Datasheet

SOLDER PASTE SC BLF03
Type ISO 1.2.3.C
The SC BLF03 is a cosequently evolved High-Tech-Product, which is best suitable for all
lead-free SMT applications. Its development is not only based on many years of
experience on the field of SMT but also the careful and severe consideration of the norms
ISO, EN, IPC, und MIL.
The SC BLF03 is a homogenous mixture of a lead-free solder powder available in all
required alloys and grain sizes, with an organic flux based on synthetic resin
corresponding to RE L0 according to J-STD 004 (F-SW32) (exceeds the expectations of
RMA!). Thus it belongs to the latest "no-clean" solder paste types. Besides excellent slump
resistance, no solder balling, a long stencil and tack life and high temperature stability, this
paste has following advantages:
*SC BLF03* minimal (4.3%), highly transparent residue, simplifying the in circuit test
*SC BLF03* a true ”no clean” paste
*SC BLF03* contains corrosion inhibitors
*SC BLF03* an outstanding printing quality - for hours
*SC BLF03* an huge adhesive power
*SC BLF03* excellent for fine pitch and super fine pitch applications
*SC BLF03* superior soldering results with all soldering profiles and ovens
PHYSICAL DATA
Metal alloys
Preferred alloys Melting point According to international standards we deliver
these alloys in the classes of:
Sn96,5/Ag3,5
Sn95,5/Ag3,8/Cu0,7
Sn96,5/Ag3/Cu0,5
Sn99,3/Cu0,7
221°C
217 – 219°C
217°C
227°C
class 3 25 – 45 µm
class 4 20 – 36 µm
class 5 10 – 25 µm
VISCOSITY (Pa.S)
Viscosity:*
Slump according to DIN32513
At the moment 20min 80°C
Solder balling
acc. To IPC
Wetting acc.
To IPC
750 Pa.s. powder class III
900 Pa.s. powder class IV
Kl.1 = 0.2 0.2
Kl.2 = 0.2 0.3 1 1
*The information is founded on the measurement with the Brookfield RVT-DV-II viscometer TF 5R/pm at 25°C with the Helipath-system
(+/- 10%). Paste with 90% metal content.
SURFACE RESISTANCE (SIR) and electrolytic corrosion impact according to IPC 650
Measured on
day 4 day 21
4,4x10'³ 6,8x10'²