MDS-S50 SERVICE MANUAL US Model Canadian Model AEP Model UK Model E Model Australian Model Ver 1.0 2001.02 Photo: Gray model US and foreign patents licensed from Dolby Laboratories. Model Name Using Similar Mechanism NEW MD Mechanism Type MDM-7A Optical Pick-up Name KMS-260B SPECIFICATIONS MiniDisc digital audio system Disc MiniDisc Laser Semiconductor laser (λ = 780 nm) Emission duration: continuous Laser output MAX 44.
MDS-S50 SELF-DIAGNOSIS FUNCTION The deckís self-diagnosis function automatically checks the condition of the MD deck when an error occurs, then issues a threeor five-digit code and an error message on the display. If the code and message alternate, find them in the following table and perform the indicated countermeasure. Should the problem persist, consult your nearest Sony dealer. C11/Protected , Take out the MD and close the record-protect slot.
MDS-S50 ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTS Display Details of History op rec tm Cumulative recording time is displayed. When cumulative recording time is over 1 minute, the hour and minute are displayed as they are. When it is under 1 minute, “Under 1 min” is displayed. The displayed time is the total time the laser is set to the high power state. This is about 1/4 of the actual recording time. The time is displayed in decimal digits. op play tm Cumulative playing time is displayed.
MDS-S50 Table of Error Codes Error Code 4 Details of Error 10 Loading failed 12 Loading switch combination is illegal 20 Head of PTOC could not be read within the specified time 21 Head of PTOC could be read but its content is erroneous 22 Access to UTOC could not be made within the specified time 23 UTOC could be not read within the specified time 24 Content of UTOC is erroneous 30 Playing could not start 31 Content of sector is erroneous 40 Cause of retry occurred during normal reco
MDS-S50 TABLE OF CONTENTS SELF-DIAGNOSIS FUNCTION .................................... 2 1. SERVICING NOTES ............................................... 7 2. GENERAL ................................................................... 12 3. DISASSEMBLY 3-1. 3-2. 3-3. 3-4. 3-5. Disassembly Flow ........................................................... Case ................................................................................. MD Mechanism Deck (MDM-7A) .................................
MDS-S50 Notes on chip component replacement • Never reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing • Keep the temperature of the soldering iron around 270 ˚C during repairing. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering.
MDS-S50 SECTION 1 SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
MDS-S50 JIG FOR CHECKING BD BOARD WAVEFORM The special jig (J-2501-196-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be performed are shown as follows.
MDS-S50 IOP DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC195 OF BD BOARD) ARE REPLACED The IOP value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the need to look at the value on the label of the optical pick-up. When replacing the optical pick-up or non-volatile memory (IC195 of BD board), record the IOP value on the optical pick-up according to the following procedure. Record Precedure: 1.
MDS-S50 RETRY CAUSE DISPLAY MODE IN MD • In this test mode, the causes for retry of the unit during recording and stop can be displayed on the liquid crystal display. During playback, the “track mode” for obtaining track information will be set. This is useful for locating the faulty part of the unit. • The following will be displayed : During recording and stop : Retry cause, number of retries, and number of retry errors. During playback : Information such as type of disc played, part played, copyright.
MDS-S50 Reading the Retry Cause Display Higher Bits Lower Bits HexaHexadecimal 8 4 2 1 8 4 2 1 decimal Bit b7 b6 b5 b4 b3 b2 b1 b0 Binary Details When 1 When 0 0 0 0 0 0 0 0 1 01 Emphasis OFF Emphasis ON 0 0 0 0 0 0 1 0 02 Monaural Stereo 0 0 0 0 0 1 0 0 04 0 0 0 0 1 0 0 0 08 This is 2-bit display. Normally 01. 01: Normal audio.
MDS-S50 SECTION 2 GENERAL This section is extracted from instruction manual.
MDS-S50 Remote control AyB qs (16) CD PLAYER . (go back)/> (go forward) ql (15) CD-SYNCHRO STANDBY/START/STOP 7 (14) (15) CLEAR 6 (18) (24) DISPLAY ws (8) (12) FADER 3 (28) INPUT wf (8) Letter/number buttons 5 (17) (25) LEVEL +/– qa (12) MENU/NO w; (10) (18) (20) MUSIC SYNC 8 (14) NAME EDIT/SELECT wa (24) PLAY MODE 2 (16) REC MODE wg (9) REPEAT qd (16) SCROLL wd (17) T.
MDS-S50 SECTION 3 DISASSEMBLY • This set can be disassembled in the order shown below. 3-1. DISASSEMBLY FLOW Set 3-2. CASE (Page 15) 3-3. MD MECHANISM DECK (MDM-7A) (Page 15) 3-4. MAIN BOARD (Page 16) 14 3-5.
MDS-S50 Note: Follow the disassembly procedure in the numerical order given. 3-2. CASE 2 case 1 two screws (case 3 TP2) 1 two screws (case 3 TP2) 3-3.
MDS-S50 3-4. MAIN BOARD 2 connector (CN902) 4 two screws (BVTP3 × 10) 1 wire (flat type) (20 core) (CN490) 5 MAIN board 1 wire (flat type) (23 core) (CN400) 1 wire (flat type) (27 core) (CN1) 3 six screws (BVTP3 × 10) 3-5. BD BOARD BD board – CONDUCTOR SIDE VIEW – 5 Remove four solders. 1 wire (flat type) (23 core) (CN103) 2 wire (flat type) (27 core) (CN102) 7 BD board 3 connector (CN104) 8 flexible board (CN101) 4 Remove five solders.
MDS-S50 SECTION 4 TEST MODE 4-1. PRECAUTIONS FOR USE OF TEST MODE • As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it. Even if the Z button is pressed while the disc is rotating during continuous playback, continuous recording, etc., the disc will not stop rotating. Therefore, it will be ejected while rotating.
MDS-S50 4-5. SELECTING THE TEST MODE There are 26 types of test modes as shown below. The groups can be switched by turning the [. AMS >] knob. After selecting the group to be used, press the [YES] button. After setting a certain group, turning the [ . AMS > ] knob switches modes shown below. Refer to “Group” in the table for details can be selected. All items used for servicing can be treated using group [Service]. So be carefully not to enter other groups by mistake.
MDS-S50 4-5-1. Operating the Continuous Playback Mode 1. Entering the continuous playback mode (1) Set the disc in the unit. (Whichever recordable discs or discs for playback only are available) (2) Turn the [. AMS > ] knob to display “CPLAY1MODE” (C34). (3) Press the [YES] button to change the display to “CPLAY1MID”. (4) When access completes, the display changes to “C = AD = )”. Note: The numbers “ ” displayed show you error rates and ADER. 2.
MDS-S50 4-7. TEST MODE DISPLAYS Each time the [LEVEL/DISPLAY/CHAR] button is pressed, the display changes in the following order. When CPLAY or CREC are started, the display will forcibly be switched to the error rate display as the initial mode. 1. Mode display Displays “TEMP ADJUST” (C03), “CPLAY1MODE” (C34), etc. Mode display 2. Error rate display Displays the error rate in the following way. C= AD = ) C = : Indicates the C1 error. AD = : Indicates ADER.
MDS-S50 4-8. AUTOMATIC SELF-DIAGNOSIS FUNCTION This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. To perform this test mode, the laser power must first be checked. Perform AUTO CHECK after the laser power check and Iop Compare. Procedure: 1. Turn the [. AMS > ] knob to display “AUTO CHECK” (C01). 2. Press the [YES] button. If “LDPWR ” is displayed, it means that the laser power check has not been performed.
MDS-S50 SECTION 5 ELECTRICAL ADJUSTMENTS 5-1. PARTS REPLACEMENT AND ADJUSTMENTS If malfunctions caused by optical pick-up such as sound skipping are suspected, follow the following check. Check before replacement Start 5-6-2. Laser Power Check (See page 25) NG OK 5-6-3. Iop Compare (See page 25) NG OK 5-6-4. Auto Check (See page 26) NG Replace optical pick-up or MDM-7A OK Other faults are suspected. Check the mechanism parts (spindle motor, sled motor, etc.
MDS-S50 Adjustment flow • Abbreviation OP: optical pick-up Start Replace IC195 YES After turning off and then on the power, initialize the EEPROM For details, refer to “WHEN MEMORY NG IS DISPLAYED” in 1. SERVICING NOTES (See page 9) NO Replace OP or IC195 YES 5-7. INITIAL SETTING OF ADJUSTMENT VALUE (See page 28) YES 5-9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT (See page 28) YES 5-10.
MDS-S50 5-2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSION To check the emission of the laser diode during adjustments, never view directly from the top as this may lose your eye-sight. 5-3. PRECAUTIONS FOR USE OF OPTICAL PICKUP (KMS-262B) As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when using it. Before disconnecting the connector, desolder first. Before connecting the connector, be careful not to remove the solder.
MDS-S50 5-5. USING THE CONTINUOUSLY RECORDED DISC • This disc is used in focus bias adjustment and error rate check. The following describes how to create a continuous recording disc. 1. Insert a disc (blank disc) commercially available. 2. Turn the [ . AMS > ] knob to display “CREC 1MODE” (C35). 3. Press the [YES] button to display “CREC 1MID”. Display “CREC 1(0300)” and start to recording. 4. Complete recording within 5 minutes. 5. Press the [MENU/NO] button and stop recording . 6.
MDS-S50 5-6-4. Auto Check This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. To perform this test mode, the laser power must first be checked. Perform Auto Check after the laser power check and Iop compare. Procedure: 1. Turn the [ . AMS > ] knob to display “AUTO CHECK” (C01). 2. Press the [YES] button. If “LDPWR ” is displayed, it means that the laser power check has not been performed.
MDS-S50 9. Press the [YES] button to display “EFB = MO-P”. Then, the optical pick-up moves to the pit area automatically and servo is imposed. 10. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not turn the [ . AMS > ] knob. Traverse Waveform A VC B Specified value : Below 10% offset value Offset value (%) = IA – BI X 100 2 (A + B) 11. Press the [YES] button to display “EF MO CHECK” (C14). The disc stops rotating automatically. 12.
MDS-S50 5-7. INITIAL SETTING OF ADJUSTMENT VALUE 5-9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT Note: Mode which sets the adjustment results recorded in the non-volatile memory to the initial setting value. However the results of the temperature compensation offset adjustment will not change to the initial setting value. If initial setting is performed, perform all adjustments again excluding the temperature compensation offset adjustment. For details of the initial setting, refer to “5-4.
MDS-S50 6. Turn the [ .AMS >] knob so that the reading of the laser power meter becomes 6.9 to 7.1 mW, press the [YES] button to save it. (“LD SAVE $ ” will be displayed for a moment) Note: Do not perform the emission with 7.0 mW more than 15 seconds continuously. 7. Then, turn the [ .AMS > ] knob to display “LDPWR CHECK” (C13). 8. Press the [YES] button once to display “LD 0.9mW$ ”. Check that the reading of the laser power meter become 0.85 to 0.91 mW. 9.
MDS-S50 8. Turn the [.AMS >] knob so that the waveform of the oscilloscope becomes the specified value. (When the [.AMS>] knob is turned, the of “EFB= ” changes and the waveform changes) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible. (Write power traverse adjustment) Traverse Waveform VC B Specification A = B 9. Press the [YES] button, and save the adjustment results in the non-volatile memory.
MDS-S50 5-14. ERROR RATE CHECK 5-16. AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 5-14-1. CD Error Rate Check Procedure: 1. Load the check disc (TDYS-1). 2. Turn the [ . AMS > ] knob to display “CPLAY1MODE” (C34). 3. Press the [YES] button twice and display “CPLAY1MID”. 4. The display changes to “C = AD = )”. 5. Check that the C1 error rate is below 20. 6. Press the [MENU/NO] button to stop playback, then press the Z button and take out the check disc (TDYS-1).
MDS-S50 Adjustment and checking Loacation: – BD BOARD (Component Side) – D101 CN101 – BD BOARD (Conductor Side) – IC101 IC151 CN105 1. I+3V 1 2. IOP 7 3. GND 4. TE 5. FE 6. VC 7. RF IC190 Note: It is useful to use the jig for checking BD board waveform.
MDS-S50 SECTION 6 DIAGRAMS 100 60 FILTER SCTX 59 62 61 AGCI RF AGC & EQ ASYI PEAK 3T PEAK & BOTTOM BOTM 37 9 TE E I-V AMP F TRACKING ERROR AMP COMMAND AUTOMATIC POWER CONTROL Q121, 122 ILCC PD 11 FE FOCUS ERROR AMP APC LD/PD AMP SERIAL/PARALLEL CONVERTER, DECODER LD SE 78 SUBCODE PROCESSOR ADIP DEMODULATOR/ DECODER CPU INTERFACE 35 79 34 F0CNT MONITOR CONTROL SPINDLE SERVO 26 28 94 93 12 11 14 9 8 5 6 7 V-I CONVERTER F0CNT SWDT 20 SCLK 1024FS DIVIDER IC171 1
MDS-S50 6-2.
MDS-S50 6-3. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS Note on Printed Wiring Board: • X : parts extracted from the component side. • Y : parts extracted from the conductor side. : Pattern from the side which enables seeing. • (The other layers' patterns are not indicated.) Caution: Pattern face side: (Conductor Side) Parts face side: (Component Side) Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated.
MDS-S50 • Circuit Boards Location VOL SEL board (Brazilian, Singapore) PT board MAIN board POWER SW board DISPLAY board 36 BD board
MDS-S50 6-4. PRINTED WIRING BOARDS – BD Board – BD BOARD • See page 36 for Circuit Boards Location. FLEXIBLE BOARD BD BOARD (CONDUCTOR SIDE) (COMPONENT SIDE) S102-2 PROTECT DETECT (LOADING) –2 –1 S102-1 REFLECT RATE DETECT (PACK OUT) 2B 1B TEST PIN 2C 1C PLAY POSITION REC POSITION G D G D 23 1 22 22 (SLED) (22) (22) A-1 Q101 Q131 Q132 Q133 Q134 B-1 C-1 B-1 B-1 C-1 MAIN BOARD CN400 MAIN BOARD CN1 (Page 40) (Page 40) Ref. No.
MDS-S50 6-5. SCHEMATIC DIAGRAM – BD Board (1/2) – • See page 48 for Waveforms. • See page 48 for IC Block Diagrams. (Page 39) (Page 39) (Page 39) The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. 38 38 Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié.
MDS-S50 6-6. SCHEMATIC DIAGRAM – BD Board (2/2) – • See page 48 for Waveforms. • See page 48 for IC Block Diagram.
MDS-S50 6-7. PRINTED WIRING BOARD – MAIN Board (Component Side) – • See page 36 for Circuit Boards Location. (Page 46) • Semiconductor Location Ref. No.
MDS-S50 6-8. PRINTED WIRING BOARD – MAIN Board (Conductor Side) – IN ANALOG • See page 36 for Circuit Boards Location. OUT (EXCEPT US, CND) R L R L DIGITAL IN • Semiconductor Location Ref. No. ON OFF 2 1 Location D461 D462 D471 D472 D476 D477 D481 E-2 D-1 E-2 D-1 E-2 D-1 G-1 IC400 IC440 IC480 IC611 B-2 G-4 I-1 A-10 Q356 Q910 H-12 G-2 (Page 45) E 41 41 There are a few cases that the part isn't mounted in model is printed on diagrams.
MDS-S50 6-9. SCHEMATIC DIAGRAM – MAIN Board (1/3) – • See page 48 for Waveform.
MDS-S50 6-10. SCHEMATIC DIAGRAM – MAIN Board (2/3) – • See page 48 for Waveforms. • See page 48 for IC Block Diagram.
MDS-S50 6-11. SCHEMATIC DIAGRAM – MAIN (3/3)/PT/VOL SEL Boards – • See page 48 for IC Block Diagrams. (Page 43) (Page 42) (Page 42) The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. 44 44 Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié.
6-12. PRINTED WIRING BOARDS – PT/VOL SEL Boards – • See page 36 for Circuit Boards Location.
MDS-S50 6-13. PRINTED WIRING BOARDS – DISPLAY/POWER SW Boards – • See page 36 for Circuit Boards Location. S701 – 705, S711 – 715 (EXCEPT US, CND) E (Page 40) • Semiconductor Location B-2 B-3 B-1 B-1 S721 – 724, S726 L791 Q751 Q775 Q791 Q792 (US, CND) L793 L791 C-1 C-3 L792 D751 D775 (EXCEPT US, CND) L793 Location L792 Ref. No. (EXCEPT US, CND) EXCEPT US, CND 46 46 There are a few cases that the part isn't mounted in model is printed on diagrams.
6-14. SCHEMATIC DIAGRAM – DISPLAY/POWER SW Boards – • See page 48 for Waveform.
MDS-S50 • Waveforms – BD Board – • IC Block Diagrams – BD Board – – + RFA1 AGCI RF AGC RF PEAK 45 COMPO 46 COMPP 47 ADDC OPN 48 OPO RFO CXA2523AR 1.4 Vp-p 4.4 Vp-p 0.5 Vp-p IC101 MORFI 3 IC500 9 (XTI) MORFO 6 IC151 wk (XBCK) 44 43 42 41 40 39 38 37 USROP RF AGC + – EQ USRC EQ DET + – 1 IC101 1 (I), 2 (J) (MD Play mode) BPF3T RFA2 I J 354 ns 2 IC101 4 (A) (MD Play mode) 1 –1 – –2 – 2 CVB A 1.4 Vp-p – + VC 3 3.
MDS-S50 CAPA+ IN2R IN2F VM2 OUT2F PGND2 OUT2R VM12 OUT1R PGND1 OUT1F VM1 IN1F IN1R VDD BH6511FS CAPA– 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 PREDRIVE 14 16 15 PSB 13 PSB IN3R 12 INTERFACE IN3F 11 VM3 10 PGND3 OUT4R 9 AMP OUT3R 8 VM34 7 PGND4 6 VM4 IN4F 5 AMP OUT3F AMP AMP VDD INTERFACE PREDRIVE 4 IN4R 3 VG MNT1 2 DCHG ADFG F0CNT XLRF CKRF DTRF APCREF LDDR TRDR TFDR DVDD PWM GENERATOR EACH BLOCK MONITOR CONTROL MNT
MDS-S50 – MAIN Board – IC400 LA5643 PH5 1 STBY 2 IC440 LB1641 T.S.D MOTOR DRIVE – VCC 3 ANA5 4 O.C.P + MOTOR DRIVE + – CD1 8 P. DOWN 9 IC480 DELAY CIRCUIT 4 5 6 7 8 FWD.IN REV.IN VCC 1 VCC 2 7 3 CLAMP AC 3.3V 2 NOISE FILTER 6 GND B.BAK – MOTOR DRIVE 1 + GND M5293L 2 5k CD2 11 DELAY CIRCUIT S.
MDS-S50 6-15. IC PIN FUNCTION DESCRIPTION • BD BOARD IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP) Pin No. Pin Name I/O Description 1 I I I-V converted RF signal I input from the optical pick-up block detector 2 J I I-V converted RF signal J input from the optical pick-up block detector 3 VC O Middle point voltage (+1.
MDS-S50 • BD BOARD IC151 CXD2662R (DIGITAL SIGNAL PROCESSOR, DIGITAL SERVO SIGNAL PROCESSOR, EFM/ACIRC ENCODER/DECODER, SHOCK PROOF MEMORY CONTROLLER, ATRAC ENCODER/DECODER) Pin No.
MDS-S50 Pin No.
MDS-S50 Pin No. Pin Name I/O Description 94 SPFD O 95 FGIN I (S) 96 TEST1 I 97 TEST2 I 98 TEST3 I 99 DVSS — Ground terminal (digital system) 100 EFMO O EFM signal output terminal when recording mode Spindle servo drive PWM signal (+) output to the BH6511FS (IC141) Input terminal for the test (fixed at “L”) * I (S) stands for schmitt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O.
MDS-S50 • MAIN BOARD IC1 M30805MG-211GP (SYSTEM CONTROLLER) Pin No.
MDS-S50 Pin No. Pin Name I/O 32 XINT I Interrupt status input from the CXD2662R (IC151) 33 BEEP O Beep sound drive signal output Headphone muting on/off control signal output “L”: muting on, “H”: muting off (Used for the except US and Canadian model) 34 LRCKI O L/R sampling clock signal (44.
MDS-S50 Pin No. Pin Name I/O Description 76 VSS — Ground terminal 77 to 85 A17 to A9 O Address signal output to the flash memory 86 to 89 SEL1 to SEL4 I Not used (open) 90 WP O Writing protect signal output to the flash memory “L” active 91 VCC — Power supply terminal (+3.
MDS-S50 SECTION 7 EXPLODED VIEWS NOTE: • -XX and -X mean standardized parts, so they may have some difference from the original one. • Color Indication of Appearance Parts Example: KNOB, BALANCE (WHITE) . . . (RED) ↑ ↑ Parts Color Cabinet's Color • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded views are not supplied.
MDS-S50 7-2. FRONT PANEL SECTION 58 57 57 59 57 57 not supplied 62 57 61 not supplied 55 56 54 64 65 51 52 Ref. No. Part No.
MDS-S50 7-3. MECHANISM DECK SECTION-1 (MDM-7A) 212 213 211 214 210 219 215 209 not supplied 216 204 205 #2 208 217 205 203 218 206 202 207 220 202 201 Ref. No. Part No. Description * 201 202 203 204 205 4-996-267-01 4-908-618-21 4-227-007-01 4-227-025-01 3-372-761-01 BASE (BU-D) SCREW (BTP) (2X6) GEAR (SB) BELT (LOADING) SCREW (M1.
MDS-S50 7-4. MECHANISM DECK SECTION-2 (MDM-7A) 259 HR901 258 260 256 264 267 257 #1 262 #1 255 259 262 254 253 268 252 253 S102 252 263 M101 266 265 261 253 M102 253 M103 251 252 Ref. No. Part No. Description 251 252 253 254 255 A-4725-471-A 4-908-618-21 3-372-761-01 4-226-993-01 4-227-014-01 BD BOARD, COMPLETE SCREW (BTP) (2X6) SCREW (M1.
MDS-S50 SECTION 8 ELECTRICAL PARTS LIST BD NOTE: • • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. • • -XX and -X mean standardized parts, so they may have some difference from the original one. • RESISTORS All resistors are in ohms. • METAL: Metal-film resistor. METAL OXIDE: Metal oxide-film resistor.
MDS-S50 BD Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark IC151 IC153 8-752-404-64 IC CXD2662R 8-759-671-27 IC MSM51V4400E-70TS-K R109 R110 1-216-845-11 METAL CHIP 1-216-845-11 METAL CHIP 100K 100K 5% 5% 1/16W 1/16W IC171 IC181 IC190 IC195 8-759-096-87 8-759-481-17 8-759-460-72 8-759-640-41 R111 R112 R113 R114 R115 1-216-833-11 1-216-829-11 1-216-833-11 1-216-827-11 1-216-833-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 10K 4.7K 10K 3.
MDS-S50 BD Ref. No. R195 R196 R197 R218 DISPLAY MAIN Part No. Description 1-216-833-11 1-216-833-11 1-216-833-11 1-216-864-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP Remark 10K 10K 10K 0 5% 5% 5% 5% 1/16W 1/16W 1/16W 1/16W Ref. No. Part No. Description R713 R714 R715 R760 R761 1-247-843-11 1-249-425-11 1-249-429-11 1-247-807-31 1-247-807-31 CARBON CARBON CARBON CARBON CARBON 3.3K 4.
MDS-S50 MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C271 C272 1-137-368-11 MYLAR 1-130-471-00 MYLAR 0.0047uF 5% 0.001uF 5% 50V 50V C554 C557 1-164-156-11 CERAMIC CHIP 1-164-156-11 CERAMIC CHIP 0.1uF 0.1uF C276 C277 C311 C312 C351 1-128-551-11 1-164-315-11 1-164-156-11 1-126-916-11 1-104-665-11 ELECT CERAMIC CHIP CERAMIC CHIP ELECT ELECT 22uF 470PF 0.1uF 1000uF 100uF 25V 50V 25V 6.3V 25V C558 1-164-156-11 CERAMIC CHIP 0.
MDS-S50 MAIN Ref. No. Part No. Description Remark Ref. No. Part No.
MDS-S50 MAIN Ref. No. Part No. Description Remark R265 R266 R271 1-218-724-11 METAL CHIP 1-218-724-11 METAL CHIP 1-216-823-11 METAL CHIP 22K 22K 1.5K 0.5% 0.5% 5% 1/16W 1/16W 1/16W R272 R276 R277 R278 R280 1-216-823-11 1-216-819-11 1-216-845-11 1-216-815-11 1-216-833-11 METAL CHIP METAL CHIP METAL CHIP METAL CHIP METAL CHIP 1.
MDS-S50 POWER SW Ref. No. PT VOL SEL Part No. Description R775 R791 R792 R798 1-249-403-11 1-249-399-11 1-249-399-11 1-249-427-11 CARBON CARBON CARBON CARBON 68 33 33 6.8K Remark R799 1-249-427-11 CARBON 6.8K 5% 1/4W 5% 1/4W 5% 1/4W 5% 1/4W (EXCEPT US, CND) 5% 1/4W (EXCEPT US, CND) Ref. No. Part No.
MDS-S50 Ref. No. Part No. Description Remark Ref. No. Part No.
MDS-S50 REVISION HISTORY Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. Ver. 1.0 Date 2001.