Toshiba Personal Computer Satellite R10 Maintenance Manual TOSHIBA CORPORATION File Number 960-509
Copyright © 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed, with respect to the use of the information contained herein. Toshiba Satellite R10 Maintenance Manual First edition January 2005 Disclaimer This manual has been validated and reviewed for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Satellite R10, referred to as Satellite R10 in this manual. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the Satellite R10 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the remova l and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.3 Optical Drive............................................................................................................ 1-12 1.4 Keyboard ......................................................
Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-4 3.3 Setting of the hardware configuration........................................................................ 3-8 3.4 Heatrun Test ......................................................................................
Chapter 4 Replacement Procedures 4.1 Overview .............................................................................................................. 4-1 4.2 Battery pack ......................................................................................................... 4-8 4.3 PC card/SD card................................................................................................. 4-10 4.4 Memory module ...........................................................................
4.31 Fluorescent Lamp ............................................................................................... 4-69 Appendices Appendix A Handling the LCD Module ........................................................................ A-1 Appendix B Board Layout ...............................................................................................B-1 Appendix C Pin Assignment ..........................................................................................
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Chapter 1 Hardware Overview
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1 Hardware Overview Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.3 Optical Drive............................................................................................................ 1-12 1.3.1 DVD-ROM Drive ......................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer..................................................................................... 1-5 Figure 1-2 System units configuration ............................................................................ 1-5 Figure 1-3 System Block Diagram .................................................................................. 1-6 Figure 1-4 2.5-inch HDD.............................................................................................
1 Hardware Overview Table 1-17 RTC battery charging/data preservation time .............................................. 1-31 Table 1-18 AC adapter specifications ............................................................................
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1.1 Features 1 1 Hardware Overview Features 1.1 Features The Satellite R10 is an ultra thin and lightweight tablet PC realizing cable- less environment on a table by wireless function with a Pentium- M/Celeron-M processor realizing high performance. ? Microprocessor Microprocessor that is used will be different of the model. ? Intel ® Mobile Pentium ®-M Pentium-M 1.60GHz (Processor Number ; 725) 1.70GHz (Processor Number ; 735) 1.80GHz (Processor Number ; 745) 2.
1 Hardware Overview 1.1 Features ? Selectable Bay Supporting hotswap with DVD-ROM drive, DVD-ROM & CD-R/RW drive, DVD Super Multi drive and 2nd HDD adapter. ? USB FDD 3.5 inch USB FDD supports 720KB/1.44MB formats. ? Display Display swivels automatically 0/90/180/270 degrees by display driver. LCD and CRT can be displayed at the same time. LCD Built- in 14.1 inch, 16M colors, XGA (1,024? 768 dots), thin type low temperature poly-silicon TFT color display.
1.1 Features 1 Hardware Overview ? USB (Universal Serial Bus) Three USB ports are usable. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported. ? PC card slot The PC card slot (PCMCIA) accommodates one 5mm Type II card. (Based on PC Card Standard, supporting CardBus) ? SD card slot A SD Card Slot can accommodate Secure Digital flash memory cards with various capacities. Supporting memory card and I/O card.
1 Hardware Overview 1.1 Features ? Wireless LAN Wireless LAN Card can be equipped with mini-PCI slot. Based on IEEE802.11b/g, a/b/g with 2.45GHz/5.0GHz Dual-band antenna. ? i.LINK (IEEE1394) This port enables high-speed data transfer directly from external devices such as digital video cameras. ? Docking port Advanced Port Replicator III can be connected through docking port on the bottom.
1.1 Features 1 Hardware Overview Figure 1-1 shows the front of the computer and Figure 1-2 shows the system units configuration.
1 Hardware Overview 1.1 Features Figure 1-3 shows the system block diagram.
1.1 Features 1 Hardware Overview The PC contains the following components. ? CPU ? Intel ® Mobile Pentium ®-M Processor 1.60GHz (Processor Number ; 725) 1.70GHz (Processor Number ; 735) 1.80GHz (Processor Number ; 745) 2.00GHz (Processor Number ; 755) Core voltage : 1.05V FSB : 400MHz L1 cache : 64KB [32KB (Code) + 32KB (Data)] L2 cache : 2MB Support : Enhanced Intel® SpeedStep technology ? Intel ® Mobile Celeron ®-M Processor 1.30GHz (Processor Number ; 350) 1.
1 Hardware Overview 1.1 Features ? PCI chipset This gate array incorporates the following elements and functions Intel 855GME (Montara-GM+) (North Bridge ) - Dothan Processor System Bus Support - DRAM Controller supporting DDR333/DDR266, 2GB max - Accelerated Graphics Port Interface: adheres to AGP2.0, AGP? 4 mode - Hub Link Interface - 732-ball 37.5? 37.5 mm FC-BGA package Intel ICH4-M (South Bridge) - Hub Link Interface - PCI Rev2.
1.1 Features 1 Hardware Overview ? Batteries The main battery is a detachable lithium- ion main battery (10.8V, 4700mAh, 6 cell) and the RTC battery is a lithium ion battery (2.4V-16mAh). ? Modem controller Supported by MDC. Using of the secondary AC97 Line ? LAN controller (ICH4-M Kinnerth 82562EP) Controls LAN and supports 100BASE-TX (Fast Ethernet)/10BASE-T (Ethernet).
1 Hardware Overview 1.2 1.2 2.5-inch Hard Disk Drive 2.5-inch Hard Disk Drive A compact, high-capacity HDD with a height of 9.5mm contains a 2.5- inch magnetic disk and magnetic heads. Figure 1-4 shows a view of the 2.5- inch HDD and Tables 1-1 and 1-2 list the specifications. Figure 1-4 2.5-inch HDD Table 1-1 2.5-inch HDD dimensions Standard value Parameter TOSHIBA HDD2188BZE02 TOSHIBA HDD2189BZE02 TOSHIBA HDD2190BZE02 Width (mm) 69.85 Outline Height (mm) 9.
1.2 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-2 2.5-inch HDD Specifications Specification Parameter Storage size (formatted) TOSHIBA HDD2190BZE02 TOSHIBA HDD2189BZE02 TOSHIBA HDD2188BZE02 TOSHIBA HDD2D08BZE02 40GB 60GB 80GB 100GB Speed (RPM) Data transfer speed (Mbits/s) Interface transfer rate (MB/s) Storage density(Kbpi) Track density (Ktpi) 4,200 5,400 175.0-341.7 230.6-445.9 100 (Ultra DMA mode) 735 - 735( max) 96 88.
1 Hardware Overview 1.3 1.3 Optical Drive Optical Drive 1.3.1 DVD-ROM Drive The DVD-ROM drive accommodates either 12 cm (4.72- inch) or 8 cm (3.15- inch) CD/DVDROM and CD-R/RW and DVD-RAM (read-only). The DVD-ROM drive is shown in Figure 1-5. The dimensions and specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-3, Table 1-4.
1.3 Optical Drive 1 Hardware Overview Table 1-4 DVD-ROM drive specifications (1/3) Drive Specification Parameter TSST (G8CC0000R410) Read DVD-ROM(Single-L) MAX 8x(CAV) [MAX 10820KB/s] DVD-ROM(Double-L) MAX 6x(CAV) [MAX 8112KB/s] DVD-VIDEO(CSS) MAX 4x(CAV) [MAX 5408KB/s] DVD-R/RW MAX 4x(CAV) [MAX 5408KB/s] DVD-RAM(Ver1.0) MAX 2x(ZCLV ) [MAX 2704KB/s] DVD-RAM(Ver2.1) MAX 1x(ZCLV ) [MAX 2704KB/s] CD(Mode1) MAX 5.7x(PCAV) [MAX 855KB/s] MAX 24x(CAV) [MAX 3600KB/s] CD(Mode2) MAX 5.7x(P CAV) [MAX 975.
1 Hardware Overview 1.3 Optical Drive Table 1-4 DVD-ROM drive specifications (2/3) Drive Specification Parameter TSST (G8CC0002B410) Read DVD-ROM(Single-L) MAX 8x(CAV) [MAX 10816KB/s] DVD-ROM(Double-L) MAX 6x(CAV) [MAX 8112KB/s] DVD-R/-RW MAX 4x(CAV) [MAX 5408KB/s] DVD+R/+RW MAX 4x(CAV) [MAX 5408KB/s] DVD-RAM(Ver2.
1.3 Optical Drive 1 Hardware Overview Table 1-4 DVD-ROM drive specifications (3/3) Drive Specification Parameter TEAC (G8CC0002E410) Read DVD-ROM MAX 8x (CAV) [MAX 4594KB/s] DVD-VIDEO MAX 4x(CAV) [MAX 2297KB/s] DVD-R/RW MAX 8x(CAV) [MAX 4594KB/s] DVD-RAM(4.7GB) MAX 5x(CAV) [MAX 3246KB/s] DVD-RAM(2.6GB) MAX 2.5x(CAV) [MAX 1626KB/s] CD(Mode1) MAX 24x(CAV) [MAX 5137KB/s] CD(Mode2) MAX 20x(CAV) [MAX 4280KB/s] CD-RW MAX 24x(CLV ) [MAX 5137KB/s] ATAPI interface (MB/s) PIO mode16.
1 Hardware Overview 1.3 Optical Drive 1.3.2 DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15inch) CD/DVD-ROM and CD-R/RW. The DVD-ROM & CD-R/RW drive is shown in Figure 1-6. The dimensions and specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-5, Table 1-6.
1.3 Optical Drive 1 Hardware Overview Table 1-6 DVD-ROM & CD-R/RW drive specifications (1/2) Drive Specification Parameter PCC (G8CC0001X411) Data transfer speed Access time (ms) Read DVD-ROM MAX 8x (CAV) [MAX 10800 KB/s] CD-ROM MAX 24x(CAV) [MAX 3600 KB/s] Write CD-R 4x/8x(CLV), 16x(PCAV), MAX24x(CAV) CD-RW 4x(CLV) High Speed CD-RW 4x/8x/10x(CLV) Ultra Speed CD-RW 10x(CLV), MAX24x(CAV) ATAPI interface (MB/s) PIO mode16.6 MB/s PIO MODE4 supported DMA mode16.
1 Hardware Overview 1.3 Optical Drive Table 1-6 DVD-ROM & CD-R/RW drive specifications (2/2) Drive Specification Parameter TEAC (G8CC0001Y411) Data transfer speed Access time (ms) Read DVD-ROM MAX 8x (CAV) [MAX 10800 KB/s] CD-ROM MAX 24x(CAV) [MAX 3600 KB/s] Write CD-R 4x/8x(CLV), 16x(PCAV), MAX 24x(CAV) CD-RW 4x(CLV) High Speed CD-RW 4x/8x/10x(CLV) Ultra Speed CD-RW 10x(CLV), MAX 24x(CAV) ATAPI interface (MB/s) PIO mode16.6 MB/s PIO MODE4 supported DMA mode16.
1.3 Optical Drive 1 Hardware Overview 1.3.3 DVD Super Multi Drive The DVD Super Multi drive accommodates either 12 cm (4.72- inch) or 8 cm (3.15- inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM. The DVD Super Multi drive is shown in Figure 1-7. The dimensions and specifications of the DVD Super Multi drive are described in Table 1-7, Table 1-8.
1 Hardware Overview 1.3 Optical Drive Table 1-8 DVD Super Multi drive specifications Drive Specification Parameter PCC (G8CC00021410) Data transfer speed Access time (ms) Read(KB/s) DVD-ROM MAX 8x (CAV) [MAX 10800 KB/s] CD-ROM MAX 24x(CAV) [MAX 3600 KB/s] Write CD-R 4x/8x (CLV), 24x (ZCLV) CD-RW 4x (CLV) High Speed CD-RW 4x/8x/10x (CLV) Ultra Speed CD-RW 10x (CLV) DVD-R 1x/2x (CLV), MAX 8x (CLV) DVD-RW 1x/2x (CLV), MAX 4x (CLV) DVD+R 2.4x (CLV), MAX 8x (CLV) DVD+RW 2.
1.3 Optical Drive 1 Hardware Overview 1.3.4 DVD Super Multi Drive (Double-layer) The DVD Super Multi drive (Double- layer) accommodates either 12 cm (4.72- inch) or 8 cm (3.15-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW, DVD-RAM and DVD+R (Doublelayer). The DVD Super Multi drive (Double- layer) is shown in Figure 1-8. The dimensions and specifications of the DVD Super Multi drive (Double- layer) are described in Table 1-9, Table 1-10.
1 Hardware Overview 1.3 Optical Drive Table 1-10 DVD Super Multi drive (Double-layer) specifications Drive Specification Parameter PCC (G8CC00021411) Data transfer speed Access time (ms) Read(KB/s) DVD-ROM MAX 8x (CAV) [MAX 10800 KB/s] CD-ROM MAX 24x(CAV) [MAX 3600 KB/s] Write CD-R 4x/8x(CLV), 24x (ZCLV) CD-RW 4x(CLV) High Speed CD-RW 4x/8x/10x(CLV) Ultra Speed CD-RW 10x(CLV) DVD-R 1x/2x(CLV), MAX 8x(CLV) DVD-RW 1x/2x(CLV), MAX 4x(CLV) DVD+R 2.4x(CLV), MAX 8x(CLV) DVD+R Double Layer 2.
1.4 Keyboard 1.4 1 Hardware Overview Keyboard The keyboard is mounted 85(US)/86(UK) keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure1-9 is a view of the keyboard. See Appendix E about a layout of the keyboard.
1 Hardware Overview 1.5 1.5 TFT Color Display TFT Color Display The TFT color display consists of a LCD module and FL inverter board. 1.5.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display images and characters of 16M colors with 1024x768 resolution. Figure 1-10 shows a view of the LCD module and Table 1-11 lists the specifications. Figure 1-10 LCD module Table 1-11 LCD module specifications (14.
1.5 TFT Color Display 1 Hardware Overview 1.5.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-12 lists the FL inverter board specifications. Table 1-12 FL inverter board specifications Item Specifications G71C00011110 Input Output Voltage (V) 5 (DC) Power (W) 7 Voltage (V) 750 (r.m.s) Power 5.0W / 7VA Current (mA) (f=70KHz) 6.00 (r.m.
1 Hardware Overview 1.6 1.6 Power Supply Power Supply The power supply supplies 27 different voltages to the system board. The power supply microcontroller has the following functions. 1. Judges that the DC power supply (AC adapter) is connected to the computer. 2. Detects DC output and circuit malfunctions. 3. Controls the battery icon, and DC IN icon. 4. Turns the battery charging system on and off and detects a fully charged battery. 5. Turns the power supply on and off. 6.
1.6 Power Supply 1 Hardware Overview Table 1-13 lists the power supply output specifications. Table 1-13 Power supply output specifications (1/2) Power supply ( Yes/No) Name Voltage [V] Power OFF (Suspend mode) Power OFF (Boot mode) No battery Object PPV 1.340 0.748 No No No CPU PTV 1.05 No No No CPU, GMCH, ICH4-M 1R25-B1V 1.25 Yes No No DDR-SDRAM Termination 1R35-P1V 1.35 No No No GMCH 1R5-S1V 1.5 Yes Yes No ICH4-M 1R5-P1V 1.
1 Hardware Overview 1.6 Power Supply Table 1-13 Power supply output specifications (2/2) Power supply ( Yes/No) Name FANVCC DSKDC 1-28 Voltage [V] Power OFF (Suspend mode) Power OFF (Boot mode) No battery Object 2.7-5 No No No FAN No No No Dock 10.0 -15.0 MCV 5 Yes Yes No PSC M5V 5 Yes Yes No System LED, Dock R3V 2.0 3.
1.7 Batteries 1.7 1 Hardware Overview Batteries The PC has the following two batteries. ? Main battery ? Real time clock (RTC) battery Table 1-14 lists the specifications for these two batteries. Table 1-14 Battery specifications Battery Name Battery Element Output Voltage Capacity Lithium ion (6 cell) 10.8 V 4,700 mAh Nickel hydrogen 2.4V 16mAh G71C0004S110 Main battery G71C0004S210 Real time clock (RTC) battery P71035009115 1.7.
1 Hardware Overview 1.7 Batteries 1.7.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adapter and battery are connected to the computer. ? Quick Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is tur ned off or in standby mode. Table 1-15 lists the main battery charging time.
1.7 Batteries 1 Hardware Overview 1.7.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-17 lists the battery charging time and data preservation times.
1 Hardware Overview 1.8 1.8 AC Adapter AC Adapter The AC adapter is also used to charge the battery. Table 1-18 lists the AC adapter specifications. Table 1-18 AC adapter specifications Specification Parameter G71C0002S310 Power 60W Input rated voltage 100V/240V Input frequency range 50Hz/60Hz Input current 1.5A or less Output rated voltage Output current 1-32 G71C0004A210 DC 15V 0A to 4.
Chapter 2 Troubleshooting Procedures
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2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-2 2.3 Power Supply Troubleshooting.................................................................................. 2-6 2.4 2.5 2.6 2.7 Procedure 1 Power Supply Icon Check............................
2 Troubleshooting Procedures 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.16 2-iv Display Troubleshooting.......................................................................................... 2-42 Procedure 1 External Monitor Check....................................................... 2-42 Procedure 2 Diagnostic Test Program Execution Check ......................... 2-42 Procedure 3 Connector and Cable Check.................................................
2 Troubleshooting Procedures Procedure 3 Replacement Check.............................................................. 2-54 Figures Figure 2-1 Troubleshooting flowchart ............................................................................. 2-3 Figure 2-2 A set of tool for debug port test ................................................................... 2-20 Tables Table 2-1 Battery icon....................................................................................................
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2 Troubleshooting 2.1 Troubleshooting 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. 2. 3. 4. 5. 6. 7. Power supply System Board 3.5" USB FDD 2.5" HDD Keyboard Display Touch pad 8. Optical drive 9. Modem 10. LAN 11. Sound 12. SD card slot 13. Tablet pen 14.
2.2 Troubleshooting Flowchart 2.2 2 Troubleshooting Procedures Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which FRU malfunctions. Before going through the flowchart steps, check the following: ? Make sure that Toshiba Windows® XP Tablet PC Edition is installed on the hard disk. Other operating systems can cause the computer malfunction. ? Make sure all optional equipment is removed from the computer.
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2 Troubleshooting 2.2 Troubleshooting Flowchart If the diagnostics program cannot detect an error, the problem may occur intermittent ly. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), and perform the appropriate troubleshooting procedures as follows: 1.
2.3 Power Supply Troubleshooting 2.3 2 Troubleshooting Procedures Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2 Troubleshooting Procedure 1 2.3 Power Supply Troubleshooting Power Supply Icon Check The following two icons indicate the power supply status: ? Battery icon ? DC IN icon The power supply controller uses the power supply status with the Battery icon and the DC IN icon as listed in the tables below. Table 2-1 Battery icon Battery icon Power supply status Lights orange Battery is charged and the external DC is input. It has no relation with ON/OFF of the system power.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures When icons are blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter and cut off the power supply to the computer by force. 2. Re-attach the battery pack and the AC adapter. If icons are still blinking after the operation above, check the followings: Check 1 If the DC IN icon blinks orange, go to Procedure 2. Check 2 If the DC IN icon does not light, go to Procedure 3.
2 Troubleshooting Procedure 2 2.3 Power Supply Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. ? Start ? Error code (8 bit) “1” “0” Interval between data bits The error code begins with LSB (Least Significant bit) Example: Error code 11h (Error codes are given in hexadecimal format.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures ? Main Battery Error code Meaning 20h Overvoltage is detected. (This is not supported.) 21h Main battery charge current is over 7.00A. 22h Main battery discharge current is over 0.5A when there is no load. 23h Main battery charge current is over 3.9A when AC adapter is not connected. 24h Abnormal current has been sensed 0[A]. 25h Main battery charge current is over 0.3A.
2 Troubleshooting 2.3 Power Supply Troubleshooting ? 1R5-C1V output (P61) Error code Meaning 50h 1R5-C1V voltage is over 1.80V when the computer is powered on/off. 51h 1R5-C1V voltage is 1.275V or less when the computer is powered on. 52h 1R5-C1V voltage is 1.275V or less when the computer is booting up. 53h 1R5-C1V voltage is 1.275V or less when the computer is suspended. 54h 1R5-C1V voltage is abnormal during shutdown (CV support) 55h 1R5-C1V voltage is 1.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures ? PTV output (P64) Error code Meaning 80h PTV voltage is over 1.26V when the computer is powered on/off. 81h PTV voltage is 0.89V or less when the computer is powered on. 82h PTV voltage is 0.89V or less when the computer is booting up. 83h PTV voltage is 0.89V or more when the computer is powered off. 84h PTV voltage is 0.89V or less when the computer is suspended. ? E5V output (P65) Error code Meaning 90h E5V voltage is over 6.
2 Troubleshooting 2.3 Power Supply Troubleshooting ? PMV output (P64) Error code Meaning C0h PMV voltage is over 1.62V when the computer is powered on. C1h PMV voltage is 1.02V or less when the computer is powered on. C2h PMV voltage is 1.02V or less when the computer is booting up. C3h PMV voltage is 1.02V or more when the computer is powered off. C4h PMV voltage is 1.02V or less while the computer is suspended.
2.3 Power Supply Troubleshooting Check 3 2 Troubleshooting Procedures In the case of error code 21h: ? Go to Procedure 3. Check 4 2-14 For any other errors, go to Procedure 5.
2 Troubleshooting Procedure 3 2.3 Power Supply Troubleshooting Connection Check The wiring diagram related to the power supply is sho wn below: Any of the connectors may be disconnected. Perform starting from Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If these cables are connected correctly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones.
2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4. Check 1 Replace the AC adapter with a new one. If power is not supplied properly to the PC, perform Check 2. Check 2 Replace the system board with a new one.
2 Troubleshooting 2.4 2.4 System Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board is defective. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. ? If an error message is shown on the display, perform Check 1. ? If there is no error message, go to Procedure 2. ? If MS-DOS or Windows XP Tablet PC Edition is properly loaded, go to Procedure 4.
2 Troubleshooting Check 3 2.4 System Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (24) or (25) is displayed, go to Procedure 5. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures in Section 2.7. If error message (19), (20) or (21) is displayed, go to the 2.5” HDD Troubleshooting Procedures in Section 2.6.
2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Debug Port (D port) Check on Boot Mode Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows; 1. Connect the debug test cable to the connector CN3400 of the system board. For disassembling the PC to connect the test cable, refer to Chapter 4. 2.
2 Troubleshooting 2.4 System Board Troubleshooting 5. Execute GETDPORT.COM in the text menu in CPU REAL mode. (Insert the FD for starting D port into FDD and input “FD starting drive:>dport”.) The D port status is displayed in the following form; 6. When the D port status is FFFFh (normal status), go to Procedure 3. 7. When the D port status falls into any status in Table 2-3, execute Check 1.
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2 Troubleshooting 2.4 System Board Troubleshooting Table 2-3 Debug port (Boot mode) error status (2/9) D port status B4h/B5h Inspection items Details Saving key scan code Setting TASK_1ms_TSC Controlling fan Initializing sound items (for BEEP) Enabling system speaker Releasing mute Making the volume max.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Debug port (Boot mode) error status (3/9) D port status (00h) Inspection items Initialization of H/W (before DRAM recognition) Details Initialization of MCHM Initialization of ICH4M.D31.Func0 Initialization of ICH4M.D31.Func1 Initialization of USB.Func0,1,2,7 Initialization of ICH4M.D31.Func3 Initialization of ICH4M.D31.
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Debug port (Boot mode) error status (5/9) D port status 05h Inspection items Initialization of devices which need initialization before PCI bus initialization Details PIT test (at Cold boot only) and initialization Setting of test pattern to channel 0 of PIT#0 Check whether the set test pattern can be read.
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2 Troubleshooting 2.4 System Board Troubleshooting Check 1 If the D port status error code F119h is displayed, go to the 3.5” USB FDD Troubleshooting Procedures in Section 2.5 or the 2.5” HDD Troubleshooting Procedures in Section 2.6. Check 2 If any other D port status error code is displayed, perform Procedure 3.
2.4 System Board Troubleshooting Procedure 3 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. USB Floppy Disk test 6. ASYNC test 7. Hard Disk test 8. Real Timer test 9. NDP test 10. Expansion test 11. Wireless LAN test 12.
2 Troubleshooting 2.5 USB 3.5” FDD Troubleshooting 2 2.5 USB 3.5” FDD Troubleshooting This section describes how to determine if the USB 3.5” FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.5 USB 3.5” FDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-4.
2 Troubleshooting Procedure 3 2.5 USB 3.5” FDD Troubleshooting Connector Check and Replacement Check The USB FDD connector may be disconnected from the connector on the system board. Check visually that the connector is connected firmly. Check 1 Make sure the USB FDD cable is firmly connected to the CN4611 (port 3) or CN4610 (port 0) of the system board, or CN4620 (port 5) of the CN board. If any of the connections are loose, reconnect firmly and repeat Procedure 2.
2.6 2.5” HDD Troubleshooting 2.6 2 Troubleshooting Procedures 2.5” HDD Troubleshooting This section describes how to determine if the 2.5” HDD is functioning properly. Perform the steps below starting with Procedure 1 and cont inuing with the other procedures as required. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the 2.
2 Troubleshooting Procedure 2 2.6 2.5” HDD Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure of no floppy disk in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2.6 2.5” HDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Format Check The computer’s 2.5" HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the 2.5" HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format the 2.5" HDD using MS-DOS FORMAT command. Type as FORMAT C:/S/U. If the 2.
2 Troubleshooting Procedure 4 2.6 2.5” HDD Troubleshooting Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-5.
2.6 2.5” HDD Troubleshooting Procedure 5 2 Troubleshooting Procedures Connector Check and Replacement Check The HDD is connected to the HD board and the HD board is connected to the connector CN1800 of the system board. The connecting portions may be loose.
2 Troubleshooting 2.7 2.7 Keyboard Troubleshooting Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test in the Diagnostic Program.
2.8 Display Troubleshooting 2.8 2 Troubleshooting Procedures Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedure 3 2.8 Display Troubleshooting Connector and Cable Check The LCD module is connected to the system board through the LCD/FL cable. Also FL inverter is connected the system board through the LCD/FL cable. The cable may be disconnected from the board or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. If the connection is loose, reconnect the cable firmly and repeat Procedure 2. If there is still an error, go to Procedure 4.
2.8 Display Troubleshooting 2 Troubleshooting Procedures Check 5 The FL tube may be damaged. Replace it with a new one and repeat Procedure 4. If there is still an error, go to Check 6. Check 6 The display controller of the system board may be damaged. Replace the system board with a new one.
2 Troubleshooting 2.9 2.9 Touch Pad Troubleshooting Touch Pad Troubleshooting To determine whether the Touch Pad is faulty or not, perform the following procedures: Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the test for touch pad in ONLY ONE test in the Diagnostic Program.
2.10 Selectable bay (optical drive) Troubleshooting 2 Troubleshooting Procedures 2.10 Selectable bay (optical drive) Troubleshooting The Selectable bay can be installed in this model and the Selectable bay optical drive is installed as standard. Here explains the troubleshooting for the optical drive. To check if the optical drive is defective or not, follow the troubleshooting procedures below as instructed.
2 Troubleshooting 2.11 Modem Troubleshooting 2.11 Modem Troubleshooting To check if the modem is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Modem test program available as part of the maintenance test program. This program checks the modem.
2.12 LAN Troubleshooting 2 Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check To check the LAN function, execute the Sound/LAN/modem test program subtest 04 (LAN test). See Chapter 3 for information on how to perform the test.
2 Troubleshooting 2.13 Sound Troubleshooting 2.13 Sound Troubleshooting To check if the sound function is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound test program available as part of the maintenance test program. See Chapter 3 for information on how to perform the test.
2.14 SD Card Slot Troubleshooting 2 Troubleshooting Procedures 2.14 SD Card Slot Troubleshooting To check if the SD card slot is good or no good, follow the troubleshooting procedures below as instructed. Procedure 1: Check on Windows XP Tablet PC Edition Procedure 2: Connector/Replacement Check Procedure 1 Check on Windows XP Tablet PC Edition Insert an SD card into the slot.
2 Troubleshooting 2.15 Tablet Pen Troubleshooting 2.15 Tablet Pen Troubleshooting To check if the Tablet Pen is defective or not, follow the troubleshooting procedures below as instructed. CAUTION: Use the Tablet Pen supplied to this model.
2.15 Tablet Pen Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector/Replacement Check The Digitizer and LCD are connected to the system board as below. Check 1 The Digitizer might be disconnected. Make sure the Digitizer is connected to the CN9540 on the system board. If there is still an error, go to Check 2. Check 2 The LCD might be disconnected. Make sure the LCD is connected to the CN5501 on the system board. If there is still an error, go to Check 3.
2 Troubleshooting 2.16 Wireless LAN Troubleshooting 2.16 Wireless LAN Troubleshooting To check if the Wireless LAN is defective or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting- Receiving Check Procedure 2: Antennas' Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Make sure the wireless communication switch on the computer is turned ON. If it is not, turn ON.
2.16 Wireless LAN Troubleshooting 2 Troubleshooting Procedures Procedure 2 Antennas' Connection Check The wireless LAN function wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, and perform the following checks: Check 1 The wireless LAN board and the system board may be disconnected. Make sure the wireless LAN board is firmly connected to the CN9991 of the system board.
Chapter 3 Tests and Diagnostics
3-ii Satellite R10 Maintenance Manual (960-509)
Chapter 3 Contents 3.1 3.2 The Diagnostic Test...................................................................................................... 3-1 3.1.1 Diagnostics menu.................................................................................... 3-1 3.1.2 H/W(hardware) initial information setting tool.......................................... 3-3 3.1.3 Heatrun test program.............................................................................. 3-3 Executing the Diagnostic Test ..
3.21 3.22 3.23 3.24 3.25 Head Cleaning ........................................................................................................... 3-48 3.21.1 Function Description............................................................................. 3-48 3.21.2 Operations ........................................................................................... 3-48 Log Utilities................................................................................................................
3.31.2 Accessing the SETUP Program.............................................................
Figures Figure 3-1 Name and positions of each side..................................................................... 3-45 Tables Table 3-1 Subtest names................................................................................................ 3-12 Table 3-2 Error codes and error status names................................................................. 3-35 Table 3-3 Hard disk controller status register contents ....................................................
Satellite R10 Maintenance Manual (960-509) 3-vii
3 Tests and Diagnostics 3.1 The Diagnostic Test 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
3.1 The Diagnostic Test ? ? ? ? ? ? 3 Tests and Diagnostics ASYNC TEST HARD DISK TEST REAL TIMER TEST NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST Other tests are: ? Wireless LAN TEST (Wireless LAN test disk) ? LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 test disk) ? Sound TEST (Sound test disk) You will need the following equipment to perform some of the Diagnostic test programs.
3 Tests and Diagnostics 3.1 The Diagnostic Test 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. ? ? ? ? ? ? Initial configuration Region write DMI information save DMI information recovery System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs. ? The Diagnostics Disk (Main T&D) 3.1.
3.2 Executing the Diagnostic Test 3.2 3 Tests and Diagnostics Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive. 2. Release the lock of the power switch and turn on the computer with pressing the F12. Select the FDD in the display for selecting booting unit. Then, press Enter and the following menu appears. Microsoft Windows XX Startup Menu --------------------------------------------------------1.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test 3.2.1 Diagnostics menu (T&D) After pressing 1 and Enter in the startup menu, the following menu appears. TOSHIBA personal computer Common DIAGNOSTICS Version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTICS MENU : 1 2 3 4 5 6 7 8 9 – - DIAGNOSTIC TEST ONLY ONE TEST HEAD CLEANING LOG UTILITIES RUNNING TEST FDD UTILITIES SYSTEM CONFIGURATION EXIT TO MS-DOS NOTE: To exit the DIAGNOSTIC TEST MENU, press the Esc key.
3.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Functions 1 through 12 are the Diagnostic Tests. Function 88 sets the floppy disk drive and hard disk drive error retry count (0-255). To exit the submenu of the Diagnostic Test and returns to the Diagnostics Menu, set the highlight bar to function 99 and press Enter. Select the option you want to execute and press Enter.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test For more details on this test, refer to the section 3.3. 3.2.3 Heatrun test program Heatrun test starts executing the same subtest as 3.23 RUNNING TEST. For more details on this test, refer to the section 3.4.
3.3 Setting of the hardware configuration 3.3 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, select 2-Repair initial config test in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of four subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Initial configuration This subtest executes the following items and shows their contents in the display.
3 Tests and Diagnostics 3.3 Setting of the hardware configuration Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) Setting of DVD region code (Yes/No) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter. Following message appears in the display. Press any key, then return to the H/W initial information setting tool menu.
3.3 Setting of the hardware configuration Subtest 04 3 Tests and Diagnostics DMI information recovery NOTE: 1. After replacing the system board, be sure to execute this subtest and copy the DMI information to a new system board. 2. Since the data of UUID is updated every time when this subtest, DMI information recovery, is done, the saved UUID data is not written This is one of tools to copy the DMI information to a new PCB after replacing.
3 Tests and Diagnostics 3.4 3.4 Heatrun Test Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu, press Enter. After selecting the test, the same subtests as 3.23 RUNNING TEST are executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
3.5 Subtest Names 3.5 3 Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 1 2 SYSTEM MEMORY Subtest No.
3 Tests and Diagnostics 3.5 Subtest Names Table 3-1 Subtest names (2/2) No. 6 7 8 9 Test Name PRINTER ASYNC HARD DISK REAL TIMER Subtest No.
3.6 System Test 3.6 3 Tests and Diagnostics System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM Checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
3 Tests and Diagnostics 3.6 System Test If the CPU supports Gerserville (SpeedStep), this Subtest checks that the CPU operating clock speed can be changed. Subtest 04 Quick Charge This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.
3.7 Memory Test 3.7 3 Tests and Diagnostics Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected Mode NOTE: The CONFIG.
3 Tests and Diagnostics 3.8 3.8 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
3.9 Display Test 3.9 3 Tests and Diagnostics Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAh and 55h) to the video RAM. The data is read and compared to the original data.
3 Tests and Diagnostics Subtest 04 3.9 Display Test Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 64K] 640*480 16M] 800*600 64K] 800*600 16M] 1024*768 64K] 1024*768 16M] The display below appears on the screen when this subtest is executed.
3.9 Display Test Subtest 06 3 Tests and Diagnostics “H” Pattern Display This subtest displays a full screen of “H” patterns.
3 Tests and Diagnostics 3.10 Floppy Disk Test 3.10 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen.
3.10 Floppy Disk Test 3 Tests and Diagnostics Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK IN PROGRESS SUB-TEST PASS COUNT WRITE DATA ADDRESS : XX : XXXXX : XX : XXXXXX XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3 Tests and Diagnostics 3.11 Printer Test 3.11 Printer Test CAUTION: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The following messages will appear after selecting the Printer Test from the DIAGNOSTIC TEST MENU. Answer each of the questions with an appropriate response to execute the test. NOTE: An IBM compatible printer must be connected to the system to execute this test.
3.11 Printer Test Subtest 02 3 Tests and Diagnostics Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3 Tests and Diagnostics 3.12 Async Test 3.12 Async Test To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3.13 Hard Disk Test 3 Tests and Diagnostics 3.13 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: When executing subtest02, 03, 04, 06, 08 and 09, the message [The hard disk will be destroyed.] will be displayed. The contents of the hard disk will be erased when these tests are executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk.
3 Tests and Diagnostics 3.13 Hard Disk Test 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3.13 Hard Disk Test Subtest 04 3 Tests and Diagnostics Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3 Tests and Diagnostics 3.14 Real Timer Test 3 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
3.14 Real Timer Test 3 Tests and Diagnostics Then the subtest reads and compares this data with the original data.
3 Tests and Diagnostics Subtest 03 3.14 Real Timer Test Real time carry CAUTION: When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments.
3.15 NDP Test 3 Tests and Diagnostics 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3 Tests and Diagnostics 3.16 Expansion Test 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
3.16 Expansion Test Subtest 02 3 Tests and Diagnostics RGB monitor ID NOTE: To execute this subtest, an external monitor with monitor ID function is required. Connect the external monitor to the PC for the test of ID acquisition. The judgment of acquisition is based on the panel data. In simultaneous display mode or internal display mode, in which the panel data is acquired, this subtest will fail. Therefore, make sure only the external display is selected when executing this subtest.
3 Tests and Diagnostics 3.17 CD-ROM/DVD-ROM Test 3.17 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW media on the market.
3.18 Error Code and Error Status Names 3 Tests and Diagnostics 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3 Tests and Diagnostics 3.
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3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight-digit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
3.19 Hard Disk Test Detail Status 3 Tests and Diagnostics Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector.
3 Tests and Diagnostics 3.20 3.20 Only One Test Only One Test 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################ # ######## Only One Test Menu (XXXXXXXXX) ####### ################################################################ # * * * 1 ............ Pressed Key Display * * 2 ............
3.20 Only One Test Subtest 01 3 Tests and Diagnostics Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function which causes the key’s display character to blink. Press Del + Enter to end the test.
3 Tests and Diagnostics Subtest 02 3.20 Only One Test Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
3.20 Only One Test Subtest 03 3 Tests and Diagnostics Kill Switch This subtest checks if the Wireless communication switch works properly. If the test is started with the switch ON, the following message appears in the display. Kill switch is set to a start position (OFF) Slide the switch to OFF position. Then, the following message appears in the display. KILL SWITCH ON !! Slide the switch to ON position. Then, the following message appears in the display.
3 Tests and Diagnostics 3.20 Only One Test Connect the USB test module and USB cable to the computer. Input the test port number and press Enter. OK message appears in the display if the test ends without an error. NG message appears in the display if an error is found during the test. Confirm the connection of cable, and then execute the test again. Press 9 and Enter to return to Only One Test menu. Subtest 05 LED This subtest checks if each LED lights properly.
3.20 Only One Test Subtest 06 3 Tests and Diagnostics Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z). NOTE: Make sure that this subtest is executed on the following condition: 1. Flat desk with vertical plane to get the stability of machine. 2. Prevent the machine from shake or shock. Set the machine against the vertical plane with the Front upward Vertical plane Flat desk The figure below shows the name and position of each side.
3 Tests and Diagnostics 3.20 Only One Test When this subtest is selected, the following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE: Be sure to execute the test with the display panel opened. Set the machine on the flat desk. Then press Enter to detect the data on this setting of machine. The following message appears in the display.
3.20 Only One Test 3 Tests and Diagnostics When a defective is found during the each check above, the following message appears in the display. The test is halted at the point when the defective is found. ** Setting ERROR! ** Press [Enter] key Press Enter and return to the Only One Test menu. Then execute the test again. Subtest 07 Button This subtest checks if the buttons in the following figure work properly.
3 Tests and Diagnostics 3.21 3.21 Head Cleaning Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3.22 Log Utilities 3.22 3 Tests and Diagnostics Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk, or output the data to a printer or the display. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD/HDD or memory address (ADDR) 6. Write data (WD) 7.
3 Tests and Diagnostics 3.22 Log Utilities 3.22.2 Operations 1.
3.23 Running Test 3.23 3 Tests and Diagnostics Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtests 01) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.23.2 Operations 1.
3 Tests and Diagnostics 3.24 3.24 Floppy Disk Drive Utilities Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. It is different from the Toshiba MS-DOS FORMAT command.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] Model No. = XXXXXXX [Drive #2] = YYYYYYY Press Enter to return to the FDD UTILITIES MENU.
3 Tests and Diagnostics 3.25 System Configuration 3 3.25 System Configuration 3.25.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4. Boot ROM version 5. EC/KBC version 6. PS Microprocessor version 7. SVP parameter version [Panel/Manufacture code/Product code] 8. Microcode revision [Processor number] 9.
3.25 System Configuration 3 Tests and Diagnostics 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display : Ver X.XX [Machine Name ???] * * * * * * * * * * * * * * * * * - * Processor Type = XXXXXX-XXXXXMHz Code = XX L2 Cache = XXXXXKB Chip set = XXXXXX VRAM = XXXXXXMB BIOS ROM Version = VX.XX 1st ID = XXH, 2nd ID = XXH BOOT ROM Version = VX.XX EC/KBC Version = VX.XX PS Micom Version = VX.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) 3.26 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intel-made Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3.26 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. ? Connection of wireless LAN card ? Using a wrong wireless LAN card (Using unspecified card) ? Defective wireless LAN card Checking the connection, execute the subtest again. Subtest02 MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display.
3 Tests and Diagnostics Subtest03 3.26 Wireless LAN Test Program (Intel-made b/g) Antenna check & communication test of 11b mode Caution: To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Access points are also required. (Access point for 802.11b and 802.11g) Be sure to turn the wireless communication switch ON before executing wireless LAN communication test.
3.26 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics Checking the connection and condition, execute the subtest again. Subtest04 Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display. Press any key and return to the test menu. When a defective is found during the test, NG message will appear in the display.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) 3.27 Wireless LAN Test Program (Intel-made a/b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intel-made Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 EXIT TO MS-DOS.
3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics Press any key and return to the test menu.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) If a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display. ************************************************************* * * SKU NG !! * * Other Card or Module not found * * ************************************************************* * * * * Press any key and return to the test menu.
3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. ? Connection of wireless LAN card ? Defective wireless LAN card ? Disappearance of MAC address data Checking the connection, execute the subtest again.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) When a defective is detected in the test, following typical cause is considered. ? Connection of wireless LAN card ? Connection of wireless LAN antenna cable (Main/Aux) ? Condition of wireless LAN communication (Interference/obstruction) ? Defective wireless LAN card Checking the connection and condition, execute the subtest again.
3.27 Wireless LAN Test Program (Intel-made a/b/g) Subtest05 3 Tests and Diagnostics Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contens of this subtest, refer to Subtest04 Communication test of 11a mode. Subtest06 All the tests of Calexico 11a/b/g Card This subtest checks SKU information, MAC address of Calexico 802.11a/b/g card, antenna connection and communication test of Calexico 802.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made) 3.28 Wireless LAN Test Program (Askey-made) This section describes how to perform the wireless LAN transmitting-receiving test (Askey-made Atheros b/g, a/b/g). Caution: To execute subtest 03-07, use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Another wireless communication tool with 2.4GHz like Bluetooth is interfering with the test.
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3 Tests and Diagnostics Subtest02 3.28 Wireless LAN Test Program (Askey-made) MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display. ************************************************************* * * * MAC Address Check : OK !! * * * ************************************************************* Press any key and return to the test menu. When a defective is detected in the test, following typical cause is considered.
3.28 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. ? Connection of wireless LAN card ? Connection of wireless LAN antenna cable (Main/Aux) ? Condition of wireless LAN communication (Interference/obstruction) ? Defective wireless LAN card Checking the connection and condition, execute the subtest again.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 3 Tests and Diagnostics (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
3 Tests and Diagnostics Subtest02 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program (GbE) CAUTION: Gigabit Ethernet test is not supported for this model. This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adaptor...hit to abort. * External Loopback Test...PASSED Testing completed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.2 3 Tests and Diagnostics Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. To execute Modem test, press 2 and Enter. Following message will appear: [Modem loopback test !] ICHx MDC Test Program with Modem Sound (Line Test) Version X.
3 Tests and Diagnostics 3.29.3 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Bluetooth test CAUTION: Bluetooth test is not supported for this model. To execute this test, input 3 and press Enter. Note: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 3 Tests and Diagnostics BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter. The following message will appear: ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the target machine has any problem, it displays Error CODE. The following message is displayed. ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics [ESC] : Stop When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following message will appear: ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Testing is finished A>_ If the target machine has any problem, the following message “INCOMPLETE” is displayed with the Error Code. ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.4 3 Tests and Diagnostics IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 ....
3.31 Sound Test program 3 3 Tests and Diagnostics Tests and Diagnostics 3.31 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power.
3 Tests and Diagnostics 3.31 Sound Test program To return to the Sound test menu, Press 9 and Enter. Then following message will appear in the display. *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display. Subtest01 Microphone recording & play This subtest checks the function of the CODEC A/D, D/A converter.
3.31 Sound Test program Subtest02 3 Tests and Diagnostics Sine Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave. (It sounds like a continuous beep). By using wave measurable devices such as an oscilloscope, the data can be measured as a sine wave.
3 Tests and Diagnostics 3.31 Sound Test program 3.31.3 CD Sound (Standard) test To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). Following menu appears in the display. For details on use of test media, refer to (1) Test media (Toshiba-made test media). For details on use of audio CD on the market, refer to (2) Audio CD.
3.31 Sound Test program 3 Tests and Diagnostics Press any key and stop the narration. Then return to the CD Sound (Standard) test menu. Subtest02 English Narration Selected this subtest, narration in English starts. For more details on the procedure, refer to the subtest01. Subtest03 Test Tone A Caution: Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz.
3 Tests and Diagnostics 3.31 Sound Test program (2) Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX SUB-TEST PASS COUNT WRITE DATA ADDRESS XX XXXXX XX XXXXXX : : : : xxxxxxx DIAGNOSTIC TEST VX.
3.32 SETUP 3 Tests and Diagnostics CAUTION: Sound (Legacy) test is not supported in this model. 3.32 SETUP 3.32.1 Function Description This program displays the current system setup information as listed below: 1. Memory 2. System Date/Time 3. Battery 4. Password 6. Boot Priority (a) Boot Priority (b) HDD Priority (c) Network Boot Protocol 7.
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3.32 SETUP 3 Tests and Diagnostics 14. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation 15.
3 Tests and Diagnostics 3.32 SETUP 3.32.2 Accessing the SETUP Program Selecting 0 from the DIAGNOSTICS MENU and pressing Enter displays the followings: NOTE: *1. This item is displayed only when "Enabled" is set as [CPU Cache]. *2. This item is displayed only when Pentium model is used for CPU. *3. This item is displayed only when "Resume" is set as [Power-up mode] in [OTHERS] menu box. *4. This item is displayed only for the computer for TCL (Canada). *5. *6.
3.32 SETUP 3 Tests and Diagnostics connected to the computer.
3 Tests and Diagnostics 3.32 SETUP Moving Within the SETUP Menu and Changing Values 1. Press ? and ? to move between the two columns. Press ? and ? to move between items in a column. Press Fn+? ??PgUp) and Fn + ? ??PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3.32 SETUP 3 Tests and Diagnostics SETUP Options The SETUP screen is divided into 15 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Sets the date and time. System Date Sets date. System Time Sets time. 3.
3 Tests and Diagnostics 3.
3.32 SETUP 3 Tests and Diagnostics User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. Battery Save Options Processing Speed This feature changes the CPU processing speed. High CPU operates at 1.6/1.7/1.8/2.0GHz (Pentium-M), at 1.3/1.4GHz (Celeron-M) (Default in Full Power Mode) Low CPU operates at half processing speed. (Default in Low Power Mode) CPU Sleep Mode Use this option to enable or disable the CPU sleep function.
3 Tests and Diagnostics 3.32 SETUP System Auto Off Use this option to set the duration of the HDD automatic power off function. It can be set only when the “Resume” id selected in [Power-up mode]. Disabled Disables system automatic off function. xx Min. Automatically turns off the system if it is not used for the duration set. The duration xx can be set from 10 to 60 minutes. LCD Brightness Use this option to set the level of LCD brightness. Super-Bright Full brightness for maximum visibility.
3.32 SETUP 3 Tests and Diagnostics 5. Boot Priority (a) Boot Priority Use this option to set the priority for booting of the computer and the priority for the HDD for booting. FDD? HDD? CD-ROM? LAN: The computer looks for bootable files in the following order: FDD, HDD, CD-ROM (*1) and LAN HDD? CD-ROM? LAN? FDD: The computer looks for bootable files in the following order: HDD, CD-ROM, LAN and FDD.
3 Tests and Diagnostics 3.32 SETUP (c) Network Boot Protocol Use this option to set the starting method via a network. PXE Sets to PXE protocol. (Default) RPL Sets to RPL protocol. 6. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Power-up Mode Use this option to choose between resume and boot mode. Boot Turns on boot mode. (Default) Resume Turns on resume mode.
3.32 SETUP 3 Tests and Diagnostics Always High Disables Pentium-M processor featuring Intel SpeedStep technology and always runs the processor at its maximum speed. Always Low Disables Pentium-M processor featuring Intel SpeedStep technology and always runs the processor at its default speed. (e) Auto Power On This option displays setting for Auto Power On. Disabled Indicates auto power on is not set. Enabled Indicates auto power on is set.
3 Tests and Diagnostics 3.32 SETUP (f) Panel Power On/Off This option is displayed only in the resume mode. Enabled Enables the Panel Power On/Off. Disabled Disables the Panel Power On/Off. (Default) (g) Standby mode Use this option to set the start speed of operation from standby mode. Normal Normal speed of start to Windows operation. (Default) Fast Quick start to Windows operation. It consumption more electricity than normal mode. It lights orange during standby mode.
3.32 SETUP 3 Tests and Diagnostics 8. I/O ports (b) Parallel This option sets the interrupt request level and I/O port base address for the parallel port. When the parallel port mode is set to Std. Bi-direct, the options are as follows: LPT setting Interrupt level I/O address LPT 1 7 378H LPT 2 5 278H LPT 3 7 3BCH Not Used Disables port When the parallel port mode (see settings below) is set to ECP, the DMA channel can also be set to 1 or 3. The default is 3.
3 Tests and Diagnostics 3.32 SETUP 10. PCI Bus This option displays the interrupt level for the Card Bus in the computer. It is for information only and cannot be changed. PCI BUS = IRQ10, IRQ11 11. Display This group of options configures the computer’s display. (a) Power On Display This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected. Otherwise it selects the internal LCD.
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3 Tests and Diagnostics 3.32 SETUP 12. Peripheral Use this option to select the peripheral's mode. (a) Internal Pointing Device This option enables or disables the touch pad Enabled Enables the touch pad. (Default) Disabled Disables the touch pad. (b) Parallel Port Mode Use this option to set information of Parallel Port Mode. ECP Sets the port mode to Extended Capabilities Port (ECP). For most printers, the port should be set to ECP. (Default) Std. Bi-Direct. Sets the bi-directional setting.
3.32 SETUP 3 Tests and Diagnostics 13. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation This option sets the Legacy support condition of the USB keyboard and the USB mouse. Enabled Enables LEGACY support. (Default) USB keyboard/USB mouse are available without the driver. Disabled Disables LEGACY support (b) USB-FDD Legacy Emulation This option sets the Legacy support condition of the USB floppy disk drive. When a computer is FDD built-in model, this option is not displayed.
Chapter 4 Replacement Procedures
4 Replacement Procedures 4 4-ii Satellite R10 Maintenance Manual (960-509)
4 Replacement Procedures Chapter 4 4.1 Contents Overview...............................................................................................................4-1 Safety Precautions ...........................................................................................4-2 Before you Begin ............................................................................................4-3 Disassembly Procedures .................................................................................
4 Replacement Procedures 4.15.2 RTC battery........................................................................................4-37 4.16 LCD harness holder ............................................................................................4-38 4.17 Mic (L) cable guide............................................................................................ 4-41 4.18 QI board/CN board............................................................................................. 4-42 4.18.
4 Replacement Procedures Figure 4-9 Removing the keyboard ...............................................................................4-19 Figure 4-10 Removing the touch pad cable ...................................................................4-21 Figure 4-11 Removing the bottom cover assembly .......................................................4-22 Figure 4-12 Removing the battery latch assembly ........................................................
4 Replacement Procedures Figure 4-44 Removing the hinge assembly ...................................................................4-65 Figure 4-45 Arranging the wireless LAN antenna cables..............................................4-66 Figure 4-46 Removing the hinge switch board..............................................................4-68 Figure 4-47 to 4-53 Replacing CMO fluorescent lamp (1) to (7) ......................
4 Replacement Procedures 4 4.1 Overview Replacement Procedures 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual.
4.1 Overview 4 Replacement Procedures Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. Danger: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
4 Replacement Procedures 4.1 Overview Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
4.1 Overview 4 Replacement Procedures Disassembly Procedure Three main types of cable connector are used. ? Pressure plate connector ? Spring connector ? Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
4 Replacement Procedures 4.1 Overview Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. ? Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. ? Check that all cables and connectors are securely connected.
4.1 Overview 4 Replacement Procedures Screw Tightening Torque Use the following torque when tightening screws. Caution: Overtightening may damage screw s or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. Note: To tighten screws quickly and accurately, an electric screwdriver is recommended. ? M2 (2mm) 0.167 N?m (1.7 kgf ?cm) ? M2.5 (2.5mm) 0.294 N?m(3.0 kgf?cm) ? M3 (3mm) 0.549 N?m(5.
4 Replacement Procedures 4.1 Overview Screw Notation To make maintenanc e of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Flat head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.) Example: B6 ...
4.2 Battery pack 4.2 4 Replacement Procedures Battery pack Removing the battery pack The following describes the procedure for removing the battery pack. (See Figure 4-1.) Caution: Take care not to short circuit the terminals when removing the battery pack. Similarly , do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all other external devices from the computer. 3. Turn the computer upside down. 4.
4 Replacement Procedures 4.2 Battery pack Installing the battery pack The following describes the procedure for installing the battery pack. (See Figure 4-1.) Caution: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispostickerways the used batteries pack in accordance with the laws and ordinances of your local authority. Use only the batteries appro ved by Toshiba.
4.3 PC card/SD card 4.3 4 Replacement Procedures PC card/SD card 4.3.1 PC card Removing a PC card The following describes the procedure for removing a PC card. (See Figure 4-2.) Caution: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of the computer system you are using. 1. Push the e jection button. It will pop out when you release it. Press it once more to eject a PC card. 2. Pull out a PC card and remove it. 3. Push in the ejection button again.
4 Replacement Procedures 4.3 PC card/SD card 4.3.2 SD card Removing a SD card The following describes the procedure for removing a SD memory card. (See Figure 4-3.) Caution: Insert or remove a SD card in accordance with any instructions in the SD card manual or the manuals of the computer system you are using. 1. Push a SD card . It will pop out partly when you release, so pull out the card.
4.4 Memory module 4.4 4 Replacement Procedures Memory module Caution: The power must be turned off when you remove the memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend the memory module. Removing the memory module To remove the memory module(s), confirm that the computer is in boot mode.
4 Replacement Procedures 4.4 Memory module Install ing the memory module To install the memory module(s), confirm that the computer is in boot mode. Then perform the following procedure. (See Figure 4-4.) 1. Insert the memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly. Caution: The power must be turned off when you insert the memory module. Inserting a memory module with the power on risks damaging the module or the computer itself.
4.5 HDD 4.5 4 Replacement Procedures HDD Removing the HDD The following describes the procedure for removing the HDD. (See Figure 4-5 and 4-6.) Caution: Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Loosen the screw (with e-ring) fixing the HDD slot cover and remove the HDD slot cover. 3. Pull out the HDD assembly from the slot of the computer.
4 Replacement Procedures 4.5 HDD 5. Remove the following screws fixing the HDD holder. ? M3.0x4.0S FLAT BIND screw x4 6. Detach the HDD holder from the HDD. HDD holder (HDD frame and laminate) M3.0x4.0S FLAT BIND M3.0x4.0S FLAT BIND HDD Figure 4-6 Removing the HDD holder Installing the HDD The following describes the procedure for installing the HDD. (See Figure 4-5 and 4-6.) CAUTION: HDD frame and laminate can not be reused.
4.6 Selectable bay module 4.6 4 Replacement Procedures Selectable bay module Removing a selectable bay module The following describes the procedure for removing a selectable bay module. (See Figure 4-7 and 4-8.) 1. Turn the computer upside down. 2. Move the following screw (if the screw is secured in the lock screw hole) from lock position to unlock position. ? M2.5x4.0B FLAT BIND screw x1 3. Pull out a selectable bay module from the selectable bay while sliding the lever. M2.5x4.
4 Replacement Procedures 4.6 Selectable bay module 4. Remove the following screws securing the plastic brace and the OD board and remove them. ? M2.0x8.0S BIND screw x2 5. Remove the following screws securing the plastic frame and remove it. ? M2.0x3.0S S-THIN FLAT BIND screw x5 M2.0x3.0S S-THIN FLAT BIND Plastic frame OD board Plastic brace M2.0x3.0S S-THIN FLAT BIND M2.0x8.
4.6 Selectable bay module 4 Replacement Procedures Installing a selectable bay module The following describes the procedure for installing a selectable bay module. (See Figure 4-7 and 4-8.) 1. Install the plastic frame to the selectable bay module and secure them with following screws . ? M2.0x3.0S S-THIN FLAT BIND screw x5 2. Install the OD board and plastic brace to the selectable bay module and secure them with following screws. ? M2.0x8.0S BIND screw x2 3.
4 Replacement Procedures 4.7 4.7 Keyboard Keyboard Removing the keyboard The following describes the procedure for removing the keyboard. (See Figure 4-9.) 1. Open the display. 2. Insert your nails in the slot of both sides of the keyboard holder and lift it up. 3. Remove the following screws securing the keyboard. ? M2.5x2.8B FLAT BIND screw x2 4. Lift the top edge of the keyboard and bring the edge to the front to lay on the computer.
4.7 Keyboard 4 Replacement Procedures Installing the keyboard The following describes the procedure for installing the keyboard. (See Figure 4-9.) 1. Put the keyboard on the palm rest as its face is down. Connect the keyboard flexible cable to CN3200 on the system board and lock the connector. 2. Hook the bottom edge of the keyboard to the palm rest. Place the keyboard on the computer and secure it with the following screws. ? M2.5x2.8B FLAT BIND screw x2 3. Fit to install the keyboard holder.
4 Replacement Procedures 4.8 4.8 Bottom cover assembly Bottom cover assembly Removing the bottom cover assembly The following describes the procedure for removing the bottom cover assembly. (See Figure 4-10 and 4-11.) 1. Disconnect the touch pad cable from the connector CN3201 on the system board. CN3201 Touch pad cable Figure 4-10 Removing the touch pad cable 2. Close the display and turn the computer upside down. 3. Remove the following screws securing the bottom cover assembly. ? M2.0x6.
4.8 Bottom cover assembly 4 Replacement Procedures (3) (6) (6) (6) (6) (6) (3) (6) (6) (6) (6) (6) (6) (6) (6) (6) (6) (6) (6) (6) (6) Figure 4-11 Removing the bottom cover assembly Installing the bottom cover assembly The following describes the procedure for installing the bottom cover assembly. (See Figure 4-10 and 4-11.) 1. Install the bottom cover assembly to the computer. Note: Install the bottom cover assembly from the i.LINK (IEEE1394) slot first. 2.
4 Replacement Procedures 4.9 4.9 Battery latch assembly / Selectable bay lock Battery latch assembly / Selectable bay lock 4.9.1 Battery latch assembly Removing the battery latch assembly The following describes the procedure for removing the battery latch assembly. (See Figure 4-12.) 1. Remove the following screw securing the battery latch assembly. ? M2.5x4.0B FLAT BIND screw x1 2. Pull up to remove the battery latch assembly from the bottom cover assembly. M2.5x4.
4.9 Battery latch assembly / Selectable bay lock 4 Replacement Procedures 4.9.2 Selectable bay lock Removing the selectable bay lock The following describes the procedure for removing the selectable bay lock. (See Figure 4-13.) 1. Release the tabs (2 points) and detach the selectable bay lock. 2. Remove the selectable bay lock from the bottom cover assembly.
4 Replacement Procedures 4.10 QI button assembly / PC card slot brace 4.10 QI button assembly / PC card slot brace 4.10.1 QI button assembly Removing the QI button assembly The following describes the procedure for removing the QI button assembly. (See Figure 4-14.) 1. Remove the following screw securing the QI button assembly and remove the QI button assembly. ? M2.5x4.0B FLAT BIND screw x1 M2.5x4.
4.10 QI button assembly / PC card slot brace 4 Replacement Procedures 4.10.2 PC card slot brace Removing the PC card slot brace The followin g describes the procedure for removing the PC card slot brace. (See Figure 4-15.) 1. Remove the following screws securing the PC card slot brace and remove the PC card slot brace . ? M2.5x4.0B FLAT BIND screw x2 M2.5x4.
4 Replacement Procedures 4.11 MDC / modem cable 4.11 MDC / modem cable Removing the MDC / modem cable The following describes the procedure for removing an MDC / modem cable. (See Figure 4-16 and 4-17.) 1. Remove the following screws securing the MDC. ? M2.0x4.0Z BIND screw x2 2. Pull up the MDC straight and remove it from the connector CN3000 on the system board. 3. Disconnect the modem cable from the connector of MDC. M2.0x4.0Z BIND MDC Modem cable CN3000 Figure 4-16 Removing the MDC 4.
4.11 MDC / modem cable 4 Replacement Procedures 6. Open the insulators and pull out the modem cable from the insulators. 7. Remove the following screw and disconnect the drain cable 2 from the stud of hinge assembly. ? M2.0x4.0Z BIND screw x1 8. Disconnect and remove the modem cable from the connector CN3001 on the system board. Modem cable CN3001 Insulator M2.0x4.0Z BIND or M2.0x4.0B LH STICK M2.0x4.
4 Replacement Procedures 4.11 MDC / modem cable Installing the MDC / modem cable The following describes the procedure for installing an MDC / modem cable. (See Figure 4-16 and 4-17.) 1. Connect the modem cable to the connector CN3001 on the system board. 2. Secure the drain cable 2 to the stud of hinge assembly with the following screw. ? M2.0x4.0Z BIND screw x1 3. Arrange the modem cable inside the insulators and close the insulators. 4. Arrange the modem cable along the guide of mini PCI cover. 5.
4.12 Mini PCI module 4 Replacement Procedures 4.12 Mini PCI module Removing the Mini PCI module The following describes the procedure for removing a Mini PCI module. (See Figure 418.) 1. Disconnect the speaker cable from the connector CN6150 on the system board and pull out the cable from the guide of mini PCI cover. 2. Remove the following screws securing the mini PCI cover and remove the mini PCI cover. ? M2.0x4.0Z BIND screw x1 3.
4 Replacement Procedures 4.12 Mini PCI module Installing the Mini PCI module The following describes the procedure for removing a Mini PCI module. (See Figure 418.) 1. Insert the wireless LAN card slantwise into the connector CN9991 of mini PCI. Press the wireless LAN card until it hooks surely. 2. Connect the wireless LAN antenna cables to the connectors of wireless LAN card. (White cable to MAIN connector, Black cable to AUX connector) 3. Secure the mini PCI cover with the following screws . ? M2.0x4.
4.13 Fan / CPU 4 Replacement Procedures 4.13 Fan / CPU 4.13.1 Fan Removing the fan The following describes the procedure for removing the fan. (See Figure 4-19.) 1. Disconnect the fan cable from the connector CN8770 on the system board. 2. Remove the following screws securing the fan and remove the fan. ? M2.0x4.0B FLAT BIND screw x2 Guide M2.0x4.0B FLAT BIND M2.0x4.0B FLAT BIND CN8770 Fan Figure 4-19 Removing the fan Install ing the fan The following describes the procedure for installing the fan.
4 Replacement Procedures 4.13 Fan / CPU 4.13.2 CPU Removing the CPU The following describes the procedure for removing the CPU. (See Figure 4-20 and 421.) 1. Remove the following screws securing the CPU hold plate in the reverse order of the number (3? 1) on the CPU hold plate and remove the CPU hold plate. ? M2.0x4.0B BIND screw x3 2. Remove the heat sink on the CPU. M2.0x4.0B BIND M2.0x4.0B BIND CPU hold plate Heat sink Figure 4-20 Removing the heat sink 3.
4.13 Fan / CPU 4 Replacement Procedures Installing the CPU The following describes the procedure for installing the CPU. (See Figure 4-20 to 4-22.) 1. Make sure that the cam of the CPU socket is in the unlock position. 2. Install the CPU on the CPU socket and check the CPU is installed on the right position. 3. Lock the CPU by rotating clockwise the cam on the CPU socket by 90 degrees with a flat-blade driver. 4. If there is already silicon grease on the CPU and FIN, clean it with a cloth.
4 Replacement Procedures 4.14 DC-IN jack 4.14 DC-IN jack Removing the DC-IN jack The following describes the procedure for removing the DC-IN jack. (See Figure 4-23.) 1. Pull up the DC-IN jack straight from the slot of cover assembly. 2. Disconnect the DC-IN jack from the connector CN8800 on the system board DC-IN jack CN8800 Figure 4-23 Removing the DC-IN jack Installing the DC-IN jack The following describes the procedure for installing the DC-IN jack. (See Figure 4-23.) 1.
4.15 Penholder / RTC battery 4 Replacement Procedures 4.15 Penholder / RTC battery 4.15.1 Penholder Removing the penholder The following describes the procedure for removing the penholder. (See Figure 4-24.) 1. Disconnect the RTC batter cable from the connector CN8760 on the system board. 2. Remove the following screws securing the penholder and remove the penholder from the cover assembly. ? M2.0x4.0B FLAT BIND screw M2.0x4.
4 Replacement Procedures 4.15 Penholder / RTC battery 4.15.2 RTC battery Removing the RTC battery The following describes the procedure for removing the RTC battery. (See Figure 4-25.) 1. Pull out the RTC batter cable from the guide of penholder. 2. Remove the RTC battery from the slot of penholder. RTC battery Penholder Figure 4-25 Removing the RTC battery Installing the RTC battery The following describes the procedure for installing the RTC battery. (See Figure 4-25.) 1.
4.16 LCD harness holder 4 4 Replacement Procedures Replacement Procedures 4.16 LCD harness holder Removing the LCD harness holder The following describes the procedure for removing the LCD harness holder. (See Figure 4-26.) 1. Disconnecting the USB harness from the connector CN4612 on the system board and from CN4612 on the CN board, turn up the insulator and pull out the USB harness from the guide of LCD harness holder. 2.
4 Replacement Procedures 4.16 LCD harness holder QI board cable CN9530 Insulator CN9521 CN board harness (Connected to CN9502) USB harness (Connected to CN4612) M2.0x6.
4.16 LCD harness holder 4 Replacement Procedures Installing the LCD harness holder The following describes the procedure for installing the LCD harness holder (See Figure 4-26). 1. Install the LCD harness holder to the cover assembly by fitting the boss and secure it with the following screws . ? M2.0x6.0B FLAT BIND screw x2 2.
4 Replacement Procedures 4.17 Mic (L) cable guide 4.17 Mic (L) cable guide Removing the mic (L) cable guide The following describes the procedure for removing the mic (L) cable guide. (See Figure 4-27.) 1. Disconnect the mic (L) cable from the connector CN6060 on the system board and pull it out from the mic (L) cable guide. 2. Remove the following screws and mic (L) cable guide . ? M2.0x6.
4.18 QI board / CN board 4 Replacement Procedures 4.18 QI board / CN board 4.18.1 QI board Removing the QI board The following describes the procedure for removing the QI board. (See Figure 4-28.) 1. Remove the following screws securing the QI board. ? M2.0x6.0B FLAT BIND screw x2 2. Pull up the QI board straight and remove the QI board from the cover assembly. M2.0x6.
4 Replacement Procedures 4.18 QI board / CN board 4.18.2 CN board Removing the CN board The following describes the procedure for removing the CN board. (See Figure 4-29.) 1. Remove the following screws securing the CN board. ? M2.0x6.0B FLAT BIND screw x2 2. Pull up to remove the CN board from the cover assembly. M2.0x6.0B FLAT BIND CN board Figure 4-29 Removing the CN board Install ing the CN board The following describes the procedure for installing the CN board. (See Figure 4-29.) 1.
4.19 System board 4 Replacement Procedures 4.19 System board Removing the system board The following describes the procedure for removing the system board. (See Figure 4-30.) 1. Disconnect the mic (R) cable from the connector CN6061 on the system board 2. Disconnect the rotation sensor cable from the connector CN3280 on the system board 3. Disconnect the digitizer cable from the connector CN9540 on the system board 4. Remove the following screws securing the system board. ? M2.0x6.
4 Replacement Procedures 4.19 System board Installing the system board The following describes the procedure for installing the system board. (See Figure 4-30.) 1. Install the system board to the cover assembly and secure it with the following screw. ? M2.0x6.0B FLAT BIND screw x1 NOTE: When installing the system board, be careful not to catch the mic (L&R) cable, rotation sensor cable and digitizer cable between the system board and cover assembly.
4.20 PC card slot cover 4 Replacement Procedures 4.20 PC card slot cover Removing the PC card slot cover The following describes the procedure for removing the PC card slot cover. (See Figure 4-31.) 1. Remove the following screws securing the PC card slot cover. ? M2.0x3.0S S-THIN FLAT BIND screw x2 2. Release the hook (2 points) and remove the PC card slot cover. M2.0x3.
4 Replacement Procedures 4.21 Speaker 4.21 Speaker Removing the speaker The following describes the procedure for removing the speaker. (See Figure 4-32.) 1. Turn up the insulator. 2. Pull out the speaker cable from the guide insulator of cover assembly. 3. Pull out the speaker from the slot of cover assembly.
4.22 Microphone / Front panel 4 Replacement Procedures 4.22 Microphone / Front panel 4.22.1 Microphone Removing the microphone The following describes the procedure for removing the speaker. (See Figure 4-33.) 1. Remove the following screws securing the both right and left mic holder. ? M2.0x4.0B FLAT BIND screw x2 (x1 for each side) 2. Pull up the mic holder straight and remove the mic holder from the cover assembly. 3. Remove the microphone from the slot of cover assembly. M2.0x4.
4 Replacement Procedures 4.22 Microphone / Front panel 4.22.2 Front panel Removing the front panel The following describes the procedure for removing the front panel. (See Figure 4-34.) 1. Remove the following screws and front panelfrom the cover assembly. ? M2.5x6.0B FLAT BIND screw x2 2. Detach the display latch from the front panel. M2.5x6.
4.23 Lens holder 4 Replacement Procedures 4.23 Lens holder Removing the lens holder The following describes the procedure for removing the lens holder. (See Figure 4-35.) 1. Remove the following screw securing the lens holder. ? M2.5x4.0B S-THIN FLAT BIND screw x1 Remove the lens holder from the cover assembly. M2.5x4.0B S-THIN FLAT BIND Lens holder Figure 4-35 Removing the lens holder Install ing the lens holder The following describes the procedure for installing the lens holder. (See Figure 4-35.
4 Replacement Procedures 4.24 Touch pad 4.24 Touch pad Removing the touch pad The following describes the procedure for removing the touch pad. (See Figure 4-36.) 1. Remove the following screws securing the touch pad. ? M2.0x4.0B S-THIN FLAT BIND screw x3 2. Remove the touch pad holder and touch pad from the cover assembly. 3. Peel off the glass tape and disconnect the touch pad cable from the touch pad. M2.0x4.
4.25 LCD unit & FL inverter 4 Replacement Procedures 4.25 LCD unit & FL inverter Removing the LCD unit & FL inverter The following describes the procedure for removing the LCD unit & FL inverter. (See Figure 4-37 to 4-39.) NOTE: When replacing the LCD unit, do not give the hinge portion a strong press. It may cause the breakage of the hinge assembly. Also, Use a stand or something under the LCD part to keep the LCD part level while replacing it. 1. Peel off the mask seals (6 points) from the LCD mask. 2.
4 Replacement Procedures 4.25 LCD unit & FL inverter 5. Turn up the insulator and disconnect the HV cable from the connector of FL inverter. 6. Remove the following screws securing the LCD unit. ? M2.0x4.0B FLAT BIND screw x4 7. With the bottom edge of the LCD unit on the display cover, raise the top edge of the LCD unit. NOTE: When putting the LCD unit on the display cover, lay a mat or something under the LCD unit to protect the computer and the LCD from a scratch or breakage. 8.
4.25 LCD unit & FL inverter 4 Replacement Procedures 10. Pull up the FL inverter while peeling off the double -sided tape. CAUTION: The removed FL inverter is not reusable. Therefore when installing the FL inverter, it must be a new one. 11. Disconnect the inverter harness and remove the FL inverterfrom the display cover.
4 Replacement Procedures 4.25 LCD unit & FL inverter Installing the LCD unit & FL inverter The following describes the procedure for installing the LCD unit & FL inverter. (See Figure 4-37 to 4-39.) 1. Connecting the inverter harness to the connector of FL inverter, install the FL inverter to the display cover. CAUTION: The FL inverter once removed from the computer is not reusable. When installing the FL inverter, be sure to use a new one. 2.
4.26 Application switch board 4 Replacement Procedures 4.26 Application switch board Removing the application switch board The following describes the procedure for removing the application switch board. (See Figure 4-40.) 1. Remove the following screws securing the application switch board and pull up the application switch board. ? M2.0x4.0B FLAT BIND screw x1 2. Disconnect the switch harness from the connector CN9510 on the application switch board. M2.0x4.
4 Replacement Procedures 4.27 LCD latch assembly 4.27 LCD latch assembly Removing the LCD latch assembly The following describes the procedure for removing the LCD latch assembly. (See Figure 4-41.) 1. Remove the following screw and LCD latch assembly from the display cover. ? M2.0x4.0B FLAT BIND screw x1 LCD latch assembly M2.0x4.0B FLAT BIND Figure 4-41 Removing the LCD latch assembly Installing the LCD latch assembly The following describes the procedure for installing the LCD latch assembly.
4.28 Digitizer 4 Replacement Procedures 4.28 Digitizer Caution: Read following instructions before handling the Digitizer. Do not carry the LCD module by holding the FL cable in one’s hand because it may result to cut the FL cable, and cause display function failure or lighting failure. Be careful to use the bezel guide. There is a portion where the bezel is sticking out because of the digitizer guide. Do not press and rub the portion with bare hands or it may result cut your finger.
4 Replacement Procedures 4.28 Digitizer Do not pull up the PCB hardly when installing the digitizer because it may result to give stress on the TAB or PCB and cause the display function failure. Make sure that three latches fit the digitizer securely. If the latches are not locked securely, it may result to move the digitizer and give stress on the TAB or PCB and cause the display function failure.
4.28 Digitizer 4 Replacement Procedures Do not turn up the digitizer because it may result to give stress on the TAB or PCB and cause the display function failure. Do not put any instrument on the LCD module because it may result to make scratch on the cell, polarization sheet or B/L and break the TAB and may cause the display function failure.
4 Replacement Procedures 4.28 Digitizer Do not hold, press and rub the TAB because it may result to break the TAB and cause the display function failure. Make sure to put the LCD module on the flat place. If the LCD module is put on the uneven place, it may result to break the TAB, make scratch on the B/L or polarization sheet and cause the display function failure.
4.
4 Replacement Procedures 4.28 Digitizer Removing the Digitizer The following describes the procedure for removing the digitizer. (See Figure 4-42.) 1. Remove the following screws securing the digitizer. ? M2.0x3.0Z BIND screw x3 2. Slide out the digitizer toward the arrow pointing. M2.0x3.0Z BIND M2.0x3.0Z BIND Digitizer Figure 4-42 Removing the digitizer Installing the digitizer The following describes the procedure for installing the digitizer. (See Figure 4-42.) 1.
4.29 LCD/digitizer harness & Wireless LAN antenna cables 4 Replacement Procedures 4.29 LCD/digitizer harness & Wireless LAN antenna cables Removing the LCD/digitizer harness & wireless LAN antenna cables The following describes the procedure for removing the LCD/digitizer harness & wireless LAN antenna cables. (See Figure 4-43 and 4-44.) 1. Pull out the wireless LAN antenna cables from the guide. 2. Remove the following screws and LCD harness holder. ? M2.5x2.8B FLAT BIND screw x1 3.
4 Replacement Procedures 4.29 LCD/digitizer harness & Wireless LAN antenna cables 7. Remove the LCD harness ground plate from the display cover. 8. Remove the following screws and LCD harness hold plate from the display cover. ? M2.5x6.0B FLAT BIND screw x2 9. Remove the following screws securing the hinge assembly. ? M2.5x6.0B FLAT BIND screw x2 10. Detaching the hinge assembly from the display cover, remove the hinge cap from the hinge assembly. M2.5x6.
4.29 LCD/digitizer harness & Wireless LAN antenna cables 4 Replacement Procedures Installing the LCD/digitizer harness & wireless LAN antenna cables The following describes the procedure for installing the LCD/digitizer harness & wireless LAN antenna cables. (See Figure 4-43 and 4-45.) 1. Stick the wireless LAN antennas on the display cover and arrange their cables. 2. Stick the acetate tape (5 points) on the display cover.
4 Replacement Procedures 4.29 LCD/digitizer harness & Wireless LAN antenna cables 10. Secure the cover assembly to the hinge assembly with the following screws. ? M2.5x6.0B FLAT BIND screw x1 ? M2.5x6.0S PSP TIGHT screw x1 11. Install the digitizer harness holderto the hinge assembly and secure it with the following screws . ? M2.5x6.0B FLAT BIND screw x1 ? M2.5x6.0S PSP TIGHT screw x1 12. Install the LCD harness holder to the hinge assembly and secure it with the following screws ? M2.5x2.
4.30 Hinge Switch Board 4 Replacement Procedures 4.30 Hinge Switch Board Removing the hinge switch board The following describes the procedure for removing the hinge switch board. (See Figure 4-46.) 1. Remove the following screws and hinge switch board . ? M2.0x3.0B FLAT BIND screw x2 2. Remove the plate placed under the hinge switch board. M2.0x3.
4 Replacement Procedures 4.31 Fluorescent Lamp 4.31 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type 14.1 inch Part. No Supplier Section CMO 4.31.1 G33C0002J110 Note: - When working with an LCD module, always use a flat, grounded table. - Handle the backlight unit in the environment without dust, such as on the clean bench.
4.31 Fluorescent Lamp 4.31.1 4 Replacement Procedures Replacing the 14.1 inch CMO-made Fluorescent Lamp Disassembling the fluoresce nt lamp The following describes the procedure for replacing the fluorescent lamp. (See Figure 447 to 4-53.) 1. Peel off the CU tape and protector film from the LCD unit. Protection sheet CU tape Figure 4-47 Replacing CMO fluorescent lamp (1) 2. Peel off the CU tapes (2 sheets) from the LCD unit.
4 Replacement Procedures 4.31 Fluorescent Lamp 3. Remove the screws (6 screws) securing the metal frame. Screw Screw Figure 4-49 Replacing CMO fluorescent lamp (3) 4. Release the hooks of metal frame from the upper side and remove the metal frame from the LCD unit. NOTE: When removing the hooks, be careful not to bend the metal frame.
4.31 Fluorescent Lamp 4 Replacement Procedures 5. Open the panel PCB and remove the panel from the back light unit. NOTE: When removing the panel, be careful not to deform the panel PCB. Panel PCB Panel Back light unit Figure 4-51 Replacing CMO fluorescent lamp (5) 6. Detaching the spacers (5 points), remove the tapes (3 tapes), lens (M), lens (T), diffuser sheet, light guide sheet, reflection sheet and mold frame. NOTE: When removing the sheets, be careful not to damage them.
4 Replacement Procedures 4.31 Fluorescent Lamp 7. Remove the screws (2 screws) and detach the lamp assembly from the mold frame. Screw Mold frame Lamp assembly Figure 4-53 Replacing CMO fluorescent lamp (7) Assembling the fluorescent lamp For the assembling fluorescent lamp, refer to the reverse procedure of 14.1-inch CMO fluorescent lamp.
4.
Appendices
Appendices App-ii Satellite R10 Maintenance Manual (960-509)
Appendices Appendix Contents Appendix A Handling the LCD Module..........................................................................A-1 Appendix B Board Layout................................................................................................B-1 B.1 System Board Front View..............................................................................B-1 B.2 System Board Back View ..............................................................................B-3 B.
Appendices C.17 CN8760 RTC battery connector (3-pin) .................................................... C-15 C.18 CN8770 FAN connector (3-pin) ................................................................ C-15 C.19 CN6150 Speaker connector (4-pin) ........................................................... C-16 C.20 J6070 External microphone connector (6-pin) .......................................... C-16 C.21 CN6060 Internal microphone (left) connector (2-pin)...............................
Appendices Appendix D Keyboard Scan/Character Codes.............................................................. D-1 Appendix E Key Layout ....................................................................................................E-1 Appendix F Wiring Diagrames........................................................................................ F-1 Appendix G BIOS Rewrite Procedures ..........................................................................
Appendices Figures Figure B-1 System board layout (front) ...........................................................................B-1 Figure B-2 System board layout (back) ...........................................................................B-3 Figure B-3 CN board layout .............................................................................................B-5 Figure B-4 QI board layout ..............................................................................................
Appendices Tables Table B-1 System board (front) .....................................................................................B-2 Table B-2 System board (back)......................................................................................B-4 Table B-3 CN board........................................................................................................B-5 Table B-4 QI board ......................................................................................................
Appendices Table C-23 J6310 Headphone connector (6-pin) ........................................................... C-17 Table C-24 IS2130 SD card I/F connector (12-pin) ..................................................... C-17 Table C-25 CN3000 MDC I/F connector (30-pin) ....................................................... C-18 Table C-26 CN3001 RJ11 connector (2-pin) ................................................................ C-18 Table C-27 CN2300 Docking I/F connector (240-pin).......
Appendices Table D-3 Scan codes in Numlock mode ....................................................................... D-6 Table D-4 Scan codes with Fn key................................................................................. D-6 Table D-5 Scan codes in overlay mode.......................................................................... D-7 Table D-6 No. 124 Key scan code ................................................................................. D-7 Table D-7 No.
Appendices App-x Satellite R10 Maintenance Manual (960-509)
Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4. If water or other liquid is left on the panel’s surface for a long period, it can change the screen’s tint or stain it.
Appendix A Handling the LCD Module 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Appendix A Handling the LCD Module 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Appendix A Handling the LCD Module A-6 Satellite R10 Maintenance Manual (960-509)
Appendix B Appendix B Board Layout B.
B.
Appendix B Board Layout B.2 B.
B.
Appendix B Board Layout B.3 B.
B.4 QI Board Front and Back View B.
Appendix B Board Layout B.5 B.
B.6 HD Board B.
Appendix. C Pin Assignment Appendix C Pin Assignment System Board C.1 CN1420 Memory 1 connector (200-pin) Table C-1 Memory 1 connector (200-pin) (1/3) Pin No. Signal Name I/O Pin No.
C.1 CN1420 Memory 1 connector (200-pin) Appendix. C Pin Assignment Table C-1 Memory 1 connector (200-pin)(2/3) Pin No. C-2 Signal Name I/O Pin No.
Appendix. C Pin Assignment C.1 CN1420 Memory 1 connector (200-pin) Table C-1 Memory 1 connector (200-pin) (3/3) Pin No. Signal Name I/O Pin No.
C.2 CN1440 Memory 2 connector (200-pin) Appendix. C Pin Assignment C.2 CN1440 Memory 2 connector (200-pin) Table C-2 Memory 2 connector (200-pin)(1/3) Pin No. C-4 Signal Name I/O Pin No.
Appendix. C Pin Assignment C.2 CN1440 Memory 2 connector (200-pin) Table C-2 Memory 2 connector (200-pin)(2/3) Pin No. Signal Name I/O Pin No. Signal Name I 70 2R5-B2V I/O 69 2R5-B2V 71 SCB5B-B2P I/O 72 SCB0B-B2P I/O 73 SCB4B-B2P I/O 74 SCB1B-B2P I/O 75 GND - 76 GND - 77 SDQS8B-B2P I/O 78 GND - 79 SCB2B-B2P I/O 80 SCB3B-B2P 81 2R5-B2V I 82 2R5-B2V 83 SCB6B-B2P I/O 84 SCB7B-B2P 85 N.C. - 86 N.C.
C.2 CN1440 Memory 2 connector (200-pin) Appendix. C Pin Assignment Table C-2 Memory 2 connector (200-pin )(3/3) Pin No. C-6 Signal Name I/O Pin No.
Appendix. C Pin Assignment C.3 CN5501 LCD connector (20-pin) C.3 CN5501 LCD connector (20-pin) Table C-3 LCD connector (20-pin) Pin No. Signal Name I/O Pin No.
C.6 CN4612 USB 3 connector (Port5) (6-pin) Appendix. C Pin Assignment C.6 CN4612 USB 3 connector (Port5) (6-pin) Table C-6 USB 3 connector (Port5) (6-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 GND - 2 GND - 3 USBP5-S3N I 4 USBP5-S3P I 5 GND - 6 GND - C.7 CN3400 Debug port connector (4-pin) Table C-7 Debug port connector (4-pin) Pin No. C-8 Signal Name I/O Pin No.
Appendix. C Pin Assignment C.8 CN1800 HDD I/F connector (50-pin) C.8 CN1800 HDD I/F connector (50-pin) Table C-8 HDD I/F connector (50-pin) Pin No. Signal Name I/O Pin No.
C.9 IS2110 PC card I/F connector (70-pin) Appendix. C Pin Assignment C.9 IS2110 PC card I/F connector (70-pin) Table C-9 PC card I/F connector (70-pin) (1/2) Pin No. C-10 Signal Name I/O Pin No.
Appendix. C Pin Assignment C.10 CN3200 Keyboard connector (34-pin) Table C-10 PC card I/F connector (70-pin) (2/2) Pin No. Signal Name I/O Pin No. Signal Name I/O 61 ACCBE3-EYN I/O 62 ACAUDI-EYP O 63 ACSTSC-EYP O 64 ACAD28-EYP I/O 65 ACAD30-EYP I/O 66 ACAD31-EYP I/O 67 ACCD2-E3N O 68 GND - 69 GND - 70 GND - C.10 CN3200 Keyboard connector (34-pin) Table C-11 Keyboard connector (34-pin) Pin No. Signal Name I/O Pin No.
C.11 CN3201 PAD connector (8-pin) Appendix. C Pin Assignment C.11 CN3201 PAD connector (8-pin) Table C-12 Pin No. Signal Name PAD connector (8-pin) I/O Pin No. Signal Name I/O 1 SP-P5V O 2 SPX-PXP O 3 SPY-PXP O 4 SP-GND O 5 GND - 6 IPDCLK-P5P I/O 7 IPDDAT-P5P I/O 8 P5V I C.12 CN3280 Panel sensor connector (3-pin) Table C-13 Pin No. Signal Name Panel sensor connector (3-pin) I/O Pin No. 2 1 GND. - 3 GND - Signal Name PNLTRN-S3N I/O O C.
Appendix. C Pin Assignment C.14 CN9991 Mini PCI I/F connector (124-pin) C.14 CN9991 Mini PCI I/F connector (124-pin) Table C-15 Pin No. Mini PCI I/F connector (124-pin) (1/2) Signal Name I/O Pin No. Signal Name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 N.C. - 10 N.C. - 11 N.C. - 12 N.C. - 13 WLON-S3N I 14 N.C. - 15 GND - 16 N.C. - 17 PIRQD-P3N I 18 P5V I 19 P3V I 20 PIRQG-P3N O 21 N.C. - 22 N.C.
C.14 CN9991 Mini PCI I/F connector (124-pin) 65 C-14 CLKRUN-P3N I/O 66 Appendix.
Appendix. C Pin Assignment C.14 CN9991 Mini PCI I/F connector (124-pin) Table C-14 Mini PCI I/F connector (124-pin)(2/2) Pin No. Signal Name I/O Pin No.
C.15 CN8800 DC-IN connector (4-pin) Appendix. C Pin Assignment C.15 CN8800 DC-IN connector (4-pin) Table C-16 Pin No. Signal Name DC-IN connector (4-pin) I/O Pin No. Signal Name I/O 1 PVL O 2 PVL O 3 GND - 4 GND - C.16 CN8810 1st battery connector (10-pin) Table C-17 Pin No. Signal Name 1st battery connector (10-pin) I/O Pin No. Signal Name I/O 1 PVBH1 I 2 BTMP1 I 3 PVBL1 I 4 M5V I 5 PSCL-S5P I 6 PSDA-S5P I 7 GND - 8 DBT10V-S5N I 9 GND - 10 GND - C.
Appendix. C Pin Assignment C.19 CN6150 Speaker connector (4-pin) C.19 CN6150 Speaker connector (4-pin) Table C-20 Pin No. Signal Name Speaker connector (4-pin) I/O Pin No. Signal Name I/O 1 SP OUT (L-) I 2 SP OUT (L+) I 3 SP OUT (R-) I 5 SP OUT (R+) I C.20 J6070 External microphone connector (6-pin) Table C-21 Pin No. External microphone connector (6-pin) Signal Name I/O Pin No.
C.23 J6310 Headphone connector (6-pin) Appendix. C Pin Assignment C.23 J6310 Headphone connector (6-pin) Table C-24 Pin No. Signal Name Headphone connector (6-pin) I/O Pin No. Signal Name I/O 1 A-GND - 4 A-GND - 2 HEADL-PXP I 5 A4R7-P4V I 3 HEADR-PXP I 6 N.C. - C.24 IS2130 SD card I/F connector (12-pin) Table C-25 Pin No. C-18 Signal Name SD card I/F connector (12-pin) I/O Pin No.
Appendix. C Pin Assignment C.25 CN3000 MDC I/F connector (30-pin) C.25 CN3000 MDC I/F connector (30-pin) Table C-26 Pin No. Signal Name MDC I/F connector (30-pin) I/O Pin No. Signal Name I/O 1 N.C. - 2 GND - 3 GND - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 GND - 9 N.C. - 10 N.C - 11 N.C. - 12 N.C - 13 N.C. - 14 N.C - 15 GND - 16 E3V I 17 E3V I 18 N.C - 19 GND - 20 GND - 21 N.C. - 22 M97SY2-P3P I 23 M97OT2-P3P I 24 N.
C.27 CN2300 Docking I/F connector (240-pin) Appendix. C Pin Assignment C.27 CN2300 Docking I/F connector (240-pin) Table C-28 Pin No. C-20 Signal Name Docking I/F connector (240-pin) (1/4) I/O Pin No. Signal Name I/O A1 DSKDC I A2 GND - A3 DSKDC I A4 GND - 1 DCOUT I 2 DCOUT I 3 DOCDT1-S3N O 4 P5V I 5 N.C. - 6 N.C.
Appendix. C Pin Assignment Table C-27 Pin No. C.27 CN2300 Docking I/F connector (240-pin) Docking I/F connector (240-pin) (2/4) Signal Name I/O Pin No.
C.27 CN2300 Docking I/F connector (240-pin) Table C-27 Pin No. C-22 Signal Name Appendix. C Pin Assignment Docking I/F connector (240-pin) (3/4) I/O Pin No.
Appendix. C Pin Assignment Table C-27 Pin No. C.27 CN2300 Docking I/F connector (240-pin) Docking I/F connector (240-pin) (4/4) Signal Name I/O Pin No.
C.28 CN9540 Digitizer switch I/F connector (40-pin) Appendix. C Pin Assignment C.28 CN9540 Digitizer switch I/F connector (40-pin) Table C-29 Pin No. C-24 Signal Name Digitizer switch I/F connector (40-pin) I/O Pin No.
Appendix. C Pin Assignment C.29 CN1801 Selectable bay I/F connector (72-pin) C.29 CN1801 Selectable bay I/F connector (72-pin) Table C-30 Pin No. Selectable bay I/F connector (72-pin) (1/2) Signal Name I/O Pin No. Signal Name I/O 1 GND - 37 GND - 2 GND - 38 SIORDY-P3P O 3 N.C. - 39 (CSEL) - 4 N.C. - 40 SDDACK I 5 GND - 41 GND - 6 N.C. - 42 IRQ15 O 7 IDRSTB-P5N I 43 N.C.
C.30 CN4200 IEEE1394 connector (4-pin) Table C-31 Pin No. Appendix. C Pin Assignment Selectable bay I/F connector (72-pin) (2/2) Signal Name I/O Pin No. Signal Name I/O 33 GND - 69 GND - 34 SDIOW-P3N I 70 GND - 35 GND - 71 36 SDIOR-P3N I 72 N.C. - C.30 CN4200 IEEE1394 connector (4-pin) Table C-32 Pin No. C-26 Signal Name EEE1394 connector (4-pin) I/O Pin No.
Appendix. C Pin Assignment C.31 CN9502 CN board I/F connector (40-pin) C.31 CN9502 CN board I/F connector (40-pin) Table C-33 Pin No. CN board I/F connector (40-pin) Signal Name I/O Pin No. Signal Name I/O 1 GND - 21 GPBTNA-S3N I 2 GND - 22 GND - 3 GND - 23 GND - 4 GND - 24 GND - 5 MRED-PXP I 25 GND - 6 LUMINA-PYP I 26 GND - 7 VGAGND - 27 PNLOFF-S3N I 8 TV-GND - 28 GND - 9 MGREEN-PXP I 29 USB1PS-E5V I 10 CHROMA-PYP I 30 N.C.
C.32 CN4621 USB I/F connector 1 (6-pin) Appendix. C Pin Assignment CN board C.32 CN4621 USB I/F connector 1 (6-pin) Table C-34 Pin No. Signal Name 1 GND 3 (CN4620-2) 5 GND USB I/F connector 1 (6-pin) I/O Pin No. Signal Name - 2 GND I/O 4 (CN4620-3) - 6 GND I/O I/O - C.33 CN4620 USB I/F connector 2 (4-pin) Table C-35 Pin No. Signal Name 1 USB1PS-E5V 3 (CN4621-4) USB I/F connector 2 (4-pin) I/O Pin No. Signal Name I 2 (CN4621-3) I/O 4 GND I/O I/O - C.
Appendix. C Pin Assignment C.35 CN5340 S-VIDEO I/F connector (4-pin) C.35 CN5340 S-VIDEO I/F connector (4-pin) Table C-37 Pin No. S-VIDEO I/F connector (4-pin) Signal Name I/O Pin No. Signal Name I/O 1 GND - 2 GND - 3 LUMINA-PYP I 4 CHROMA-PYP I C.36 CN9520 System board I/F connector (40-pin) Table C-38 Pin No. System board I/F connector (40-pin) Signal Name I/O Pin No.
C.37 CN9521 QI board I/F connector (2-pin) Appendix. C Pin Assignment C.37 CN9521 QI board I/F connector (2-pin) Table C-39 Pin No. 1 C-30 Signal Name GPBTNA-S3N QI board I/F connector (2-pin) I/O Pin No.
Appendix. C Pin Assignment C.38 CN9530 CN board I/F connector (2-pin) QI board C.38 CN9530 CN board I/F connector (2-pin) Table C-40 Pin No. 1 CN board I/F connector (2-pin) Signal Name GPBTNA-S3N I/O Pin No. I 2 Signal Name GND I/O - SW board C.39 CN9510 System board I/F connector (12-pin) Table C-41 Pin No. System board I/F connector (12-pin) Signal Name I/O Pin No.
C.40 CN9600 System board I/F connector (50-pin) Appendix. C Pin Assignment HD board C.40 CN9600 System board I/F connector (50-pin) Table C-42 Pin No. C-32 Signal Name System board I/F connector (50-pin) I/O Pin No.
Appendix. C Pin Assignment C.41 CN9610 HDD I/F connector (44-pin) C.41 CN9610 HDD I/F connector (44-pin) Table C-43 Pin No. Signal Name HDD I/F connector (44-pin) I/O Pin No.
Appendix D Keyboard Scan/Character Codes Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap Code set 1 Code set 2 Note No.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) Cap D-2 Code set 1 Code set 2 Note No.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (3/4) Cap Code set 1 Code set 2 Note No.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap Code set 1 Code set 2 Note No. Keytop 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Break Make Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
Appendix D Keyboard Scan/Character Codes Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Table D-5 Scan codes in overlay mode Cap No.
Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* 46 E0 C6 E0 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix.
Appendix.
Appendix F Appendix F Wiring Diagrams F.1 LAN Loopback Connector Figure F-1 LAN loopback Connector F.
F.3 RS-232C Cable (9-pin to 25-pin) Appendix F Wiring Diagrams F.
Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: ? BIOS rewriting disk for the computer that has renewed BIOS data. Rewriting the BIOS Note: 1. Connect the AC adaptor to the computer when you rewrite the BIOS. 2. Do not turn off the power while you are rewriting the BIOS. If the rewrite fails, it might be impossible to start up the computer. 3.
Appendix G BIOS Rewrite Procedures G-2 Satellite R10 Maintenance Manual (960-509)
Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: ? EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1. Rewrite the EC/KBS only when instructed by a diagnostic disk release notice. 2. Be sure to connect both battery and AC adapter to the computer when you rewrite the EC/KBC. 3.
Appendix H EC/KBC Rewrite Procedures H-2 Satellite R10 Maintenance Manual (960-509)
Appendix I Appendix I Reliability The following table shows MTBF (Mean Time between Failures).
Appendix I Reliability I-2 Satellite R10 Maintenance Manual (960-509)
