Datasheet

PCF8523 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6 — 17 September 2013 60 of 78
NXP Semiconductors
PCF8523
Real-Time Clock (RTC) and calendar
[1] The x/y coordinates of the alignment mark location represent the position of the REF point (see Figure 43)
with respect to the center (x/y = 0) of the chip; see Figure 42
.
[2] The x/y values of the dimensions represent the extensions of the alignment mark in direction of the
coordinate axis (see Figure 43
).
[1] Pressure of diamond head: 10 g to 50 g.
Table 51. Bump locations
All x/y coordinates represent the position of the center of each bump with respect to the center
(x/y = 0) of the chip; see Figure 42.
Symbol Bump Coordinates (m)
X Y
V
DD
1 714.4 911.7
OSCI 2 714.4 988.3
OSCO 3 714.4 707.3
V
BAT
4 714.4 199.3
V
SS
5 714.4 459.1
n.c. 6 714.4 616.7
INT2
7 714.4 895.4
CLKOUT 8 714.4 922.0
SDA 9 714.4 528.8
SCL 10 714.4 101.1
n.c. 11 714.4 607.6
INT1
/CLKOUT 12 714.4 763.2
Table 52. Alignment mark dimension and location
Coordinates X Y
Location
[1]
631.3 m 891.7 m
Dimension
[2]
44.25 m 36.5 m
Fig 43. Alignment mark
Table 53. Gold bump hardness of PCF8523U
Gold bump type Min Max Unit
[1]
soft gold bump 35 80 HV
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