Datasheet

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MPX2100

Rev 10, 10/2008

Freescale Semiconductor

Pressure

100 kPa On-Chip Temperature

Compensated and Calibrated

Silicon Pressure Sensors

The MPX2100 series devices silicon piezoresistive pressure sensors

providing a highly accurate and linear voltage output directly proportional to

the applied pressure. The sensor is a single, monolithic silicon diaphragm

with the strain gauge and a thin-film resistor network integrated on-chip.

The chip is laser trimmed for precise span and offset calibration an

temperature compensation.

Features

• Temperature Compensated Over 0°C to +85°C

• Available in Absolute, Differential and Gauge Configurations

• Easy to Use Chip Carrier Package Options

• Ratiometric to Supply Voltage

• ±0.25% Linearity (MPX2100D Series)

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX2100 Series)

MPX2100A

Tray 344

• •

MPX2100A

MPX2100D

Tray 344

• •

MPX2100D

MPX2100AP

Tray 344B

• •

MPX2100AP

MPX2100GP

Tray 344B

• •

MPX2100GP

MPX2100DP

Tray 344C

• •

MPX2100DP

MPX2100GVP

Tray 344D

• •

MPX2100GVP

MPX2100ASX

Tray 344F

• •

MPX2100A

MPX2100

Series

0 to 100 kPa (0 to 14.5 psi)

40 mV Full Scale Span

(Typical)

PACKAGES

MPX2100A/D

CASE 344-15

MPX2100AP/GP

CASE 344B-01

MPX2100DP

CASE 344C-01

MPX2100ASX

CASE 344F-01

MPX2100GVP

CASE 344D-01

Application Examples

• Pump/Motor Controllers

• Robotics

• Level Indicators

• Medical Diagnostics

• Pressure Switching

• Barometers

Summary of content (10 pages)

PAGE 1
Pressure Freescale Semiconductor + MPX2100 Rev 10, 10/2008 100 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors MPX2100 Series 0 to 100 kPa (0 to 14.5 psi) 40 mV Full Scale Span (Typical) The MPX2100 series devices silicon piezoresistive pressure sensors providing a highly accurate and linear voltage output directly proportional to the applied pressure.
PAGE 2
Pressure Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature Compensation and Calibration Circuitry Sensing Element 2 +VOUT 4 -V OUT 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum.
PAGE 3
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristics Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 100 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc VFSS 38.5 40 41.5 mV Voff -1.0 -2.0 — — 1.0 2.0 mV ΔV/ΔP — 0.4 — mV/kPa — — -0.25 -1.0 — — 0.25 1.0 %VFSS Pressure Hysteresis(5) (0 to 100 kPa) — — ±0.
PAGE 4
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg -40 to +125 °C Operating Temperature TA -40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Least Squares Fit Relative Voltage Output LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range.
PAGE 5
Pressure On-Chip Temperature Compensation and Calibration Figure 3 shows the output characteristics of the MPX2100 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. VS = 10 Vdc TA = 25°C P1 > P2 40 Output (mVdc) 35 30 25 20 The effects of temperature on Full-Scale Span and Offset are very small and are shown under Operating Characteristics. TYP Span Range (Typ) MAX 15 10 MIN 5 0 -5 kPa 0 PSI 25 3.62 50 7.25 75 10.
PAGE 6
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The differential or gauge sensor is designed to operate with positive differential pressure Part Number MPX2100A, MPX2100D Case Type 344 applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side.
PAGE 7
Pressure PACKAGE DIMENSIONS C R M 1 B -A- 2 Z 4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F Y D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4.
PAGE 8
Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- 0.25 (0.010) -T- M T Q S S F J G D 4 PL C 0.13 (0.005) M T S Q S S -TA E -Q- U N V B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 -P0.25 (0.010) M T Q M 4 3 2 1 S K J F INCHES MILLIMETERS MIN MAX MIN MAX 1.
PAGE 9
Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. -AU SEATING PLANE -T- L R DIM A B C D F G H J K L N P Q R S U H PORT #2 VACUUM (P2) POSITIVE PRESSURE (P1) N -Q- B 1 2 3 4 K PIN 1 S C F -P- J 0.25 (0.010) M T Q S G D 4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. 2. 3. 4. INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.
PAGE 10
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