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ManualsBrandsNXP SEMICONDUCTORS ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller LQFP 44 (10x10) 8-Bit 40 MHz I/O number 38

824D-02

MC9S08AC128

840B-01

917A-03

Freescale Semiconductor

Data Sheet: Technical Data

Document Number: MC9S08AC128

Rev. 4, 8/2011

This document contains information on a new product. Specifications and information herein

are subject to change without notice.

MC9S08AC128 8-Bit

Microcontroller Data Sheet

8-Bit HCS08 Central Processor Unit (CPU)

• 40-MHz HCS08 CPU (central processor unit)

• 20-MHz internal bus frequency

• HC08 instruction set with added BGND, CALL and

RTC instructions

• Memory Management Unit to support paged

memory.

• Linear Address Pointer to allow direct page data

accesses of the entire memory map

Development Support

• Background debugging system

• Breakpoint capability to allow single breakpoint

setting during in-circuit debugging (plus two more

breakpoints in on-chip debug module)

• On-chip in-circuit emulator (ICE) Debug module

containing three comparators and nine trigger

modes. Eight deep FIFO for storing change-of-flow

addresses and event-only data. Supports both tag

and force breakpoints.

Memory Options

• Up to 128K FLASH — read/program/erase over full

operating voltage and temperature

• Up to 8K Random-access memory (RAM)

• Security circuitry to prevent unauthorized access to

RAM and FLASH contents

Clock Source Options

• Clock source options include crystal, resonator,

external clock, or internally generated clock with

precision NVM trimming using ICG module

System Protection

• Optional computer operating properly (COP) reset

with option to run from independent internal clock

source or bus clock

• CRC module to support fast cyclic redundancy

checks on system memory

• Low-voltage detection with reset or interrupt

• Illegal opcode detection with reset

• Master reset pin and power-on reset (POR)

Power-Saving Modes

• Wait plus two stops

Peripherals

• ADC — 16-channel, 10-bit resolution, 2.5 s

conversion time, automatic compare function,

temperature sensor, internal bandgap reference

channel

• SCIx — Two serial communications interface

modules supporting LIN 2.0 Protocol and SAE J2602

protocols; Full duplex non-return to zero (NRZ);

Master extended break generation; Slave extended

break detection; Wakeup on active edge

• SPIx — One full and one master-only serial

peripheral interface modules; Full-duplex or

single-wire bidirectional; Double-buffered transmit

and receive; Master or Slave mode; MSB-first or

LSB-first shifting

• IIC — Inter-integrated circuit bus module; Up to 100

kbps with maximum bus loading; Multi-master

operation; Programmable slave address; Interrupt

driven byte-by-byte data transfer; supports broadcast

mode and 10 bit addressing

• TPMx — One 2-channel and two 6-channel 16-bit

timer/pulse-width modulator (TPM) modules:

Selectable input capture, output compare, and

edge-aligned PWM capability on each channel. Each

timer module may be configured for buffered,

centered PWM (CPWM) on all channels

• KBI — 8-pin keyboard interrupt module

Input/Output

• Up to 70 general-purpose input/output pins

• Software selectable pullups on input port pins

• Software selectable drive strength and slew rate

control on ports when used as outputs

Package Options

• 80-pin low-profile quad flat package (LQFP)

• 64-pin quad flat package (QFP)

• 48-pin quad flat no-lead package (QFN)

• 44-pin low-profile quad flat package (LQFP)

Summary of content (40 pages)

PAGE 1
Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9S08AC128 Rev. 4, 8/2011 MC9S08AC128 8-Bit Microcontroller Data Sheet MC9S08AC128 8-Bit HCS08 Central Processor Unit (CPU) • 40-MHz HCS08 CPU (central processor unit) • 20-MHz internal bus frequency • HC08 instruction set with added BGND, CALL and RTC instructions • Memory Management Unit to support paged memory.
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Table of Contents Chapter 1 Device Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 1.1 MCU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Chapter 2 Pins and Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 2.1 Device Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . .5 Chapter 3 Electrical Characteristics and Timing Specifications . . . . . . .11 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . .
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Chapter 1 Device Overview The MC9S08AC128 is a member of the low-cost, high-performance HCS08 Family of 8-bit microcontroller units (MCUs). The MC9S08AC128 uses the enhanced HCS08 core. 1.1 MCU Block Diagram The block diagram in Figure 1-1 shows the structure of the MC9S08AC128 Series MCU. MC9S08AC128 MCU Series Data Sheet, Rev.
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Chapter 1 Device Overview HCS08 CORE LVD 8-BIT KEYBOARD INTERRUPT MODULE (KBI1) VDDAD 10-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) VSSAD VREFL VREFH USERMEMORY FLASH, RAM (BYTES) (AW128 = 128K, 8K) (AW96 = 96K, 6K) VDD PORT J PTJ7 PTJ6 PTJ5 PTJ4 PTJ3 PTJ2 PTJ1 PTJ0 PTG6/EXTAL PTG5/XTAL PTG4/KBI1P4 PTG3/KBI1P3 PTG2/KBI1P2 PTG1/KBI1P1 PTG0/KBIP0 PORT H PTH4/SPSCK2 PTH3/TPM2CH5 PTH2/TPM2CH4 PTH1/TPM2CH3 PTH0/TPM2CH2 RXD1 TXD1 SERIAL COMMUNICATIONS INTERFACE MODULE (SCI2) RXD2 TXD2 6-CHANNEL TIMER/PW
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Chapter 2 Pins and Connections This section describes signals that connect to package pins. It includes pinout diagrams, recommended system connections, and detailed discussions of signals. 2.
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Chapter 2 Pins and Connections PTC2/MCLK PTC1/SDA1 PTC0/SCL1 VSS PTG6/EXTAL PTG5/XTAL BKGD/MS VREFL VREFH PTD7/AD1P15/KBI1P7 PTD6//TPM1CLK PTD5/AD1P13 PTD4/AD1P12/TPM2CLK 63 62 61 60 59 58 57 56 55 54 53 52 51 50 64 PTC4 1 PTG4/KBI1P4 PTC3/TxD2 PTC5/RxD2 Figure 2-2 shows the 64-pin package assignments for the MC9S08AC128 Series devices.
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Chapter 2 Pins and Connections PTC2/MCLK PTC1/SDA1 PTC0/SCL1 VSS PTG6/EXTAL PTG5/XTAL BKGD/MS VREFL VREFH 47 46 45 44 43 42 41 40 39 38 48 PTC4 1 PTG4/KBI1P4 PTC3/TxD2 PTC5/RxD2 Figure 2-1 shows the 48-pin package assignments for the MC9S08AC128 Series devices.
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Chapter 2 Pins and Connections VREFH VREFL BKGD/MS PTG5/XTAL PTG6/EXTAL VSS PTC0/SCL1 PTC1/SDA1 PTC2/MCLK PTC3/TxD2 PTC5/RxD2 Figure 2-3 shows the 44-pin LQFP pin assignments for the MC9S08AC128 Series device.
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Chapter 2 Pins and Connections Table 2-4.
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Chapter 2 Pins and Connections Table 2-4.
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Chapter 3 Electrical Characteristics and Timing Specifications 3.1 Introduction This section contains electrical and timing specifications. 3.2 Parameter Classification The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding the following classification is used and the parameters are tagged accordingly in the tables where appropriate: Table 3-1.
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Chapter 3 Electrical Characteristics and Timing Specifications Table 3-2. Absolute Maximum Ratings Rating Symbol Value Unit Supply voltage VDD –0.3 to + 5.8 V Input voltage VIn – 0.3 to VDD + 0.3 V Instantaneous maximum current Single pin limit (applies to all port pins)1, 2, 3 ID  25 mA Maximum current into VDD IDD 120 mA Tstg –55 to +150 C Storage temperature 1 Input must be current limited to the value specified.
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Chapter 3 Electrical Characteristics and Timing Specifications 3.4 Thermal Characteristics This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and it is user-determined rather than being controlled by the MCU design.
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Chapter 3 Electrical Characteristics and Timing Specifications Solving equations 1 and 2 for K gives: K = PD  (TA + 273C) + JA  (PD)2 Eqn. 3-3 where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations 1 and 2 iteratively for any value of TA. 3.
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Chapter 3 Electrical Characteristics and Timing Specifications Table 3-6. DC Characteristics Num C Parameter 1 — Operating Voltage 2 P Output high voltage — Low Drive (PTxDSn = 0) 5 V, ILoad = –2 mA 3 V, ILoad = –0.6 mA 5 V, ILoad = –0.4 mA 3 V, ILoad = –0.24 mA P Output high voltage — High Drive (PTxDSn = 1) 5 V, ILoad = –10 mA 3 V, ILoad = –3 mA 5 V, ILoad = –2 mA 3 V, ILoad = –0.4 mA 3 5 6 Typ1 Max Unit VDD 2.7 — 5.5 V VDD – 1.5 VDD – 1.5 VDD – 0.8 VDD – 0.
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Chapter 3 Electrical Characteristics and Timing Specifications Table 3-6. DC Characteristics (continued) Num C 19 P 20 P 21 Parameter Typ1 Max Unit 4.2 4.3 4.3 4.4 4.4 4.5 V 2.48 2.54 2.56 2.62 2.64 2.7 V Vhys — — 100 60 — — mV VBG 1.170 1.200 1.
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Chapter 3 Electrical Characteristics and Timing Specifications –20.0E-3 VDD–VOH (V) Average of IOH –18.0E-3 –16.0E-3 –14.0E-3 –12.0E-3 –10.0E-3 –8.0E-3 –6.0E-3 –4.0E-3 –2.0E-3 000.0E-3 IOH (A) –40C 25C 125C 0 0.3 0.5 0.8 VSupply–VOH 0.9 1.2 1.5 Figure 3-2. Typical IOH (High Drive) vs VDD–VOH at VDD = 3 V Average of IOH –7.0E-3 –40C 25C 125C –6.0E-3 –5.0E-3 IOH (A) –4.0E-3 –3.0E-3 –2.0E-3 –1.0E-3 000E+0 0.00 0.30 0.50 0.80 1.00 1.30 2.00 VDD–VOH (V) VSupply–VOH Figure 3-3.
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Chapter 3 Electrical Characteristics and Timing Specifications 3.7 Supply Current Characteristics Table 3-7. Supply Current Characteristics Num C Parameter 1 C Run supply current measured at (CPU clock = 2 MHz, fBus = 1 MHz) 2 C Run supply current measured at (CPU clock = 16 MHz, fBus = 8 MHz) Symbol 2 RIDD 4 RIDD Stop2 mode supply current 3 5 6 7 1 2 3 4 5 6 7 Typ1 Max 5 1.1 1.43 3 1.0 1.2 5 6.7 8.05 3 6 7.5 1.
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Chapter 3 Electrical Characteristics and Timing Specifications 18 20 MHz, ADC off, FEE, 25C 16 20 MHz, ADC off, FBE, 25C 14 12 10 IDD 8 8 MHz, ADC off, FEE, 25C 8 MHz, ADC off, FBE, 25C 6 4 1 MHz, ADC off, FEE, 25C 1 MHz, ADC off, FBE, 25C 2 0 2.2 2.6 3.0 3.4 3.8 4.2 4.6 5.0 5.4 VDD Note: External clock is square wave supplied by function generator. For FEE mode, external reference frequency is 4 MHz Figure 3-5. Typical Run IDD for FBE and FEE Modes, IDD vs.
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Chapter 3 Electrical Characteristics and Timing Specifications –40C 25C 55C 85C Stop2 IDD (A) –8.0E-3 Average of Measurement IDD –7.0E-3 –6.0E-3 IDD (A) –5.0E-3 –4.0E-3 –3.0E-3 –2.0E-3 –1.0E-3 000E+0 1.8 2 2.5 3 3.5 4 4.5 5 VDD (V) Figure 3-6. Typical Stop 2 IDD –40C 25C 55C 85C Stop3 IDD (A) –8.0E-3 Average of Measurement IDD –7.0E-3 –6.0E-3 IDD (A) –5.0E-3 –4.0E-3 –3.0E-3 –2.0E-3 –1.0E-3 000E+0 1.8 2 2.5 3 3.5 4 4.5 5 VDD (V) Figure 3-7.
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Chapter 3 Electrical Characteristics and Timing Specifications 3.8 ADC Characteristics Table 3-8. 5 Volt 10-bit ADC Operating Conditions Symb Min Typ1 Max Unit Absolute VDDAD 2.7 — 5.5 V Delta to VDD (VDD–VDDAD)2 VDDAD –100 0 +100 mV Delta to VSS (VSS–VSSAD)2 VSSAD –100 0 +100 mV Ref voltage high VREFH 2.7 VDDAD VDDAD V Ref voltage low VREFL VSSAD VSSAD VSSAD V IDDAD — 0.011 1 A Input voltage VADIN VREFL — VREFH V Input capacitance CADIN — 4.5 5.
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Chapter 3 Electrical Characteristics and Timing Specifications SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT ZADIN Pad leakage due to input protection ZAS RAS SIMPLIFIED CHANNEL SELECT CIRCUIT RADIN ADC SAR ENGINE + VADIN VAS + – CAS – RADIN INPUT PIN INPUT PIN RADIN RADIN INPUT PIN CADIN Figure 3-8. ADC Input Impedance Equivalency Diagram MC9S08AC128 Series Data Sheet, Rev.
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Chapter 3 Electrical Characteristics and Timing Specifications Table 3-9. 5 Volt 10-bit ADC Characteristics (VREFH = VDDAD, VREFL = VSSAD) C Symb Min Typ1 Max Unit Supply current ADLPC = 1 ADLSMP = 1 ADCO = 1 T IDDAD — 133 — A Supply current ADLPC = 1 ADLSMP = 0 ADCO = 1 T IDDAD — 218 — A Supply current ADLPC = 0 ADLSMP = 1 ADCO = 1 T IDDAD — 327 — A Supply current ADLPC = 0 ADLSMP = 0 ADCO = 1 T IDDAD — 582 — A — — 1 mA 2 3.3 5 MHz 1.25 2 3.
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Chapter 3 Electrical Characteristics and Timing Specifications Table 3-9. 5 Volt 10-bit ADC Characteristics (VREFH = VDDAD, VREFL = VSSAD) Characteristic Conditions 10-bit mode Input leakage error Pad leakage3 * RAS C Symb Min Typ1 Max Unit D EIL — 0.2 2.5 LSB2 — 0.1 1 8-bit mode 1 Typical values assume VDDAD = 5.0V, Temp = 25C, fADCK=1.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production.
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Chapter 3 Electrical Characteristics and Timing Specifications 3.9.1 ICG Frequency Specifications Table 3-11.
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Chapter 3 Electrical Characteristics and Timing Specifications 3 4 5 6 7 8 9 Loss of reference frequency is the reference frequency detected internally, which transitions the ICG into self-clocked mode if it is not in the desired range. Loss of DCO frequency is the DCO frequency detected internally, which transitions the ICG into FLL bypassed external mode (if an external reference exists) if it is not in the desired range. This parameter is characterized before qualification rather than 100% tested.
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Chapter 3 Electrical Characteristics and Timing Specifications 3.10 AC Characteristics This section describes ac timing characteristics for each peripheral system. 3.10.1 Control Timing Table 3-12. Control Timing Num C Parameter Symbol Min Typ1 Max Unit — 20 MHz 1 Bus frequency (tcyc = 1/fBus) fBus dc 2 Real-time interrupt internal oscillator period tRTI 600 1500 s  External reset pulse width2 (tcyc = 1/fSelf_reset) textrst 1.
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Chapter 3 Electrical Characteristics and Timing Specifications BKGD/MS RESET tMSH tMSSU Figure 3-11. Active Background Debug Mode Latch Timing tIHIL IRQ/KBIP7-KBIP4 IRQ/KBIPx tILIH Figure 3-12. IRQ/KBIPx Timing 3.10.2 Timer/PWM (TPM) Module Timing Synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that can be used as the optional external source to the timer counter. These synchronizers operate from the current bus rate clock. Table 3-13.
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Chapter 3 Electrical Characteristics and Timing Specifications tTPMext tclkh TPMxCLK tclkl Figure 3-13. Timer External Clock tICPW TPMxCHn TPMxCHn tICPW Figure 3-14. Timer Input Capture Pulse MC9S08AC128 MCU Series Data Sheet, Rev.
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Chapter 3 Electrical Characteristics and Timing Specifications 3.11 SPI Characteristics Table 3-14 and Figure 3-15 through Figure 3-18 describe the timing requirements for the SPI system. Table 3-14.
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Chapter 3 Electrical Characteristics and Timing Specifications SS1 (OUTPUT) 3 1 2 SCK (CPOL = 0) (OUTPUT) 5 4 SCK (CPOL = 1) (OUTPUT) 5 4 6 MISO (INPUT) 7 MSB IN2 BIT 6 . . . 1 10 MOSI (OUTPUT) LSB IN 11 10 MSB OUT2 BIT 6 . . . 1 LSB OUT NOTES: 1. SS output mode (MODFEN = 1, SSOE = 1). 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure 3-15.
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Chapter 3 Electrical Characteristics and Timing Specifications SS (INPUT) 3 1 SCK (CPOL = 0) (INPUT) 5 4 2 SCK (CPOL = 1) (INPUT) 5 4 8 MISO (OUTPUT) 11 10 BIT 6 . . . 1 MSB OUT SLAVE SEE NOTE SLAVE LSB OUT 7 6 MOSI (INPUT) 9 BIT 6 . . . 1 MSB IN LSB IN NOTE: 1. Not defined but normally MSB of character just received Figure 3-17.
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Chapter 3 Electrical Characteristics and Timing Specifications 3.12 FLASH Specifications This section provides details about program/erase times and program-erase endurance for the Flash memory. Program and erase operations do not require any special power sources other than the normal VDD supply. Table 3-15. Flash Characteristics Num C 1 P 2 Characteristic Symbol Min Supply voltage for program/erase Vprog/erase P Supply voltage for read operation  P 4 Typ1 Max Unit 2.7 5.
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Chapter 3 Electrical Characteristics and Timing Specifications 3.13 EMC Performance Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the MCU resides. Board design and layout, circuit topology choices, location and characteristics of external components as well as MCU software operation all play a significant role in EMC performance.
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Chapter 4 Ordering Information and Mechanical Drawings 4.1 Ordering Information This section contains ordering numbers for MC9S08AC128 Series devices. See below for an example of the device numbering system. Table 4-1. Device Numbering System Available Packages1 Memory Device Number FLASH 1 4.2 RAM Type MC9S08AC128 128K 8K 80 LQFP, 64 QFP, 48-QFN, 44-LQFP MC9S08AC96 96K 6K 80 LQFP, 64 QFP, 48-QFN, 44-LQFP See Table 4-2 for package information.
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Chapter 4 Ordering Information and Mechanical Drawings MC9S08AC128 Series Data Sheet, Rev.
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Chapter 5 Revision History To provide the most up-to-date information, the version of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information available, refer to: http://freescale.com/ The following revision history table summarizes changes contained in this document. Revision Number Revision Date Description of Changes 1 9/2008 Initial release of a separate data sheet and reference manual.
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MC9S08AC128 MCU Series Data Sheet, Rev.
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How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.