Datasheet

QUALIFICATIONS
SC BLF03 is an RMA paste, which fulfils the demands of MIL-QQ-S571e. The corrosion-,
solderballing-, wetting- and slump (SN 59650) tests have been passed. Laboratory tests
certify non-corrosive residues, which can be left on the board, even under the protective
coating, as the flux corresponds to RE L0 (no clean).
If wetting of the PCB can occur during the use of it, even for a short term, apropriate
measures against moisture have to be applied.
STORAGE
Unopened at room temperature (20°C/68°F): 6 months
Open or on the printer squeegee the maximal processing time depends, of course, on the
environmental influences on the paste. A storage in the refrigerator is not necessary,
but a storage temperature of <22°C is recommended.
APPLICATION INFORMATION
After using the paste close the container tightly.
Do not mix used and fresh paste, only to freshen up paste and only at work in progress.
Do not mix pastes of different kind.
Recommended squeegee speed: 15-100 mm/s.
For stencil printing, paste with 90% metal content is recommended.
Note: the printer is always faster than the fastest assembler in the production line.
The printer squeegee must be set to ensure that the paste performs a rolling action in front
of the squeegee and does not slide!
The stencil can be washed with an alcohol mixture but the alcohol must not contaminate
fresh paste. We recommend the SC Stencil Cleaner.
The paste is suitable for all common reflow systems.
Solder Chemistry order example
Legend Paste type Grain size Alloy Flux content Jar capacity
e.g. SC BLF03 F 95,5/3,8/0,7Cu 10% 500g
SC BLF03 F 96,5/3,5Ag 10% 200g
Order example according to DIN:
Solder Paste(SC...) L-Sn96,5Ag3,5 / F-SW 32 / 90-3 200g(packing)
Solder Chemistry ; Fragnerstraße 4 ; D-84034 Landshut
Tel. ++49/871/4309500 ; Fax. ++49/871/43095020
e-Mail: [e-mail] ; www.SolderChemistry.com
The engineering data shown here has been compiled by Solder Chemistry using commonly accepted procedures. Although the data is
considered accurate, we cannot guarantee its accuracy, the results obtained from its use, or any patent infringement resulting from its
use. The data is supplied on the condition that the user shall conduct tests to determine material suitability for a particular application.