Specifications

Table Of Contents

Cinterion

ALAS66A Hardware Interface Overview

1.2 Key Features at a Glance

 ALAS66A_HIO_v01.000a 2019-02-26

Confidential / Released

Page 7 of 51

1.2 Key Features at a Glance

Feature Implementation

General

Frequency bands Note: Not all of the frequency bands (and 3GPP technologies) mentioned

throughout this document are supported by every ALAS66A products vari-

ant. Please refer to Section 1.2.1 for an overview of the frequency bands

supported by each ALAS66A product variant.

GSM class Small MS

Output power

(according to Release 99)

GSM/GPRS/UMTS:

Class 4 (+33dBm ±2dB) for EGSM850 and EGSM900

Class 1 (+30dBm ±2dB) for GSM1800 and GSM1900

Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK and GSM 900 8-PSK

Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK and GSM 1900 8-PSK

Class 3 (+24dBm +1/-3dB) for all supported WCDMA FDD bands

Output power

(according to Release 4)

TD-SCDMA:

Class 2 (+24dBm +1/-3dB) for TD-SCDMA 1900, TD-SCDMA Bd39 and

TD-SCDMA 2000, TD-SCDMA Bd34

Output power

(according to Release 8)

LTE (FDD):

Class 3 (+23dBm +-2dB) for all supported LTE FDD bands

LTE (TDD):

Class 3 (+23dBm +-2dB) for all supported LTE TDD bands

Power supply 3.3V <

BATT+

< 4.2V

Operating temperature

(board temperature)

Normal operation: -30°C to +85°C

Restricted operation: -40°C to +95°C

Physical Dimensions: 48mm x 36mm x 3mm

Weight: approx. 10.5g

RoHS All hardware components fully compliant with EU RoHS Directive