Datasheet

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MPX53

Rev 7, 05/2009

Freescale Semiconductor

Pressure

50 kPa Uncompensated

Silicon Pressure Sensors

The MPX53 series silicon piezoresistive pressure sensors provide a very

accurate and linear voltage output, directly proportional to the applied

pressure. These standard, low cost, uncompensated sensors permit

manufacturers to design and add their own external temperature

compensating and signal conditioning networks. Compensation techniques

are simplified because of the predictability of Freescale's single element

strain gauge design.

Features

• Low Cost

• Patented Silicon Shear Stress Strain Gauge Design

• Ratiometric to Supply Voltage

• Easy to Use Chip Carrier Package Options

• 60 mV Span (Typical)

• Differential and Gauge Options

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX53 Series)

MPX53D

Tape & Reel

344 • •

MPX53D

MPX53DP

Rail 344C • •

MPX53DP

MPX53GP

Rail 344B • •

MPX53GP

Small Outline Package (MPXV53G Series)

MPXV53GC7U

Rail 482C • •

MPXV53G

MPX53

Series

0 to 50 kPa (0 to 7.25 psi)

60 mV Full Scale Span

(Typical)

UNIBODY PACKAGESSMALL OUTLINE PACKAGE

MPXV53GC7U

CASE 482C-03

MPX53GP

CASE 344B-01

MPX53DP

CASE 344C-01

MPX53D

CASE 344-15

Application Examples

• Air Movement Control

• Environmental Control Systems

• Level Indicators

• Leak Detection

• Medical Instrumentation

• Industrial Controls

• Pneumatic Control Systems

• Robotics

Summary of content (8 pages)

PAGE 1
Pressure Freescale Semiconductor MPX53 Rev 7, 05/2009 50 kPa Uncompensated Silicon Pressure Sensors MPX53 Series The MPX53 series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output, directly proportional to the applied pressure. These standard, low cost, uncompensated sensors permit manufacturers to design and add their own external temperature compensating and signal conditioning networks.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units POP 0 — 50 kPa VS — 3.0 6.0 VDC IO — 6.0 — mAdc VFSS 45 60 90 mV VOFF 0 20 35 mV ΔV/ΔΡ — 1.2 — mV/kPa Linearity — –0.6 — 0.4 %VFSS Pressure Hysteresis (0 to 50 kPa) — — ±0.1 — %VFSS Temperature Hysteresis — — ±0.5 — %VFSS Temperature Coefficient of Full Scale Span TCVFSS –0.22 — -0.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 175 kPa Burst Pressure (P1 > P2) PBurst 200 kPa Storage Temperature TSTG –40 to +125 °C TA –40 to +125 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. 3 +VS 2 +VOUT Sensor 4 -VOUT 1 GND Figure 1.
PAGE 4
Pressure Temperature Compensation Figure 2 shows the typical output characteristics of the MPX53 series over temperature. The piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure.
PAGE 5
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table.
PAGE 6
Pressure PACKAGE DIMENSIONS C R M 1 B 2 -A- Z 4 3 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F D 4 PL 0.136 (0.005) Y M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.
PAGE 7
Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- -T- 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.
PAGE 8
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.