INTEGRATED CIRCUITS DATA SHEET TDA1519 2 x 6 W stereo car radio power amplifier Product specification File under Integrated Circuits, IC01 May 1992
Philips Semiconductors Product specification 2 x 6 W stereo car radio power amplifier TDA1519 GENERAL DESCRIPTION The TDA1519 is an integrated class-B dual output amplifier in a 9-lead single in-line (SIL) plastic medium power package. The device is primarily developed for car radio applications.
Philips Semiconductors Product specification 2 x 6 W stereo car radio power amplifier Fig.1 Block diagram.
Philips Semiconductors Product specification 2 x 6 W stereo car radio power amplifier TDA1519 PINNING 1 INV1 non-inverting input 1 2 GND1 ground (signal) 3 SVRR supply voltage ripple rejection 4 OUT1 output 1 5 GND2 ground (substrate) 6 OUT2 output 2 7 VP supply voltage 8 M/SS mute/stand-by switch 9 −INV2 non-inverting input 2 FUNCTIONAL DESCRIPTION The TDA1519 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB.
Philips Semiconductors Product specification 2 x 6 W stereo car radio power amplifier TDA1519 Fig.2 Power derating curve. DC CHARACTERISTICS (note 1) VP = 14,4 V; Tamb = 25 °C; unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply Supply voltage range note 2 VP 6,0 14,4 18,0 V IP − 40 80 mA note 3 VO − 6,95 − V see Fig.
Philips Semiconductors Product specification 2 x 6 W stereo car radio power amplifier TDA1519 AC CHARACTERISTICS (note 1) VP = 14,4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; unless otherwise specified PARAMETER Output power CONDITIONS SYMBOL MIN. TYP. MAX.
Philips Semiconductors Product specification 2 x 6 W stereo car radio power amplifier Fig.3 Stand-by, mute and ON conditions.
Philips Semiconductors Product specification 2 x 6 W stereo car radio power amplifier APPLICATION INFORMATION Fig.4 Application circuit diagram.
Philips Semiconductors Product specification 2 x 6 W stereo car radio power amplifier TDA1519 PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D1 q P A2 P1 A3 q1 q2 A A4 seating plane E pin 1 index c L 1 9 b e Z Q b2 w M b1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 max. A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1) max. mm 18.5 17.8 3.7 8.7 8.0 15.8 15.4 1.40 1.14 0.
Philips Semiconductors Product specification 2 x 6 W stereo car radio power amplifier TDA1519 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages.
