Owner manual
www.vishay.com For technical questions, contact: diodes-tech@vishay.com
Document Number: 93085
2 Revision: 30-Jul-08
HFA25TB60
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery Diode, 25 A
ELECTRICAL SPECIFICATIONS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode
breakdown voltage
V
BR
I
R
= 100 µA 600 - -
V
Maximum forward voltage V
FM
I
F
= 25 A
See fig. 1
-1.31.7
I
F
= 50 A - 1.5 2.0
I
F
= 25 A, T
J
= 125 °C - 1.3 1.7
Maximum reverse
leakage current
I
RM
V
R
= V
R
rated
See fig. 2
-1.520
µA
T
J
= 125 °C, V
R
= 0.8 x V
R
rated - 600 2000
Junction capacitance C
T
V
R
= 200 V See fig. 3 - 55 100 pF
Series inductance L
S
Measured lead to lead 5 mm from package body - 8.0 - nH
DYNAMIC RECOVERY CHARACTERISTICS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Reverse recovery time
See fig. 5, 6 and 16
t
rr
I
F
= 1.0 A, dI
F
/dt = 200 A/µs, V
R
= 30 V - 23 -
nst
rr1
T
J
= 25 °C
I
F
= 25 A
dI
F
/dt = 200 A/µs
V
R
= 200 V
-5075
t
rr2
T
J
= 125 °C - 105 160
Peak recovery current
See fig. 7 and 8
I
RRM1
T
J
= 25 °C - 4.5 10
A
I
RRM2
T
J
= 125 °C - 8.0 15
Reverse recovery charge
See fig. 9 and 10
Q
rr1
T
J
= 25 °C - 112 375
nC
Q
rr2
T
J
= 125 °C - 420 1200
Peak rate of fall of recovery
current during t
b
See fig. 11 and 12
dI
(rec)M
/dt1 T
J
= 25 °C - 250 -
A/µs
dI
(rec)M
/dt2 T
J
= 125 °C - 160 -
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Lead temperature T
lead
0.063” from case (1.6 mm) for 10 s - - 300 °C
Thermal resistance,
junction to case
R
thJC
--1.0
K/W
Thermal resistance,
junction to ambient
R
thJA
Typical socket mount - - 80
Thermal resistance,
case to heatsink
R
thCS
Mounting surface, flat, smooth and greased - 0.5 -
Weight
-2.0- g
-0.07- oz.
Mounting torque
6.0
(5.0)
-
12
(10)
kgf · cm
(lbf · in)
Marking device Case style TO-220AC HFA25TB60