Datasheet

PCF8523 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6 — 17 September 2013 2 of 78
NXP Semiconductors
PCF8523
Real-Time Clock (RTC) and calendar
4. Ordering information
4.1 Ordering options
[1] Bump hardness see Table 53.
5. Marking
Table 1. Ordering information
Type number Package
Name Description Version
PCF8523T SO8 plastic small outline package; 8 leads;
body width 3.9 mm
SOT96-1
PCF8523TK HVSON8 plastic thermal enhanced very thin small outline
package; no leads; 8 terminals;
body 4  4  0.85 mm
SOT909-1
PCF8523TS TSSOP14 plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT402-1
PCF8523U bare die 12 bumps (6-6) PCF8523U
Table 2. Ordering options
Product type
number
Sales item (12NC) Orderable part
number
IC
revision
Delivery form
PCF8523T/1 935293581118 PCF8523T/1,118 1 tape and reel, 13 inch
PCF8523TK/1 935293573118 PCF8523TK/1,118 1 tape and reel, 13 inch
PCF8523TS/1 935291196112 PCF8523TS/1,112 1 tube
935291196118 PCF8523TS/1,118 1 tape and reel, 13 inch
PCF8523U/12AA/1 935293887005 PCF8523U/12AA/1,00 1 chips with bumps
[1]
, sawn wafer on Film
Frame Carrier (FFC)
Table 3. PCF8523U wafer information
Type number Wafer thickness Wafer diameter FFC for wafer size Marking of bad die
PCF8523U/12AA/1 200 m 6 inch 8 inch wafer mapping
Table 4. Marking codes
Type number Marking code
PCF8523T/1 8523T
PCF8523TK/1 8523
PCF8523TS/1 8523TS
PCF8523U/12AA/1 PC8523-1