Datasheet

LM75B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2015. All rights reserved.
Product data sheet Rev. 6.1 — 6 February 2015 30 of 37
NXP Semiconductors
LM75B
Digital temperature sensor and thermal watchdog
15. Soldering: PCB footprints
Fig 26. PCB footprint for SOT96-1 (SO8); reflow soldering
Fig 27. PCB footprint for SOT96-1 (SO8); wave soldering
sot096-1_fr
occupied area
solder lands
Dimensions in mm
placement accuracy ± 0.25
1.30
0.60 (8×)
1.27 (6×)
4.00 6.60
5.50
7.00
sot096-1_fw
solder resist
occupied area
solder lands
Dimensions in mm
board direction
placement accurracy ± 0.25
4.00
5.50
1.30
0.3 (2×)
0.60 (6×)
1.20 (2×)
1.27 (6×)
7.00
6.60
enlarged solder land