Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor -2 kPa up to 2 kPa SMD

MPXV7002

Rev 2, 1/2009

Freescale Semiconductor

Pressure

Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MPXV7002 series piezoresistive transducers are state-of-the-art

monolithic silicon pressure sensors designed for a wide range of applications,

but particularly those employing a microcontroller or microprocessor with A/D

inputs. This transducer combines advanced micromachining techniques, thin-

film metallization, and bipolar processing to provide an accurate, high level

analog output signal that is proportional to the applied pressure.

Features

• 2.5% Typical Error over +10°C to +60°C with Auto Zero

• 6.25% Maximum Error over +10°C to +60°C without Auto Zero

• Ideally Suited for Microprocessor or Microcontroller-Based Systems

• Thermoplastic (PPS) Surface Mount Package

• Temperature Compensated over +10° to +60°C

• Patented Silicon Shear Stress Strain Gauge

• Available in Differential and Gauge Configurations

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Small Outline Package (MPXV7002 Series)

MPXV7002GC6U

Rails

482A

• •

MPXV

7002

MPXV

7002

GC6T1

Tape & Reel 482A

• •

MPXV

7002

MPXV

7002

Trays

1369

• •

MPXV

7002

MPXV

7002

Trays

1351

• •

MPXV

7002

MPXV7002

Series

-2 to 2 kPa (-0.3 to 0.3 psi)

0.5 to 4.5 V Output

SMALL OUTLINE PACKAGE

MPXV7002GC6U/C6T1

CASE 482A-01

MPXV7002DP

CASE 1351-01

MPXV7002GP

CASE 1369-01

Application Examples

• Hospital Beds

•HVAC

• Respiratory Systems

• Process Control

Summary of content (11 pages)

PAGE 1
Pressure Freescale Semiconductor + MPXV7002 Rev 2, 1/2009 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV7002 Series -2 to 2 kPa (-0.3 to 0.3 psi) 0.5 to 4.5 V Output The MPXV7002 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Pressure Range(1) Supply Voltage (2) Supply Current Symbol Min Typ Max Unit POP –2.0 — 2.0 kPa VS 4.75 5.0 5.25 Vdc Io — — 10 mAdc Pressure Offset(3) @ VS = 5.0 Volts (10 to 60°C) Voff 2.25 2.5 2.75 Vdc Full Scale Output(4) @ VS = 5.0 Volts (10 to 60°C) VFSO 4.25 4.5 4.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 75 kPa Storage Temperature Tstg –30 to +100 °C Operating Temperature TA 10 to 60 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
PAGE 4
Pressure ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482).
PAGE 5
Pressure 5.0 Transfer Function: Vout = VS × (0.2 × P(kPa)+0.5) ± 6.25% VFSS VS = 5.0 Vdc TA = 10 to 60°C Output Voltage (V) 4.0 3.0 TYPICAL MAX 2.0 MIN 1.0 0 -2 -1 0 1 2 Differential Pressure (kPa) Figure 4. Output versus Pressure Differential PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side.
PAGE 6
Pressure PACKAGE DIMENSIONS -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.
PAGE 7
Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPXV7002 Sensors Freescale Semiconductor 7
PAGE 8
Pressure PACKAGE DIMENSIONS MPXV7002 8 Sensors Freescale Semiconductor
PAGE 9
Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV7002 Sensors Freescale Semiconductor 9
PAGE 10
Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV7002 10 Sensors Freescale Semiconductor
PAGE 11
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.