Service manual

2-10 Samsung Electronics

2-2-5 (c) Installation

1. Clean the place where new parts will be installed.

2. Apply water-soluble flux.

3. Locate a part exactly in place. Be careful not to shift

it.

4. Stick the part fast with a soldering iron not con-

tacting it directly. Put 0.3mm solder between the

iron and the part so that it can melt into the part.

2-2-6. Chip IC

2-2-6 (a) Type

There are the following types of chip IC.

1. SOP (Small Outline Package) IC

2. SSOP (Shrink Small Outline Package) IC

3. VSOP (Very Small Outline Package) IC

4. QFP (Quad Flat Package) IC

5. VQFP (Very Quad Flat Package) IC

6. PLCC (Plastic Leaded Chip Carrier) IC

7. TSOP (Thin Small Outline Package) IC

2-2-6 (b) Removal

1. Use a special solder-removing iron.

a. Choose an iron tip that suits the shape and the

size of IC.

b. Use ÔthinÕ tip to contact legs of IC.

c. Put the tip right in front of the legs of IC.

d. Twist the iron carefully when solder melts.

e. Raise and remove IC.

2. Use a ventilation device.

a. Choose an injector that suits IC.

b. Choose the temperature and the ventilation

speed. (normal: temperature - 7, speed - 4)

c. Use IC-removing tools.

d. Preheat it for about 5 seconds with the ventila-

tion device. And apply heat with the injector

until IC can be removed from the board with IC

removing tools.

2-2-6 (c) Installation

1. Remove the remaining solder completely with sol-

der-removing wire.

2. Clean the place to be soldered.

3. Apply water-soluble flux.

4. Put IC in place and solder the legs of opposite

direction.

5. Solder each leg carefully with thin tip.

6. Remove solder with solder-removing wire if there

is a short circuit.

7. Check the soldered part with a magnifier.