User Guide
Table Of Contents
- Key safety instructions
- Introduction
- Projector Positioning
- Connection
- Operation
- Activate the projector
- Using the menus
- Use basic settings
- Use Network setting
- Use Advanced settings
- Use Information
- Use Firmware upgrade
- Use Image settings
- Use Advanced settings (in signal source mode)
- Switching input signal
- Changing HDMI input settings
- Adjusting the projected image
- Perform keystone correction
- Using the CEC function
- Smart energy-saving
- Light Source Mode
- Operations at high altitudes
- Hiding the image
- Optimize images in user mode
- Fine-tuning of image quality in user modes
- Adjust Gamma
- Color Management
- Fine-tuning of image in user modes
- Select the aspect ratio
- About the aspect ratio
- Control the projector with the web browser
- About Crestron e-Control®
- Using the projector under standby mode
- Switch off the projector
- Menu operations
- Maintenance
- Troubleshooting
- Specifications
- Copyright information
- Appendix
iii
Declaration of RoHS2 Compliance
This product has been designed and manufactured in compliance with Directive
2011/65/EU of the European Parliament and the Council on restriction of the use of
certain hazardous substances in electrical and electronic equipment (RoHS2 Directive)
and is deemed to comply with the maximum concentration values issued by the
European Technical Adaptation Committee (TAC) as shown below:
Substance Proposed Maximum
Concentration
Actual Concentration
Lead (Pb) 0.1% < 0.1%
Mercury (Hg) 0.1% < 0.1%
Cadmium (Cd) 0.01% < 0.01%
Hexavalent Chromium (Cr
6+
) 0.1% < 0.1%
Polybrominated biphenyls (PBB) 0.1% < 0.1%
Polybrominated diphenyl ethers (PBDE) 0.1% < 0.1%
Bis (2-ethylhexyl) phthalate (DEHP) 0.1% < 0.1%
Butyl benzyl phthalate (BBP) 0.1% < 0.1%
Dibutyl phthalate (DBP) 0.1% < 0.1%
Diisobutyl phthalate (DIBP) 0.1% < 0.1%
Certain components of products as stated above are exempted under the Annex III of
the RoHS2 Directives as noted below:
Examples of exempted components are:
1. Lead in glass of cathode ray tubes.
2. Lead in glass of uorescent tubes not exceeding 0.2% by weight.
3. Lead as an alloying element in aluminium containing up to 0.4% lead by weight.
4. Copper alloy containing up to 4% lead by weight.
5. Lead in high melting temperature type solders (i.e. lead-based alloys containing
85% by weight or more lead).
6. Electrical and electronic components containing lead in a glass or ceramic other
than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or
ceramic matrix compound.