Datasheet

PCF85063TP All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 11 July 2013 42 of 47
NXP Semiconductors
PCF85063TP
Tiny Real-Time Clock/calendar
21. References
[1] AN10365 — Surface mount reflow soldering description
[2] AN10366 — HVQFN application information
[3] AN11247 — Improved timekeeping accuracy with PCF85063, PCF8523 and
PCF2123 using an external temperature sensor
[4] IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[5] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[6] IPC/JEDEC J-STD-020 — Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices
[7] JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[8] JESD22-C101 — Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
[9] JESD78 — IC Latch-Up Test
[10] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[11] SNV-FA-01-02 — Marking Formats Integrated Circuits
[12] UM10204 — I
2
C-bus specification and user manual
[13] UM10301 — User Manual for NXP Real Time Clocks PCF85x3, PCA8565 and
PCF2123, PCA2125
[14] UM10569 — Store and transport requirements
[15] UM10698 — User manual for I2C-bus RTC demo board OM11059A
22. Revision history
Table 37. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCF85063TP v.3 20130711 Product data sheet - PCF85063TP v.2
Modifications:
• Corrected sales item (12NC) and delivery form description in Table 2
• Corrected packing information in Figure 28
PCF85063TP v.2 20130415 Product data sheet - PCF85063TP v.1
PCF85063TP v.1 20130122 Objective data sheet - -