Datasheet
PCF8563 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 10 — 3 April 2012 30 of 50
NXP Semiconductors
PCF8563
Real-time clock/calendar
11. Limiting values
[1] Pass level; Human Body Model (HBM), according to Ref. 5 “JESD22-A114”.
[2] Pass level; Charged-Device Model (CDM), according to Ref. 6 “
JESD22-C101”.
[3] Pass level; latch-up testing according to Ref. 7 “
JESD78” at maximum ambient temperature (T
amb(max)
).
[4] According to the NXP store and transport requirements (see Ref. 9 “
NX3-00092”) the devices have to be stored at a temperature of
+8 C to +45 C and a humidity of 25 % to 75 %. For long term storage products deviant conditions are described in that document.
Table 28. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DD
supply voltage 0.5 +6.5 V
I
DD
supply current 50 +50 mA
V
I
input voltage on pins SCL, SDA,
and OSCI
0.5 +6.5 V
V
O
output voltage on pins CLKOUT and INT 0.5 +6.5 V
I
I
input current at any input 10 +10 mA
I
O
output current at any output 10 +10 mA
P
tot
total power dissipation - 300 mW
V
ESD
electrostatic discharge voltage HBM
HVSON10 (PCF8563BS/4)
[1]
- 3500 V
DIP8 (PCF8563P/F4)
[1]
SO8 (PCF8563T/F4)
[1]
TSSOP8 (PCF8563TS/4)
[1]
SO8 (PCF8563T/5)
[1]
- 2000 V
TSSOP8 (PCF8563TS/5)
[1]
CDM
HVSON10 (PCF8563BS/4)
[2]
- 2000 V
DIP8 (PCF8563P/F4)
[2]
- 500 V
SO8 (PCF8563T/F4)
[2]
- 1000 V
SO8 (PCF8563T/5)
[2]
- 1500 V
TSSOP8 (PCF8563TS/4)
[2]
- 1500 V
TSSOP8 (PCF8563TS/5)
[2]
- 1750 V
I
lu
latch-up current
[3]
-200mA
T
stg
storage temperature
[4]
65 +150 C
T
amb
ambient temperature operating device 40 +85 C