Datasheet

Package Information
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Vishay Siliconix
Revison: 19-Jan-15
1
Document Number: 66542
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TO-220-1
Notes
• M* = 0.052 inches to 0.064 inches (dimension including
protrusion), heatsink hole for HVM
• Outline conforms to JEDEC
®
outline TO-220AB with exception
of dimension F
M
*
3
2
1
L
L(1)
D
H(1)
Q
Ø P
A
F
J(1)
b(1)
e(1)
e
E
b
C
MILLIMETERS INCHES
DIM. MIN. MAX. MIN. MAX.
A 4.14 4.70 0.163 0.185
b 0.69 1.02 0.027 0.040
b(1) 1.14 1.73 0.045 0.068
c 0.36 0.61 0.014 0.024
D 14.33 15.85 0.564 0.624
E 9.96 10.52 0.392 0.414
e 2.41 2.67 0.095 0.105
e(1) 4.88 5.28 0.192 0.208
F 0.43 1.40 0.017 0.055
H(1) 6.10 6.48 0.240 0.255
J(1) 2.41 2.92 0.095 0.115
L 13.36 14.40 0.526 0.567
L(1) 3.33 4.04 0.131 0.159
Ø P 3.53 3.94 0.139 0.155
Q 2.59 3.00 0.102 0.118
ECN: X15-0003-Rev. A, 19-Jan-15
DWG: 6031