Datasheet
UM10398 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
User manual Rev. 12.3 — 10 June 2014 8 of 547
NXP Semiconductors
UM10398
Chapter 1: LPC111x/LPC11Cxx Introductory information
1.3 Ordering information
Table 2. Ordering information
Type number Package
Name Description Version
SO20, TSSOP20, TSSOP28, and DIP28 packages
LPC1110FD20 SO20 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
LPC1111FDH20/002 TSSOP20 TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SOT360-1
LPC1112FD20/102 SO20 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
LPC1112FDH20/102 TSSOP20 TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SOT360-1
LPC1112FDH28/102 TSSOP28 TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
SOT361-1
LPC1114FDH28/102 TSSOP28 TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
SOT361-1
LPC1114FN28/102 DIP28 DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1
HVQFN24/33, LQFP48, and TFBGA48 packages
LPC1111FHN33/101 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1111FHN33/102 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1111FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1111FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1111FHN33/103 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1111JHN33/103 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1111FHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1111JHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1112FHN33/101 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1112FHN33/102 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
L
PC1
112FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1112FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
LPC1112FHN24/202 HVQFN24 HVQFN24: plastic thermal enhanced very thin quad flat package; no
leads; 24 terminals; body 4 x 4 x 0.85 mm
SOT616-3
LPC1112FHI33/102 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5 5 0.85 mm
n/a
LPC1112FHI33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5 5 0.85 mm
n/a