Datasheet

LM75B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2015. All rights reserved.
Product data sheet Rev. 6.1 — 6 February 2015 24 of 37
NXP Semiconductors
LM75B
Digital temperature sensor and thermal watchdog
Fig 22. Package outline SOT505-1 (TSSOP8)
UNIT
A
1
A
max.
A
2
A
3
b
p
LH
E
L
p
wyv
ceD
(1)
E
(2)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.70
0.35
6°
0°
0.1 0.10.10.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.4
SOT505-1
99-04-09
03-02-18
w M
b
p
D
Z
e
0.25
14
8
5
θ
A
A
2
A
1
L
p
(A
3
)
detail X
L
H
E
E
c
v M
A
X
A
y
2.5 5 mm0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
1.1
pin 1 index