Datasheet

UM10398 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
User manual Rev. 12.3 — 10 June 2014 9 of 547
NXP Semiconductors
UM10398
Chapter 1: LPC111x/LPC11Cxx Introductory information
LPC1112FHI33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
n/a
LPC1112JHI33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
n/a
LPC1112FHN33/103 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1112JHN33/103 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1112JHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1112FHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113JHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/301 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/302 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1113FHN33/303 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.
85 mm
n/a
LP
C1113JHN33/303 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1114FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1114FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1114FHN33/301 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1114FHN33/302 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1114FHI33/302 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
n/a
LPC1114FHI33/303 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
n/a
LPC1114JHI33/303 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
n/a
LPC1114FHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
LPC1114JHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
n/a
Table 2. Ordering information
…continued
Type number Package
Name Description Version