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Freescale Semiconductor

MC9S08LL64

Rev. 7.1, 08/2012

This is the MC9S08LL64 Series Data Sheet set consisting of the following files:

• MC9S08LL64 Data Sheet Addendum, Rev 1

• MC9S08LL64 Series Data Sheet, Rev 7

MC9S08LL64 Series Data Sheet

by: Automotive and Industrial Solutions Group

Summary of content (47 pages)

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Freescale Semiconductor MC9S08LL64 Rev. 7.1, 08/2012 MC9S08LL64 Series Data Sheet by: Automotive and Industrial Solutions Group This is the MC9S08LL64 Series Data Sheet set consisting of the following files: • MC9S08LL64 Data Sheet Addendum, Rev 1 • MC9S08LL64 Series Data Sheet, Rev 7 © Freescale Semiconductor, Inc., 2012. All rights reserved.
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Freescale Semiconductor Data Sheet Addendum MC9S08LL64AD Rev. 1, 08/2012 MC9S08LL64 Data Sheet Addendum by: Automotive and Industrial Solutions Group This document describes corrections to the MC9S08LL64 Series Data Sheet, order number MC9S08LL64. For convenience, the addenda items are grouped by revision. Please check our website at http://www.freescale.com for the latest updates. The current available version of the MC9S08LL64 Series Data Sheet is Revision 7. © Freescale Semiconductor, Inc., 2012.
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Addendum for Revision 7 1 Addendum for Revision 7 Table 1. MC9S08LL64 Data Sheet Rev 7 Addendum Location Description Section 3.7, “Supply Current In the table, for numbers 3 and 4, change “LPS” to “LPR”. Characteristics”/Table 9/Page 23 Section 3.12, “ADC Characteristics”/Page 33 Add the following data of the ADC conversion clock frequency: Characteris tic ADC Conversion Clock Frequency 2 Conditions Symb Min Typ Max Unit ADLPC=0, ADHSC=1 fADCK 1.0 — 8 MHz ADLPC=0, ADHSC=0 1.
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How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.
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Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9S08LL64 Rev. 7, 4/2012 An Energy Efficient Solution by Freescale MC9S08LL64 Series Covers: MC9S08LL64 and MC9S08LL36 • 8-Bit HCS08 Central Processor Unit (CPU) – Up to 40 MHz CPU at 3.6 V to 2.1 V across temperature range of –40 °C to 85 °C – Up to 20 MHz at 2.1 V to 1.
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Contents 1 2 3 Devices in the MC9S08LL64 Series. . . . . . . . . . . . . . . . . . . . . 3 Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.2 Parameter Classification. . . . . . . . . . . . . . . . . . . . . . . . . 9 3.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . .
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1 Devices in the MC9S08LL64 Series Table 1 summarizes the feature set available in the MC9S08LL64 series of MCUs. Table 1.
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HCS08 CORE ON-CHIP ICE DEBUG MODULE (DBG) INT BKGD PTA7/KBIP7/ADP11/ACMP– PTA6/KBIP6/ADP10/ACMP+ PORT A CPU TIME OF DAY MODULE (TOD) BKP PTA5/KBIP5/ADP9/LCD42 PTA4/KBIP4/ADP8/LCD43 PTA3/KBIP3/SCL/MOSI/ADP7 PTA2/KBIP2/SDA/MISO/ADP6 HCS08 SYSTEM CONTROL SERIAL PERIPHERAL INTERFACE (SPI) IRQ IIC MODULE (IIC) USER FLASH A (LL64 = 32,768 BYTES) (LL36 = 24,576 BYTES) 2-CHANNEL TIMER/PWM (TPM2) 2-CHANNEL TIMER/PWM USER RAM SERIAL COMMUNICATIONS INTERFACE (SCI1) 4 KB VREFO1 VREFO2 TxD1 RxD1 ANAL
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2 Pin Assignments 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 64-Pin LQFP 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 LCD38 LCD39 LCD40 LCD41 PTA5/KBIP5/ADP9/LCD42 PTA4/KBIP4/ADP8/LCD43 PTA3/KBIP3/SCL/MOSI/ADP7 PTA2/KBIP2/SDA/MISO/ADP6 PTA1/KBIP1/SPSCK/ADP5 PTA0/KBIP0/SS/ADP4 PTC7/IRQ/TCLK PTC6/ACMPO/BKGD/MS PTC5/TPM2CH1 PTC4/TPM2CH0 PTC3/TPM1CH1 PTC2/TPM1CH0 PTA6/KBIP6/ADP10/ACMP+ PTA7/KBIP7/ADP11/ACMP– VSSA/VREFL VDDA/VREFH PTB0/EXTAL PTB1/XTAL VDD VSS PTB2/RESET VREFO2 PTB4/MISO/SDA PTB5/MOSI/SCL PT
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PTE1/LCD14 PTE2/LCD15 PTE3/LCD16 PTE4/LCD17 PTE5/LCD18 PTE6/LCD19 PTE7/LCD20 LCD21 LCD22 LCD23 LCD24 LCD25 LCD26 LCD27 LCD28 LCD29 LCD30 LCD31 LCD32 LCD33 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 LCD34 LCD35 LCD36 LCD37 LCD38 LCD39 LCD40 LCD41 PTA5/KBIP5/ADP9/LCD42 PTA4/KBIP4/ADP8/LCD43 PTA3/KBIP3/SCL/MOSI/ADP7 PTA2/KBIP2/SDA/MISO/ADP6 PTA1/KBIP1/SPSCK/ADP5 PTA0/KBIP0/SS/ADP4
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Table 2.
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Table 2.
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Introduction 3 Electrical Characteristics 3.1 Introduction This section contains electrical and timing specifications for the MC9S08LL64 series of microcontrollers available at the time of publication. 3.2 Parameter Classification The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding, the following classification is used and the parameters are tagged accordingly in the tables where appropriate: Table 3.
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Thermal Characteristics Table 4. Absolute Maximum Ratings Rating Symbol Value Unit Supply voltage VDD –0.3 to +3.8 V Maximum current into VDD IDD 120 mA Digital input voltage VIn –0.3 to VDD + 0.3 V Instantaneous maximum current Single pin limit (applies to all port pins)1, 2, 3 ID ± 25 mA Tstg –55 to 150 °C Storage temperature range 1 Input must be current limited to the value specified.
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ESD Protection and Latch-Up Immunity TJ = TA + (PD × θJA) Eqn. 1 where: TA = Ambient temperature, °C θJA = Package thermal resistance, junction-to-ambient, °C/W PD = Pint + PI/O Pint = IDD × VDD, Watts — chip internal power PI/O = Power dissipation on input and output pins — user determined For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected) is: PD = K ÷ (TJ + 273°C) Eqn.
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DC Characteristics Table 6. ESD and Latch-up Test Conditions (continued) Model Description Symbol Value Unit Minimum input voltage limit –2.5 V Maximum input voltage limit 7.5 V Latch-up Table 7. ESD and Latch-Up Protection Characteristics Rating1 No. 1 3.
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DC Characteristics Table 8.
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DC Characteristics Table 8. DC Characteristics (continued) Num C 1 2 3 4 5 6 7 8 Characteristic Min Typ1 Max Unit 2.08 2.14 2.2 V Vhys — 80 — mV VBG 1.15 1.17 1.18 V Symbol 22 P Low-voltage warning threshold VLVW 23 P 24 P Bandgap Voltage Reference8 Low-voltage inhibit reset/recover hysteresis Condition VDD falling VDD rising Typical values are measured at 25°C. Characterized, not tested All I/O pins except for LCD pins in Open Drain mode.
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DC Characteristics Figure 5. Typical Low-Side Driver (Sink) Characteristics (Non LCD Pins) — Low Drive (PTxDSn = 0) MC9S08LL64 Series MCU Data Sheet, Rev.
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DC Characteristics Figure 6. Typical Low-Side Driver (Sink) Characteristics(Non LCD Pins) — High Drive (PTxDSn = 1) MC9S08LL64 Series MCU Data Sheet, Rev.
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DC Characteristics Figure 7. Typical High-Side (Source) Characteristics (Non LCD Pins)— Low Drive (PTxDSn = 0) MC9S08LL64 Series MCU Data Sheet, Rev.
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DC Characteristics Figure 8. Typical High-Side (Source) Characteristics(Non LCD Pins) — High Drive (PTxDSn = 1) MC9S08LL64 Series MCU Data Sheet, Rev.
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DC Characteristics Figure 9. Typical Low-Side Driver (Sink) Characteristics (LCD/GPIO Pins)— Low Drive (PTxDSn = 0) MC9S08LL64 Series MCU Data Sheet, Rev.
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DC Characteristics Figure 10. Typical Low-Side Driver (Sink) Characteristics (LCD/GPIO Pins) — High Drive (PTxDSn = 1) MC9S08LL64 Series MCU Data Sheet, Rev.
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DC Characteristics Figure 11. Typical High-Side (Source) Characteristics (LCD/GPIO Pins)— Low Drive (PTxDSn = 0) MC9S08LL64 Series MCU Data Sheet, Rev.
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DC Characteristics Figure 12. Typical High-Side (Source) Characteristics (LCD/GPIO Pins) — High Drive (PTxDSn = 1) MC9S08LL64 Series MCU Data Sheet, Rev.
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Supply Current Characteristics 3.7 Supply Current Characteristics This section includes information about power supply current in various operating modes. Table 9. Supply Current Characteristics Num C Parameter T 1 T Bus Freq Max 13.75 17.9 7 — 1 MHz 2 — 20 MHz 8.9 — 5.5 — 1 MHz 0.
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Supply Current Characteristics Table 10.
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External Oscillator (XOSCVLP) Characteristics 3.8 External Oscillator (XOSCVLP) Characteristics Reference Figure 14 and Figure 15 for crystal or resonator circuits. Table 11.
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Internal Clock Source (ICS) Characteristics XOSCVLP EXTAL XTAL RS RF Crystal or Resonator C1 C2 Figure 14. Typical Crystal or Resonator Circuit: High Range and Low Range/High Gain XOSCVLP EXTAL XTAL Crystal or Resonator Figure 15. Typical Crystal or Resonator Circuit: Low Range/Low Power 3.9 Internal Clock Source (ICS) Characteristics Table 12.
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Internal Clock Source (ICS) Characteristics Table 12. ICS Frequency Specifications (Temperature Range = –40 to 85°C Ambient) (continued) Symbol Min Typ1 Max Unit Total deviation of trimmed DCO output frequency over voltage and temperature Δfdco_t — + 0.5 –1.0 ±2 %fdco Total deviation of trimmed DCO output frequency over fixed voltage and temperature range of 0 °C to 70 °C Δfdco_t — ± 0.5 ±1 %fdco tAcquire — — 1 ms CJitter — 0.02 0.
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AC Characteristics 3.10 AC Characteristics This section describes timing characteristics for each peripheral system. 3.10.1 Control Timing Table 13. Control Timing Symbol Min Typ1 Max Unit Bus frequency (tcyc = 1/fBus) VDD ≤ 2.1V VDD > 2.
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AC Characteristics textrst RESET PIN Figure 17. Reset Timing tIHIL IRQ/KBIPx IRQ/KBIPx tILIH Figure 18. IRQ/KBIPx Timing 3.10.2 TPM Module Timing Synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that can be used as the optional external source to the timer counter. These synchronizers operate from the current bus rate clock. Table 14. TPM Input Timing No.
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AC Characteristics tICPW TPMCHn TPMCHn tICPW Figure 20. Timer Input Capture Pulse 3.10.3 SPI Timing Table 15 and Figure 21 through Figure 24 describe the timing requirements for the SPI system. Table 15. SPI Timing No.
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AC Characteristics Table 15. SPI Timing (continued) No. C Function Symbol Min Max Unit 10 D Data hold time (outputs) Master Slave tHO 0 0 — — ns ns 11 D Rise time Input Output tRI tRO — — tcyc – 25 25 ns ns 12 D Fall time Input Output tFI tFO — — tcyc – 25 25 ns ns SS1 (OUTPUT) 1 2 SPSCK (CPOL = 0) (OUTPUT) 11 4 4 12 SPSCK (CPOL = 1) (OUTPUT) 5 MISO (INPUT) 6 MS BIN2 BIT 6 . . . 1 9 MOSI (OUTPUT) 3 LSB IN 9 MSB OUT2 BIT 6 . . . 1 10 LSB OUT NOTES: 1.
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AC Characteristics SS1 (OUTPUT) 1 2 12 11 11 12 3 SPSCK (CPOL = 0) (OUTPUT) 4 SPSCK (CPOL = 1) (OUTPUT) 4 5 MISO (INPUT) 6 MSB IN2 BIT 6 . . . 1 9 LSB IN 10 MOSI (OUTPUT) PORT DATA BIT 6 . . . 1 MASTER MSB OUT2 MASTER LSB OUT PORT DATA NOTES: 1. SS output mode (DDS7 = 1, SSOE = 1). 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure 22.
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Analog Comparator (ACMP) Electricals SS (INPUT) 1 3 2 SPSCK (CPOL = 0) (INPUT) 4 SPSCK (CPOL = 1) (INPUT) 12 11 11 12 4 9 MISO (OUTPUT) SEE NOTE 1 10 SLAVE MSB OUT ‘c 7 MOSI (INPUT) c BIT 6 . . . 1 SLAVE LSB OUT 6 MSB IN BIT 6 . . . 1 LSB IN NOTE: 1. Not defined but normally LSB of character just received Figure 24. SPI Slave Timing (CPHA = 1) 3.11 Analog Comparator (ACMP) Electricals Table 16.
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ADC Characteristics Table 17. 12-Bit ADC Operating Conditions (continued) No. Characteristic Conditions Symb Min Typ1 Max Unit 2 Ground voltage Delta to VSS (VSS – VSSA)2 ΔVSSA –100 0 100 mV 3 Reference voltage high — VREFH 1.8 VDDA VDDA V 4 Reference voltage low — VREFL VSSA VSSA VSSA V 5 Input voltage — VADIN VREFL — VREFH V 6 Input capacitance 8/10/12-bit modes CADIN — 4 5 pF 7 Input resistance — RADIN — 5 7 kΩ Typical values assume VDDA = 3.
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ADC Characteristics Table 18. 12-Bit ADC Characteristics (VREFH = VDDA, VREFL = VSSA) C Symb Min Typ1 Max Unit Supply current ADLPC = 1 ADHSC = 0 ADLSMP = 0 ADCO = 1 T IDDA — 200 — μA Supply current ADLPC = 1 ADHSC = 1 ADLSMP = 0 ADCO = 1 T IDDA — 280 — μA Supply current ADLPC = 0 ADHSC = 0 ADLSMP = 0 ADCO = 1 T IDDA — 370 — μA 4 Supply current ADLPC = 0 ADHSC = 1 ADLSMP = 0 ADCO = 1 T IDDA — 0.61 — mA 5 Supply current Stop, reset, module off IDDA — 0.01 0.
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ADC Characteristics Table 18.
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ADC Characteristics Table 18. 12-Bit ADC Characteristics (VREFH = VDDA, VREFL = VSSA) (continued) # 12 13 14 Characteristic Integral non-linearity Zero-scale error Full-scale error Conditions C Symb 15 16 Input leakage error 18 Temp sensor slope Temp sensor voltage Max — –1.5 to 2.25 ±2.75 — ±0.5 ±1.0 T 10-bit mode T 8-bit mode T — ±0.3 ±0.5 12-bit mode T — ±1 –1.25 to 1 10-bit mode T — ±0.5 ±1 8-bit mode T — ±0.5 ±0.5 12-bit mode T — ±1.0 –3.5 to 2.
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VREF Specifications 3.13 VREF Specifications Table 19. VREF Electrical Specifications Num Characteristic Symbol Typical Min Max Unit 1 Supply voltage VDD — 1.80 3.60 V 2 Operating temperature range Top — –40 105 °C 3 Maximum load — — — 10 mA — — V Operation across Temperature 4 V Room Temp V Room Temp 1.
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LCD Specifications 3.14 LCD Specifications Table 20. LCD Electricals, 3-V Glass No. Characteristic Symbol Min Typ Max Unit 1 D LCD supply voltage VLCD .9 1.5 1.8 V 2 D LCD frame frequency fFrame 28 30 58 Hz CLCD — 100 100 nF CBYLCD — 100 100 nF Cglass — 2000 8000 pF VIREG .89 1.00 1.15 1.49 1.67 1.851 ΔRTRIM 1.5 — — HRefSel = 0 — — — .1 HRefSel = 1 — — — .
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EMC Performance Table 21. Flash Characteristics (continued) No. C 10 D Characteristic Page erase current3 4 11 C Program/erase endurance TL to TH = –40°C to 85°C T = 25°C 12 C Data retention5 Symbol Min Typical Max Unit RIDDPE — 6 — mA 10,000 — 100,000 — — cycles 15 100 — years — tD_ret 1 The frequency of this clock is controlled by a software setting. These values are hardware state machine controlled. User code does not need to count cycles.
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Device Numbering System Table 22. Device Numbering System Memory Device Number1 MC9S08LL64 MC9S08LL36 1 2 4.1 Available Packages2 Flash RAM 64 KB 4000 80 LQFP 64 KB 4000 64 LQFP 36 KB 4000 80 LQFP 36 KB 4000 64 LQFP See Table 1 for a complete description of modules included on each device. See Table 23 for package information.
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Mechanical Drawings MC9S08LL64 Series MCU Data Sheet, Rev.
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How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.