Datasheet

CMB 0207
www.vishay.com
Vishay Beyschlag
Revision: 11-Feb-16
8
Document Number: 28755
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Note
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
4.40 -
Electrostatic discharge
(human body model)
IEC 61340-3-1
(1)
;
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
method 3015)
CMB 0207: 16 kV
± (0.5 % R + 0.05 )
4.17 58 (Td) Solderability
Solder bath method;
SnPb40;
non-activated flux;
(215
±3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or
SnAg3.5; non-activated flux;
(235
± 3) °C; (2 ±0.2) s
Good tinning ( 95 % covered);
no visible damage
4.18 58 (Td) Resistance to soldering heat
Solder bath method;
(260 ± 5)
C; (10 ± 1) s
± (0.5 % R + 0.1 )
Reflow method 2
(IR / forced gas convection);
(260 ± 5) °C; (10 ± 1) s
± (0.25 % R + 0.1 )
4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage
4.30 45 (XA) Solvent resistance of marking
Isopropyl alcohol; 50 C; method 1,
toothbrush
Marking legible;
no visible damage
4.32 21 (Ue
3
) Shear (adhesion) 45 N No visible damage
4.33 21 (Ue
1
) Substrate bending Depth 2 mm, 3 times
No visible damage;
no open circuit in bent position
± (0.5 % R + 0.1)
4.7 - Voltage proof U
RMS
= U
ins
; 60 s No flashover or breakdown
4.35 - Flammability
IEC 60695-11-5
(1)
,
needle flame test;
10
s
No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
CMB 0207 2.2  to 1.5 M