Data Sheet

QSB34GR / QSB34ZR / QSB34CGR / QSB34CZR — Surface-Mount Silicon Pin Photodiode
www.onsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only.
Values are at T
A
= 25°C unless otherwise specified.
Note:
1. Soldering time ≤ 5 s.
Recommend I
R
Reflow Soldering Profile
Symbol Parameter Min. Unit
T
OPR
Operating Temperature -25 to +85
°CT
STG
Storage Temperature -40 to + 85
T
SOL
(1)
Soldering Temperature 260
V
R
Reverse Voltage 32 V
P
C
Power Dissipation at (or below) 25°C
Free Air Temperature
150
mW
1 ~ 3°C/s
Pre-heating
180 ~ 200°C
260°C Max.
120 s Max.
60 s Max.
Above 220°C
10 s Max.
1 ~ 3°C/s