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MPXV4006G

Rev 6, 01/2007

Freescale Semiconductor

Technical Data

Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated

and Calibrated

The MPXV4006G series piezoresistive transducer is a state-of-the-art

monolithic silicon pressure sensor designed for a wide range of applications, but

particularly those employing a microcontroller or microprocessor with A/D inputs.

This sensor combines a highly sensitive implanted strain gauge with advanced

micromachining techniques, thin-film metallization, and bipolar processing to

provide an accurate, high level analog output signal that is proportional to the

applied pressure.

Features

• Temperature Compensated over 10° to 60°C

• Ideally Suited for Microprocessor or Microcontroller-Based Systems

• Available in Gauge Surface Mount (SMT) or Through-hole (DIP)

Configurations

• Durable Thermoplastic (PPS) Package

MPXV4006G series pressure sensors are available in the basic element

package or with pressure ports. Two packing options are offered for the 482 and

482A case configurations.

ORDERING INFORMATION

Device

Type

Options

Case

No.

MPX Series Order

No.

Packing

Options

Marking

Basic

Element

Element Only 482 MPXV4006G6U Rails MPXV4006G

Element Only 482 MPXV4006G6T1 Tape & Reel MPXV4006G

Element Only 482B MPXV4006G7U Rails MPXV4006G

Ported

Element

Axial Port 482A MPXV4006GC6U Rails MPXV4006G

Axial Port 482A MPXV4006GC6T1 Tape & Reel MPXV4006G

Axial Port 482C MPXV4006GC7U Rails MPXV4006G

Side Port 1369 MPXV4006GP Trays MPXV4006G

Dual Port 1351 MPXV4006DP Trays MPXV4006G

MPXV4006G

INTEGRATED

PRESSURE SENSOR

0 to 6 kPa (0 to 0.87 psi)

0.2 to 4.7 V OUTPUT

PIN NUMBERS

(1)

1. Pins 1, 5, 6, 7, and 8 are internal device

connections. Do not connect to external

circuitry or ground. Pin 1 is noted by the

notch i n the lead.

1 N/C 5 N/C

2 V

6 N/C

3 Gnd 7 N/C

4 V

out

8 N/C

SMALL OUTLINE PACKAGE

THROUGH-HOLE

MPXV4006G7U

CASE 482B-03

MPXV4006GC7U

CASE 482C-03

SMALL OUTLINE PACKAGE

SURFACE MOUNT

MPXV4006G6U/6T1

CASE 482-01

MPXV4006GC6U/C6T1

CASE 482A-01

MPXV4006DP

CASE 1351-01

MPXV4006GP

CASE 1369-01

Summary of content (11 pages)

PAGE 1
Freescale Semiconductor Technical Data MPXV4006G Rev 6, 01/2007 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV4006G INTEGRATED PRESSURE SENSOR 0 to 6 kPa (0 to 0.87 psi) 0.2 to 4.7 V OUTPUT The MPXV4006G series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs.
PAGE 2
VS Gain Stage #2 and Ground Reference Shift Circuitry Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Vout Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Parametrics Symbol Value Units Maximum Pressure (P1 >P2) Pmax 24 kPa Storage Temperature Tstg -30° to +100° °C Operating Temperature TA -10° to +60° °C 1.
PAGE 3
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION, AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm.
PAGE 4
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Table 3.
PAGE 5
PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.
PAGE 6
PACKAGE DIMENSIONS -ANOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 5 -BG 8 1 0.25 (0.010) M T B D 8 PL S A S DETAIL X S PIN 1 IDENTIFIER N C -T- SEATING PLANE DIM A B C D G J K M N S INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.
PAGE 7
PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV4006G Sensors Freescale Semiconductor 7
PAGE 8
PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV4006G 8 Sensors Freescale Semiconductor
PAGE 9
PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT PAGE 1 OF 2 MPXV4006G Sensors Freescale Semiconductor 9
PAGE 10
PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT PAGE 2 OF 2 MPXV4006G 10 Sensors Freescale Semiconductor
PAGE 11
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.