Datasheet

GSC
www.vishay.com
Vishay
Revision: 15-Oct-14
5
Document Number: 28005
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SOLDERING
Recommended soldering pad dimensions
STANDARD SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS
Maximum temperature load during reflow soldering
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters
CASE SIZE
(Ø)
LAND SIZE
abc
3 0.8 2.2 1.6
4 1.0 2.6 1.6
5 1.4 3.0 1.6
6.3 1.9 3.5 1.6
8 x 6.5 2.1 4.0 1.6
8 3.0 3.5 2.5
10 4.0 4.0 2.5
12.5 4.0 6.0 3.2
16 6.0 7.0 3.2
18 6.0 8.0 3.2
REFLOW SOLDERING CONDITIONS
Rated voltage (V) 4 to 50 4 to 50 63 and up 4 and up
Case size (Ø) 4 to 6.3 x 4.5 long 3 to 6.3 3 to 6.3 8 to 18
Preheat
Temperature (T
1
to T
2
, °C) 150 to 180
Time (t
1
) (max., s) 1210 100
Duration
Temperature (T
3
, °C) 230 217 230 217 217
Time (t
2
) (max., s) 30 90 60 60 40
Peak
Temperature (T
4
, °C) 250 260 250 240
Time (t
3
, s) 5
Reflow cycles 1 2 or less
: pad
a b
c
t
1
time (s)
T (°C)
t
2
t
3
T
1
T
2
T
3
T
4