Datasheet

PCF8523 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6 — 17 September 2013 62 of 78
NXP Semiconductors
PCF8523
Real-Time Clock (RTC) and calendar
18.2 Wafer and Film Frame Carrier (FFC) information
SOT402-1 (TSSOP14) of PCF8523TS
A0 pocket width in x direction 6.95 mm
B0 pocket width in y direction 5.6 mm
K0 pocket depth 1.6 mm
P1 pocket hole pitch 8.0 mm
W tape width in y direction 12.0 mm
Table 54. Carrier tape dimensions of PCF8523
…continued
Symbol Description Value Unit
(1) Die marking code.
Seal ring plus gap to active circuit ~18 m. Wafer thickness 200 m.
PCF8523U: bad die are marked in wafer mapping.
Fig 45. PCF8523U wafer information
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