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October 2009

General Information DDR3 SDRAM

DDR3 SDRAM Product Guide

October 2009

Memory Division

Summary of content (21 pages)

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General Information DDR3 SDRAM DDR3 SDRAM Product Guide October 2009 Memory Division October 2009
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General Information DDR3 SDRAM 1. DDR3 SDRAM Component Ordering Information 1 2 3 4 5 6 7 8 9 10 11 K 4 B X X X X X X X - X X X X Speed SAMSUNG Memory DRAM Temp & Power DRAM Type Package Type Density Revision Interface (VDD, VDDQ) Bit Organization # of Internal Banks 1. SAMSUNG Memory : K 7. Interface ( VDD, VDDQ) 6 : SSTL (1.5V, 1.5V) 2. DRAM : 4 8. Revision 3. DRAM Type B : DDR3 SDRAM 4. Density 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb M A B C D E F G H : 1st Gen. : 2nd Gen.
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General Information DDR3 SDRAM 2. DDR3 SDRAM Component Product Guide Density 1Gb D-die 1Gb E-die 1Gb F-die 2Gb B-die 2Gb C-die Banks 8Banks 8Banks 8Banks 8Banks 8Banks DDP 2Gb D-die 8Banks DDP 2Gb E-die 8Banks DDP 4Gb B-die 8Banks Part Number Package & Power, Temp. (-C/-L) & Speed Org.
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General Information DDR3 SDRAM 3. DDR3 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 M X X X B X X X X X X X - X X X Memory Module DIMM Type Data bits Speed DRAM Component Type Temp & Power Depth PCB Revision Package # of Banks in Comp. & Interface Component Revision Bit Organization 1. Memory Module : M 8. Component Revision M : 1st Gen. B : 3rd Gen. D : 5th Gen. F : 7th Gen. 2. DIMM Type 3 : DIMM 4 : SODIMM 3.
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General Information DDR3 SDRAM 4. DDR3 SDRAM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product) 240Pin DDR3 Unbuffered DIMM Org. 128Mx 64 128Mx 72 256Mx 64 256Mx 72 Density 1GB 1GB 2GB 2GB 512Mx 64 4GB 512Mx 72 4GB Part Number Speed M378B2873DZ1 CF8/H9 M378B2873EH1 CF8/H9/K0 M378B2873FHS Raw Card Composition Comp.
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General Information DDR3 SDRAM 4.3 204Pin DDR3 SoDIMM (1.5V Product) 204Pin DDR3 SODIMM Org. 128Mx 64 256Mx 64 512Mx 64 Density 1GB 2GB 4GB Comp.
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General Information DDR3 SDRAM 4.5 240Pin DDR3 Registered DIMM (1.5V Product) 240Pin DDR3 Registered DIMM Org. 128Mx 72 256Mx 72 512Mx 72 Density 1GB 2GB 4GB Part Number Speed M393B2873DZ1 CF8/H9 M393B2873EH1 CF8/H9 M393B2873FH0 Raw Card 2Gx 72 8GB Comp.
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General Information DDR3 SDRAM 4.6 240Pin DDR3 Registered DIMM (1.35V Product) 240Pin DDR3 Registered DIMM Org.
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General Information DDR3 SDRAM 4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product) 240Pin DDR3 VLP Registered DIMM Org. 128Mx 72 Density 1GB Part Number Speed M392B2873DZ1 CF8/H9 M392B2873EH1 CF8/H9 M392B2873FH0 CF8/H9 M392B5673DZ1 CF8/H9 Raw Card K(1Rx8) Composition Comp.
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General Information DDR3 SDRAM 4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product) 240Pin DDR3 VLP Registered DIMM Org. Density 128Mx 72 1GB 256Mx 72 512Mx 72 2GB 4GB Part Number Speed M392B2873EH1 YF8/H9 M392B2873FH0 YF8/H9 M392B5673EH1 YF8/H9 M392B5673FH0 YF8/H9 M392B5670EH1 YF8/H9 Raw Card K(1Rx8) L(2Rx8) M(1Rx4) Comp.
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General Information DDR3 SDRAM 5. RDIMM RCD Information 5.1 RCD Identification in JEDEC Description in Module Label 5.2 Label Example 4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0 Made in Korea M393B5170EH1-CH9 0920 5.3 RCD Information - Example Voltage 1.5V 1.
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General Information DDR3 SDRAM 9.00 ± 0.10 A 0.80 x 10 = 8.00 1.60 #A1 INDEX MARK 4.00 #A1 11.00 ± 0.10 0.80 x 12 = 9.60 4.80 0.80 0.80 (Datum B) A B C D E F G H J K L M N 9.00 ± 0.10 B 11 10 9 8 7 6 5 4 3 2 1 0.50 ± 0.05 0.80 11.00 ± 0.10 (Datum A) 0.10MAX 78 + 4Ball FBGA for 1Gb D-die (x4/x8) 0.35 ± 0.05 (0.95) 82 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B Top Bottom : Support Ball A 0.80 x 10 = 8.00 #A1 INDEX MARK 0.80 1.
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General Information DDR3 SDRAM 0.80 1.60 #A1 INDEX MARK 3.20 #A1 11.00 ± 0.10 0.80 x 12 = 9.60 4.80 0.80 0.80 (Datum B) A B C D E F G H J K L M N 7.50 ± 0.10 B 9 8 7 6 5 4 3 2 1 0.50 ± 0.05 (Datum A) A 11.00 ± 0.10 7.50 ± 0.10 0.80 x 8 = 6.40 0.10MAX 78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8) 0.35 ± 0.05 (0.95) 78 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B Top Bottom A 0.80 x 8 = 6.40 0.80 1.60 3.
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General Information DDR3 SDRAM 9.00 ± 0.10 0.80 A #A1 INDEX MARK 3.20 1.60 #A1 11.50 ± 0.10 0.80 x 12 = 9.60 0.80 4.80 A B C D E F G H J K L M N 0.80 (Datum B) 9.00 ± 0.10 B 9 8 7 6 5 4 3 2 1 11.50 ± 0.10 (Datum A) 0.10MAX 78Ball FBGA for 2Gb B-die (x4/x8) 0.35 ± 0.05 (0.95) 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B TOP VIEW BOTTOM VIEW 9.00 ± 0.10 0.10MAX 96Ball FBGA for 2Gb B-die (x16) A #A1 INDEX MARK 0.80 1.60 3.
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General Information DDR3 SDRAM 10.50 ± 0.10 A 0.80 x 8 = 6.40 0.80 1.60 #A1 INDEX MARK 4.00 #A1 11.00 ± 0.10 0.80 x 12 = 9.60 4.80 0.80 0.80 (Datum B) A B C D E F G H J K L M N 10.50 ± 0.10 B 9 8 7 6 5 4 3 2 1 11.00 ± 0.10 (Datum A) 0.10MAX 78Ball DDP for 1Gb D-die (x4) 0.35 ± 0.05 82 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 1.40 ± 0.10 0.2 M A B Top Bottom 9.00 ± 0.10 A 0.80 x 8 = 6.40 0.80 1.60 #A1 INDEX MARK 3.20 #A1 11.50 ± 0.10 0.80 x 12 = 9.60 4.80 0.80 0.
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General Information DDR3 SDRAM 10.00 ± 0.10 A 0.80 x 8 = 6.40 0.80 1.60 #A1 INDEX MARK 3.20 #A1 11.50 ± 0.10 0.80 x 12 = 9.60 4.80 0.80 0.80 (Datum B) A B C D E F G H J K L M N 10.00 ± 0.10 B 9 8 7 6 5 4 3 2 1 11.50 ± 0.10 (Datum A) 0.10MAX 78Ball DDP for 2Gb B-die (x4/x8) 0.35 ± 0.05 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 1.40 ± 0.10 0.
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General Information DDR3 SDRAM x64/x72 240pin DDR3 SDRAM Unbuffered DIMM Units : Millimeters 128.95 ECC SPD 17.30 9.50 N/A (for x64) 2.30 (for x72) 30.00 ± 0.15 (4X)3.00 ± 0.1 133.35 ± 0.15 (2) 2.50 54.675 A B 47.00 Max 4.0 71.00 N/A (for x64) ECC (for x72) 2.50 ± 0.20 1.270 ± 0.10 5.00 0.80 ± 0.05 3.80 1.50±0.10 2x 2.10 ± 0.15 0.2 ± 0.15 1.00 2.
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General Information DDR3 SDRAM x64 204pin DDR3 SDRAM Unbuffered SODIMM Units : Millimeters 67.60 0.10 M C A B 63.60 6 20.00 SPD 30.00 ± 0.15 Max 3.8 1.00 ± 0.10 24.80 A 21.00 B 39.00 2X 1.80 0.10 M C A B (OPTIONAL HOLES) 2X 4.00 ± 0.10 0.10 M C A B 0.60 0.45 ± 0.03 1.65 4.00 ± 0.10 2.55 0.25 MAX 1.00 ± 0.
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General Information DDR3 SDRAM x72 240pin DDR3 SDRAM Registered DIMM Units : Millimeters C 128.95 32.40 18.93 9.74 Max 4.0 54.675 2.30 2.50 A 1.0 max B 47.00 1.27 ± 0.10 2.50 ± 0.20 71.00 5.00 0.80 ± 0.05 3.80 0.2 ± 0.15 1.00 0.4 R 1.50±0.10 10.9 Detail A Detail B Detail C 2x 2.10 ± 0.15 Register 2.50 17.30 Register 30.00 ± 0.15 18.92 0. 50 10.9 9.50 9.76 (2X)3.00 133.35 ± 0.
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General Information DDR3 SDRAM Registered DIMM Heat Spreader Design 1. FRONT PART Outside R0 .2 4.65± 0.12 1 2 ± 0.1 2 2 2.6 ± 0.2 0.15 1.3 1 0. R 127 ± 0.12 25.6 ± 0.15 31.4 23.6 ± 0.15 11.9 29.77 25.6 ± 0.15 0.65 ± 0.2 130.45 ± 0.15 9.26 1+0/ -0.3 133.15 ± 0.2 1.3 0.4 Inside Green Line : TIM Attatch Line 7.45 Reg. pedestal line 80.78 119.29 128.5 2.
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General Information DDR3 SDRAM 3. CLIP PART 39.3 ± 0.2 Upper Bending Tilting Gap 29.77 0.1 ~ 0.3 C R B 1. 5 A 0.5 4. DDR3 RDIMM ASS’Y View Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness) 1.27 1.05 132.95 ± 133.45 39.3 ± 0.2 19 19 ± 0.1 D K E (Clip open size) text mark ’B’ or ’K’ punch press_stamp * Dimension Index Mono DDP Note Min. Typ. Max. Min. Typ. Max. A - 43.9 - - 44.4 - B 6.7 6.8 6.9 7.2 7.3 7.