LF PA K 56 PHPT61003NY 100 V, 3 A NPN high power bipolar transistor 3 February 2014 Product data sheet 1. General description NPN high power bipolar transistor in a SOT669 (LFPAK56) Surface-Mounted Device (SMD) power plastic package. PNP complement: PHPT61003PY 2.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor 5. Pinning information Table 2. Pinning information Pin Symbol Description 1 E emitter 2 E emitter 3 E emitter 4 B base mb C collector Simplified outline Graphic symbol C mb B E 1 2 3 4 sym123 LFPAK56; PowerSO8 (SOT669) 6. Ordering information Table 3.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 100 V VCEO collector-emitter voltage open base - 100 V VEBO emitter-base voltage open collector - 7 V IC collector current - 3 A ICM peak collector current - 8 A IB base current - 0.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor 9. Thermal characteristics Table 6.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor aaa-010428 102 duty cycle = 1 Zth(j-a) (K/W) 0.75 10 0.33 0.5 0.2 0.1 0.05 1 0.01 10-2 10-5 0.02 0.25 0 10-4 10-3 10-2 FR4 PCB, mounting pad for collector 6 cm Fig. 3. 10-1 1 10 102 tp (s) 103 2 Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PHPT61003NY Product data sheet All information provided in this document is subject to legal disclaimers.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor 10. Characteristics Table 7.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor Symbol Parameter Conditions Min Typ Max Unit fT transition frequency VCE = 10 V; IC = 100 mA; f = 100 MHz; - 140 - MHz - 11 - pF Tamb = 25 °C Cc collector capacitance VCB = 10 V; IE = 0 A; ie = 0 A; f = 1 MHz; Tamb = 25 °C aaa-010261 400 hFE (1) aaa-010267 3 IB = 50 mA 45 IC (A) 300 40 35 30 2 (2) 200 25 20 15 10 (3) 1 5 100 0 10-1 1 10 102 0 103 104 IC (kA) VCE = 10 V 1 2 3 4 VCE
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor aaa-010262 1.2 aaa-010265 1.4 VBE (V) VBEsat (V) (1) 0.8 1.0 (2) (1) (3) 0.4 0.6 (2) (3) 0 10-1 Fig. 6. 1 102 10 103 0.2 10-1 104 105 IC (mA) 1 102 10 VCE = 2 V IC/IB = 20 (1) Tamb = −55 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = 100 °C (3) Tamb = 100 °C Base-emitter voltage as a function of collector current; typical values Fig. 7.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor aaa-010266 103 RCEsat (Ω) RCEsat (Ω) 102 102 10 10 (1) 1 aaa-010268 103 1 (2) 10-1 10-2 10-1 (1) (3) 1 10 102 (2) 10-1 10-2 10-1 103 104 IC (mA) (3) 1 IC/IB = 20 Tamb = 25 °C (1) Tamb = 100 °C (1) IC/IB = 50 (2) Tamb = 25 °C (2) IC/IB = 20 (3) Tamb = −55 °C (3) IC/IB = 10 Fig. 10.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor 11. Test information - IB input pulse (idealized waveform) 90 % - I Bon (100 %) 10 % - I Boff output pulse (idealized waveform) - IC 90 % - I C (100 %) 10 % t td ts tr t on tf t off 006aaa266 Fig. 12. BISS transistor switching time definition VBB RB VCC RC Vo (probe) oscilloscope 450 Ω (probe) 450 Ω R2 VI oscilloscope DUT R1 mgd624 Fig. 13. Test circuit for switching times 11.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor 12. Package outline Plastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leads E A2 A SOT669 C c2 b2 E1 b3 L1 mounting base b4 D1 D H L2 1 2 3 e 4 w b A X c 1/2 e A (A3) A1 C q L detail X 0 y C θ 5 mm 8° scale 0° Dimensions (mm are the original dimensions) Unit(1) A A1 A2 A3 b b2 max 1.20 0.15 1.10 0.50 4.41 nom 0.25 min 1.01 0.00 0.95 0.35 3.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor 13. Soldering Footprint information for reflow soldering SOT669 4.7 4.2 0.9 (3×) 0.25 (2×) 0.25 (2×) 0.6 (4×) 3.45 0.6 (3×) 2 3.5 2.55 0.25 (2×) SR opening = Cu + 0.075 1.1 2.15 3.3 SP opening = Cu - 0.050 0.7 (4×) 1.27 3.81 solder lands solder paste 125 µm stencil solder resist occupied area Dimensions in mm sot669_fr Fig. 15.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor 14. Revision history Table 8. Revision history Data sheet ID Release date Data sheet status Change notice Supersedes PHPT61003NY v.3 20140203 Product data sheet - PHPT61003NY v.2 Modifications: • PHPT61003NY v.2 20131213 Product data sheet - PHPT61003NY v.1 Modifications: • PHPT61003NY v.
PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 15. Legal information 15.
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PHPT61003NY NXP Semiconductors 100 V, 3 A NPN high power bipolar transistor 16. Contents 1 General description ............................................... 1 2 Features and benefits ............................................1 3 Applications ........................................................... 1 4 Quick reference data ............................................. 1 5 Pinning information ............................................... 2 6 Ordering information ........................