Thick Film SMD Resistors, 2512 FEATURES: Small size and lightweight Suitable for both flow and re-flow soldering Reduction of assembly costs SPECIFICATION: Housing type Rated output Resistor type Rated voltage Temperature range Dimensions L x W x H 2512 1W Thick film 200 V -55...+155 °C 6.35 x 3.2 x 0.
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1.0 Scope: This specification for approve relates to the Lead-Free Thick Film Chip Resistors manufactured 2.0 Ratings & Dimension: 0603ˣ0805ˣ1206ˣ1210ˣ1812ˣ2010ˣ2512 0201ǃ0402 2.1 Dimension & Resistance Range烉 Type Dimension(mm) 70ɗ Power Resistance Range L W H A B 0.5% 1.0% 2.0% 5.0% 0201 1/20W 0.60±0.03 0.30±0.03 0.23±0.03 0.10±0.05 0.15±0.05 -- 1¡-10M¡ 1¡-10M¡ 1¡-10M¡ 0402 1/16W 1.00±0.10 0.50±0.05 0.35±0.05 0.20±0.10 0.25±0.10 1¡-10M¡ 0.1¡~22M¡ 0.1¡~22M¡ 0.
2.2 Ratings Type 70ɗ Power MaxDŽ MaxDŽ Dielectric Resistance Rated MaxDŽRated Working Overload withstanding Value of Current of Current of Voltage Voltage Voltage Jumper Jumper Jumper Operating Temperature 0201 1/20W 25V 50V -- <50m¡ 0.
4.0 Marking: (1) For 0201 and 0402 size. Due to the very small size of the resistor’s body, there is no marking on the body. Example: 0201ǃ0 4 0 2 (2) Ʋ2%,r5%Tolerance:The first two digits are significant figures of resistance and the third denotes number of zeros following Example: 333 o 33K: (3) Ʋ2%ˣr5%Tolerance: Below 10: show as following, read alphabet”R” as decimal point. Example: 2R2 o 2.2: (4) Ʋ0.5%ˣr1% Tolerance: 4 digits, first three digits are significant; forth digit is number of zeros.
EXAMPLE: 1.96K:=196u101:------29B 12.
5.0 Derating Curve: Resistors shall have a power rating based on continuous load operation at an ambient temperature from -55 ɗ to 70ć. For temperature in excess of 70ć, the load shall be derate as shown in figure 1 Figure 1 5.
˖ġ īSolderability 95% coverage Min. Soldering temp reference Electrical characteristics shall be satisfied. Without distinct deformation in appearance. (95 % coverage Min.) 4.17 Test temperature of solder: 245ɗ±3ɗ dipping time in solder: 2-3 seconds. Wave soldering condition: (2 cycles Max.) Pre-heat: 100~120ɗ,30±5 sec. Suggestion solder temp.: 235~255ɗ,10sec. (Max.) Peak temp.: 260ɗ Reflow soldering condition: (2 cycles Max.) Pre-heat:150~180ɗ,90~120sec. Suggestion solder temp.: 235~255ɗ,20~40sec.
7.0 Explanation of Part No. System: 51' The standard Part No. includes 14 digits with the following explanation: 7.1 1st ~4th digits This is to indicate the Chip Resistor. Example: 0201, 0402,0603,0805,1206,1210,2010,1812,2512 7.2 5th~6th digits: 7.2.1 This is to indicate the wattage or power rating.
8.
Unit: mm Type A Ʋ0.2 B Ʋ0.2 CƲ0.05 +0.1 ȜD -0 EƲ0.1 FƲ0.05 GƲ0.1 WƲ0.2 TƲ0.1 0603 1.10 1.90 2.00 1.50 1.75 3.50 4.00 8.00 0.67 0805 1.65 2.40 2.00 1.50 1.75 3.50 4.00 8.00 0.81 1206 2.00 3.60 2.00 1.50 1.75 3.50 4.00 8.00 0.81 1210 2.80 3.50 2.00 1.50 1.75 3.50 4.00 8.00 0.75 Unit: mm + 0.1 ID -0 +0.1 ID1 -0 Er0.1 Fr0.05 Gr0.1 Wr0.2 TƲ0.1 1.50 1.50 1.75 5.50 4.00 12.00 1.00 2.00 1.50 1.50 1.75 5.50 4.00 12.00 1.00 2.00 1.50 1.50 1.
9.3 Dimension: Unit: mm Type Taping Qty/Reel Ar0.5 Br0.5 Cr0.5 Dr1 Mr2 Wr1 0201 Paper 10,000pcs 2.0 13.0 21.0 60.0 178.0 10.0 0402 Paper 10,000pcs 2.0 13.0 21.0 60.0 178.0 10.0 0603 Paper 5,000pcs 2.0 13.0 21.0 60.0 178.0 10.0 0805 Paper 5,000pcs 2.0 13.0 21.0 60.0 178.0 10.0 1206 Paper 5,000pcs 2.0 13.0 21.0 60.0 178.0 10.0 1210 Paper 5,000pcs 2.0 13.0 21.0 60.0 178.0 10.0 2010 Paper or Embossed 4,000pcs 2.0 13.0 21.0 60.0 178.0 13.
10.0: Note Matter˖ 10.1 Environment Related Substance. This product complies to EU RoHS directive, EU PAHs directive, EU PFOS directive and Halogen free. 10.2 Ozone layer depleting substances. Ozone depleting substances are not used in our manufacturing process of this product. This product is not manufactured using Chloro fluorocarbons (CFCs), Hydrochlorofluorocarbons (HCFCs), Hydrobromofluorocarbons (HBFCs) or other ozone depleting substances in any phase of the manufacturing process. 10.
