Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsInterface ICsInterface IC - transceivers LIN 1/1 SO 8

1. General description

The TJA1021 is the interface between the Local Interconnect Network (LIN) master/slave

protocol controller and the physical bus in a LIN. It is primarily intended for in-vehicle

sub-networks using baud rates from 1 kBd up to 20 kBd and is LIN 2.1/SAE J2602

compliant. The TJA1021 is pin-to-pin compatible with the TJA1020 with an improved

ElectroStatic Discharge (ESD) specification.

The transmit data stream of the protocol controller at the transmit data input (TXD) is

converted by the TJA1021 into a bus signal with optimized slew rate and wave shaping to

minimize ElectroMagnetic Emission (EME). The LIN bus output pin is pulled HIGH via an

internal termination resistor. For a master application, an external resistor in series with a

diode should be connected between pin INH or pin V

BAT

and pin LIN. The receiver detects

the data stream at the LIN bus input pin and transfers it via pin RXD to the microcontroller.

In Sleep mode, the power consumption of the TJA1021 is very low. In failure modes, the

power consumption is reduced to a minimum.

2. Features and benefits

2.1 General

 LIN 2.1/SAE J2602 compliant

 Baud rate up to 20 kBd

 Very low ElectroMagnetic Emission (EME)

 High ElectroMagnetic Immunity (EMI)

 Passive behavior in unpowered state

 Input levels compatible with 3.3 V and 5 V devices

 Integrated termination resistor for LIN slave applications

 Wake-up source recognition (local or remote)

 K-line compatible

 Pin-to-pin compatible with TJA1020

 Available in SO8 and HVSON8 packages

 Leadless HVSON8 package (3.0 mm  3.0 mm) with improved Automated Optical

Inspection (AOI) capability

2.2 Low power management

 Very low current consumption in Sleep mode with local and remote wake-up

TJA1021

LIN 2.1/SAE J2602 transceiver

Rev. 7 — 25 March 2011 Product data sheet

Summary of content (25 pages)

PAGE 1
TJA1021 LIN 2.1/SAE J2602 transceiver Rev. 7 — 25 March 2011 Product data sheet 1. General description The TJA1021 is the interface between the Local Interconnect Network (LIN) master/slave protocol controller and the physical bus in a LIN. It is primarily intended for in-vehicle sub-networks using baud rates from 1 kBd up to 20 kBd and is LIN 2.1/SAE J2602 compliant. The TJA1021 is pin-to-pin compatible with the TJA1020 with an improved ElectroStatic Discharge (ESD) specification.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 2.3 Protection mechanisms  High ESD robustness: 6 kV according to IEC 61000-4-2 for pins LIN, VBAT and WAKE_N  Transmit data (TXD) dominant time-out function  Bus terminal and battery pin protected against transients in the automotive environment (ISO 7637)  Bus terminal short-circuit proof to battery and ground  Thermally protected 3. Quick reference data Table 1.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 5. Block diagram VBAT WAKE_N 7 3 WAKE-UP TIMER CONTROL 8 SLP_N 2 SLEEP/ NORMAL TIMER TEMPERATURE PROTECTION 6 TXD 4 INH LIN TXD TIME-OUT TIMER TJA1021 RXD 1 RXD/ INT BUS TIMER FILTER 5 GND 001aae066 Fig 1. Block diagram TJA1021 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 25 March 2011 © NXP B.V. 2011. All rights reserved.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 6. Pinning information 6.1 Pinning terminal 1 index area RXD 1 8 INH SLP_N 2 7 VBAT WAKE_N 3 6 LIN TXD 4 5 GND TJA1021T Fig 2. 1 SLP_N 2 8 INH 7 VBAT TJA1021TK WAKE_N 3 6 LIN TXD 4 5 GND 015aaa232 Transparent top view 015aaa231 a. TJA1021T/10; TJA1021T/20: SO8 RXD b. TJA1021TK/10; TJA1021TK/20: HVSON8 Pin configuration diagrams 6.2 Pin description Table 3.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 7. Functional description The TJA1021 is the interface between the LIN master/slave protocol controller and the physical bus in a Local Interconnect Network (LIN). The TJA1021 is LIN 2.1/SAE J2602 compliant and provides optimum ElectroMagnetic Compatibility (EMC) performance due to wave shaping of the LIN output.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver Table 4.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver Standby mode is signalled by a LOW-level on pin RXD which can be used as an interrupt for the microcontroller. In Standby mode (pin SLP_N is still LOW), the condition of pin TXD (weak pull-down or strong pull-down) indicates the wake-up source: weak pull-down for a remote wake-up request and strong pull-down for a local wake-up request.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver A falling edge at pin WAKE_N followed by a LOW level maintained for a certain time period (twake(dom)WAKE_N) results in a local wake-up. The pin WAKE_N provides an internal pull-up towards pin VBAT. In order to prevent EMI issues, it is recommended to connect an unused pin WAKE_N to pin VBAT. After a local or remote wake-up, pin INH is activated (it goes HIGH) and the internal slave termination resistor is switched on.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver The output driver at pin LIN is protected against overtemperature conditions. If the junction temperature exceeds the shutdown junction temperature Tj(sd), the thermal protection circuit disables the output driver. The driver is enabled again when the junction temperature has dropped below Tj(sd) and a recessive level is present at pin TXD. If VBAT drops below Vth(VBATL)L, a protection circuit disables the output driver.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to pin GND; unless otherwise specified. Positive currents flow into the IC. Symbol Parameter Conditions Min Max Unit VBAT battery supply voltage with respect to GND 0.3 +40 V VTXD voltage on pin TXD ITXD no limitation 0.3 +6 V ITXD < 500 A 0.3 +7 V 0.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 10. Static characteristics Table 7. Static characteristics VBAT = 5.5 V to 27 V; Tvj = 40 C to +150 C; RL(LIN-VBAT) = 500 ; all voltages are defined with respect to ground; positive currents flow into the IC; typical values are given at VBAT = 12 V; unless otherwise specified.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver Table 7. Static characteristics …continued VBAT = 5.5 V to 27 V; Tvj = 40 C to +150 C; RL(LIN-VBAT) = 500 ; all voltages are defined with respect to ground; positive currents flow into the IC; typical values are given at VBAT = 12 V; unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit Pin SLP_N VIH HIGH-level input voltage 2 - 7 V VIL LOW-level input voltage 0.3 - +0.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver Table 7. Static characteristics …continued VBAT = 5.5 V to 27 V; Tvj = 40 C to +150 C; RL(LIN-VBAT) = 500 ; all voltages are defined with respect to ground; positive currents flow into the IC; typical values are given at VBAT = 12 V; unless otherwise specified.[1] Symbol Parameter CLIN capacitance on pin LIN Vo(dom) dominant output voltage Conditions Min Typ Max Unit - - 30 pF Normal mode; VTXD = 0 V VBAT = 7.0 V - - 1.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver Table 8. Dynamic characteristics …continued VBAT = 5.5 V to 18 V; Tvj = 40 C to +150 C; RL(LIN-VBAT) = 500 ; all voltages are defined with respect to ground; positive currents flow into the IC; typical values are given at VBAT = 12 V; see Figure 6; unless otherwise specified.[1] Symbol Min Typ Max Unit rise time [2][4] - - 22.5 s t(r-f) difference between rise and fall time VBAT = 7.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver VBAT WAKE_N INH 100 nF SLP_N TXD TJA1021 RXD RRXD RL LIN GND CRXD CL 001aae069 Fig 5.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 12. Application information ECU LIN BUS LINE BATTERY +5 V/ +3.3 V only for master node VBAT INH VDD RX0 MICROTX0 CONTROLLER GND Px.x RXD TXD SLP_N 1 8 7 4 TJA1021 2 5 3 6 1 kΩ WAKE_N LIN (1) 001aae070 (1) Master: C = 1 nF; slave: C = 220 pF. Fig 7. Typical application of the TJA1021 13.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 14. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT782-1 X B D A E A A1 c detail X terminal 1 index area e1 terminal 1 index area e 1 4 C C A B C v w b y y1 C L K Eh 8 5 Dh 0 1 scale Dimensions Unit(1) mm 2 mm A A1 b max 1.00 0.05 0.35 nom 0.85 0.03 0.30 min 0.80 0.00 0.25 c 0.2 D Dh E Eh e e1 K L 3.10 2.45 3.10 1.65 0.35 0.45 3.00 2.40 3.00 1.60 0.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 10. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 18. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes TJA1021 v.7 20110325 Product data sheet - TJA1021 v.6 Modifications: • • • • Section 2.1: features added Table 5: parameter deleted - Tamb; conditions changed for VESD Table 7, Table 8: parameter names, descriptions and table notes revised Figure 6: revised (parameter names corrected) TJA1021 v.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 19. Legal information 19.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 19.
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TJA1021 NXP Semiconductors LIN 2.1/SAE J2602 transceiver 21. Contents 1 2 2.1 2.2 2.3 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 8 9 10 11 12 13 13.1 14 15 16 16.1 16.2 16.3 16.4 17 18 19 19.1 19.2 19.3 19.4 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Low power management . . . . . . . . . . . . . . . . .