Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor 0 kPa up to 10 kPa Print

MPX2010

Rev 13, 10/2008

Freescale Semiconductor

Pressure

10 kPa On-Chip Temperature

Compensated and Calibrated

Silicon Pressure Sensors

The MPX2010 series silicon piezoresistive pressure sensors provide a very

accurate and linear voltage output directly proportional to the applied pressure.

These sensors house a single monolithic silicon die with the strain gauge and

thin film resistor network integrated. The sensor is laser trimmed for precise

span, offset calibration and temperature compensation.

Features

• Temperature Compensated over 0°C to +85°C

• Ratiometric to Supply Voltage

• Differential and Gauge Options

• Available in Easy-to-Use Tape & Reel

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device Marking

None Single Dual Gauge Differential Absolute

Small Outline Package (MPXV2010 Series)

MPXV2010GP

Tray 1369

• • MPXV2010GP

MPXV2010DP

Tray 1351

• • MPXV2010DP

Unibody Package (MPX2010 Series)

MPX2010D

Tray 344

• • MPX2010D

MPX2010DP

Tray 344C

• • MPX2010DP

MPX2010GP

Tray 344B

• • MPX2010GP

MPX2010GS

Tray 344E

• • MPX2010D

MPX2010GSX

Tray 344F

• • MPX2010D

MPAK Package (MPXM2010 Series)

MPXM2010D

Rail 1320

• • MPXM2010D

MPXM2010DT1

Tape and Reel 1320

• • MPXM2010D

MPXM2010GS

Rail 1320A

• • MPXM2010GS

MPXM2010GST1

Tape and Reel 1320A

• • MPXM2010GS

MPX2010

Series

0 to 10 kPa (0 to 1.45 psi)

25 mV Full Scale

(Typical)

Application Examples

• Respiratory Diagnostics

• Air Movement Control

• Controllers

• Pressure Switching

UNIBODY PACKAGES

SMALL OUTLINE PACKAGES

MPXV2010GP

CASE 1369-01

MPXV2010DP

CASE 1351-01

MPX2010D

CASE 344-15

MPX2010GP

CASE 344B-01

MPX2010DP

CASE 344C-01

MPX2010GS

CASE 344E-01

MPX2010GSX

CASE 344F-01

MPXM2010D/DT1

CASE 1320-02

MPXM2010GS/GST1

CASE 1320A-02

MPAK PACKAGES

Summary of content (17 pages)

PAGE 1
Pressure Freescale Semiconductor + MPX2010 Rev 13, 10/2008 10 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors MPX2010 Series 0 to 10 kPa (0 to 1.45 psi) 25 mV Full Scale (Typical) The MPX2010 series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output directly proportional to the applied pressure. These sensors house a single monolithic silicon die with the strain gauge and thin film resistor network integrated.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units POP 0 — 10 kPa Supply Voltage(2) VS — 10 16 VDC Supply Current IO — 6.0 — mAdc Full Scale Span(3) VFSS 24 25 26 mV Offset(4) VOFF –1.0 — 1.0 mV Sensitivity ΔV/ΔΡ — 2.5 — mV/kPa Linearity — –1.0 — 1.0 %VFSS Pressure Hysteresis (0 to 10 kPa) — — ±0.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Burst Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Value Unit PMAX 75 kPa PBURST 100 kPa TSTG –40 to +125 °C TA –40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
PAGE 4
Pressure On-Chip Temperature Compensation and Calibration Figure 2. shows the output characteristics of the MPX2010 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. This performance over temperature is achieved by having both the shear stress strain gauge and the thin-film resistor circuitry on the same silicon diaphragm.
PAGE 5
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Table 3.
PAGE 6
Pressure PACKAGE DIMENSIONS C R M 1 B 2 -A- 3 Z 4 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F Y D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3.
PAGE 7
Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- -T- 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.
PAGE 8
Pressure PACKAGE DIMENSIONS -TC A E -Q- U N V B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 -P0.25 (0.010) M T Q M 4 3 2 1 S K J F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.
PAGE 9
Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2010 Sensors Freescale Semiconductor 9
PAGE 10
Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2010 10 Sensors Freescale Semiconductor
PAGE 11
Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2010 Sensors Freescale Semiconductor 11
PAGE 12
Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2010 12 Sensors Freescale Semiconductor
PAGE 13
Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2010 Sensors Freescale Semiconductor 13
PAGE 14
Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE A MPAK MPX2010 14 Sensors Freescale Semiconductor
PAGE 15
Pressure PACKAGE DIMENSIONS PIN 4 PIN 1 CASE 1320A-02 ISSUE A MPAK MPX2010 Sensors Freescale Semiconductor 15
PAGE 16
Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE A MPAK MPX2010 16 Sensors Freescale Semiconductor
PAGE 17
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