User's Manual

January
2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
6 Hardware design
SPBT3.0DP1 module with DP command embedded FW supports UART, I2C and GPIO hardware interfaces.
Note:
o All unused pins should be left floating; do not ground.
o All GND pins must be well grounded.
o The area around the module should be free of any ground planes, power planes, trace routings,
or metal for 6 mm from the module antenna position, in all directions.
o Traces should not be routed underneath the module.
6.1 Module reflow soldering
The SPBT3.0DP1 is a high temperature strength surface mount Bluetooth® module supplied on an 24 pin,
6-layer PCB. The final assembly recommended reflow profiles are indicated here below.
Soldering phase must be executed with care: in order to avoid undesired melting phenomenon, particular
attention must be paid to the set-up of the peak temperature.
Figure 5: Recommend land pattern top view