Service manual

The user interface and micro controller are the same as used in the H8 set. In the N8
however, a HIP, PICNIC, and HOP are used for the '100 Hz' function i.s.o. the BOCMA
in the H8.
The HIP and HOP have about the same functionality as the BOCMA.
This chip set however, sees to it that line frequency and YUV-signals are doubled (2 fh),
while the vertical frequency stay 60 Hz (1fh). The set runs in progressive scan (an
interlaced picture at 60 Hz, in stead of at 30 Hz in normal NTSC)
The PICNIC is used for video features like AutoTV and Freeze.
The architecture consists of a conventional Large Signal Panel (LSP) a Picture In
Picture (PIP) and a Small Signal Board (SSB) module, placed into a so-called SIMM-
connector (Standard Interface, 80 pins).
The LSP is built up very conventional, with hardly any surface mounted components on
the copper side. Difference with the MG3.1U-chassis is that the N8 LSP has a very
large 'hot' part, including the deflection coil.
The SSB is a high tech module (two sides reflow technology, full SMC) with very high
component density and complete shielding for EMC-reasons. Despite this, it is designed
in such a way, that repair on component level will be possible. To achieve this, attention
has been paid to:
• the position of service test lands (tuner side),
• accessibility (tuner side),
• clearance around surface mounted ICs (for replacing),
• diagnostics and fault finding via ComPair.
Warning: Be aware that half of the LSP-circuitry is 'hot', including the deflection coils.