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1. Product profile

1.1 General description

NPN Resistor-Equipped Transistor (RET) family in Surface-Mounted Device (SMD)

plastic packages.

1.2 Features and benefits

1.3 Applications

1.4 Quick reference data

PDTC143Z series

NPN resistor-equipped transistors;

R1 = 4.7 k, R2 = 47 k

Rev. 8 — 5 December 2011 Product data sheet

Table 1. Product overview

Type number Package PNP

complement

Package

configuration

NXP JEITA JEDEC

PDTC143ZE SOT416 SC-75 - PDTA143ZE ultra small

PDTC143ZM SOT883 SC-101 - PDTA143ZM leadless ultra small

PDTC143ZT SOT23 - TO-236AB PDTA143ZT small

PDTC143ZU SOT323 SC-70 - PDTA143ZU very small

 100 mA output current capability  Reduces component count

 Built-in bias resistors  Reduces pick and place costs

 Simplifies circuit design  AEC-Q101 qualified

 Digital applications in automotive and

industrial segments

 Cost-saving alternative for BC847/857

series in digital applications

 Control of IC inputs  Switching loads

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

CEO

collector-emitter voltage open base - - 50 V

output current - - 100 mA

R1 bias resistor 1 (input) 3.3 4.7 6.1 k

R2/R1 bias resistor ratio 8 10 12

Summary of content (17 pages)

PAGE 1
PDTC143Z series NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k Rev. 8 — 5 December 2011 Product data sheet 1. Product profile 1.1 General description NPN Resistor-Equipped Transistor (RET) family in Surface-Mounted Device (SMD) plastic packages. Table 1.
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 2. Pinning information Table 3. Pinning Pin Description Simplified outline Graphic symbol SOT23; SOT323; SOT416 1 input (base) 2 GND (emitter) 3 3 3 R1 output (collector) 1 R2 1 2 2 006aaa144 sym007 SOT883 1 input (base) 2 GND (emitter) 3 1 3 3 2 output (collector) R1 1 Transparent top view R2 2 sym007 3. Ordering information Table 4.
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 006aac778 300 Ptot (mW) (1) (2) 200 (3) 100 0 -75 -25 25 75 125 175 Tamb (°C) (1) SOT23; FR4 PCB, standard footprint SOT883; FR4 PCB with 70 m copper strip line, standard footprint (2) SOT323; FR4 PCB, standard footprint (3) SOT416; FR4 PCB, standard footprint Fig 1. Power derating curves 6. Thermal characteristics Table 7.
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 006aac781 103 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 0.2 102 0.1 0.05 0.02 10 0.01 0 1 10-5 10-4 10-3 10-2 10-1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for PDTC143ZE (SOT416); typical values 006aac782 103 Zth(j-a) (K/W) duty cycle = 1 0.75 0.5 102 0.33 0.2 0.1 0.05 10 0.02 0.
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 006aac779 103 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 102 0.2 0.1 0.05 0.02 10 0.01 0 1 10-5 10-4 10-3 10-2 10-1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for PDTC143ZT (SOT23); typical values 006aac780 103 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 102 0.2 0.1 0.05 0.02 10 0.
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 7. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified.
PAGE 8
PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 006aac819 103 006aac820 1 hFE (1) VCEsat (V) (2) (3) 102 10-1 (1) (2) (3) 10 1 10-1 1 102 10 10-2 10-1 1 IC (mA) VCE = 5 V IC/IB = 20 (1) Tamb = 100 C (1) Tamb = 100 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 40 C (3) Tamb = 40 C Fig 6. DC current gain as a function of collector current; typical values Fig 7.
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 006aac823 3 Cc (pF) 006aac757 103 fT (MHz) 2 102 1 0 0 10 20 30 40 50 VCB (V) f = 1 MHz; Tamb = 25 C 10 10-1 1 102 10 IC (mA) VCE = 5 V; Tamb = 25 C Fig 10. Collector capacitance as a function of collector-base voltage; typical values Fig 11. Transition frequency as a function of collector current; typical values of built-in transistor 8. Test information 8.
PAGE 10
PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 9. Package outline 0.62 0.55 0.55 0.47 0.95 0.60 1.8 1.4 3 0.45 0.15 0.50 0.46 3 0.30 0.22 1.75 0.9 1.45 0.7 1.02 0.95 0.65 1 0.30 0.22 2 0.30 0.15 0.25 0.10 2 1 0.20 0.12 1 0.35 Dimensions in mm 04-11-04 Fig 12. Package outline PDTC143ZE (SOT416/SC-75) 3.0 2.8 Dimensions in mm 03-04-03 Fig 13. Package outline PDTC143ZM (SOT883/SC-101) 1.1 0.9 2.2 1.8 1.1 0.8 0.45 0.15 3 3 0.45 0.
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 11. Soldering 2.2 1.7 solder lands solder resist 1 0.85 2 solder paste 0.5 (3×) occupied area Dimensions in mm 0.6 (3×) 1.3 sot416_fr Reflow soldering is the only recommended soldering method. Fig 16. Reflow soldering footprint PDTC143ZE (SOT416/SC-75) 1.3 0.7 R0.05 (12×) solder lands solder resist 0.9 0.6 0.7 solder paste 0.25 (2×) occupied area 0.3 (2×) 0.3 0.4 (2×) 0.
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 3.3 2.9 1.9 solder lands solder resist 3 2 1.7 solder paste occupied area 0.6 (3×) 0.7 (3×) Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr Fig 18. Reflow soldering footprint PDTC143ZT (SOT23) 2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 solder resist 2.6 occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw Fig 19.
PAGE 13
PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 2.65 1.85 1.325 solder lands solder resist 2 2.35 0.6 (3×) 3 solder paste 1.3 1 occupied area 0.5 (3×) Dimensions in mm 0.55 (3×) sot323_fr Fig 20. Reflow soldering footprint PDTC143ZU (SOT323/SC-70) 4.6 2.575 1.425 (3×) solder lands solder resist occupied area 1.8 3.65 2.1 09 (2×) Dimensions in mm preferred transport direction during soldering sot323_fw Fig 21.
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PDTC143Z_SER v.8 20111205 Product data sheet - PDTC143Z_SERIES v.7 Modifications: • The format of this document has been redesigned to comply with the new identity guidelines of NXP Semiconductors.
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
PAGE 16
PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.
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PDTC143Z series NXP Semiconductors NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . .