User manual

Chip Resistor
- 16 -
▶
Soldering
▷
The resistor should be fixed on PCB(printed circuit board) for testing.
- Soldering specification : JIS C 5202 (6.2)
* Soldering method : Flow type(Dipping type), Reflow type
* Solder : H63A (JIS Z 3282)
* FLUX : ROSIN 25WT% (JIS K 5902), IPA 75WT% (JIS K 5901)
- Flow soldering condition
* FLUX dipping time : 5
∼
10 sec
* Pre-treatment : None
* Soldering temp. : 235
℃±
5
℃
* Soldering time : 5
±
0.5 sec
* Temp. profile : <Fig 15>
- Reflow soldering condition
* Peak temp. : 230
℃±
5
℃
* Duration over 220
℃
:15
±
5sec
* Solder Cream : Sn-Pb (63-37)
* Temp. Profile : <Fig 16>
item
Permissible deviation
Test method
Resistor Jumper
Low
temperature
exposure
1. No mechanical
damage
2.
Δ
R should be
within
±
(3%+0.1
Ω
)
50m
Ω
Maximum
묤
Standard : JIS C 5202 (7.1)
묤
Test temperature : -55
±
2
℃
묤
Test time : 1000
+48
hours (without load)
묤
Measure : after 1 hour
묤
Test board : <Fig 11>
High
temperatur
exposure
1. No mechanical
damage
2.
Δ
R should be
within
±
(3%+0.1
Ω
)
50m
Ω
Maximum
묤
Standard : JIS C 5202 (7.2)
묤
Test temperature : 1608,2012,3216 : 155
±
2
℃
, others : 125
±
2
℃
묤
Test time : 1000
+48
hours (without load)
묤
Measure : after 1 hour
묤
Test board : <Fig 11>
Load life
1. No mechanical
damage
2.
Δ
R should be
within
<Table 13>
100m
Ω
Maximum
묤
Standard : JIS C 5202 (7.10)
묤
Test temperature : 70
±
2
℃
묤
Test voltage : rated voltage
묤
Test time : repeat 90min ON, 30min OFF
during 1000
+48
hours
묤
Test board : <Fig 11>.
<Table 13>
Range(
Ω
)
Δ
RMAX
0.1
≤
R<1
±
5%(L-Type)
1
≤
R<10
±
5%
10
≤
R<1M
±
(3%+0.1
Ω
)
1M
≤
R < 10M
±
5%
●
TEST BOARD AND SPECIFICATION