Datasheet

NTCC200E4, NTCC300E4
www.vishay.com
Vishay BCcomponents
Revision: 20-Jul-2018
1
Document Number: 29153
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Leadless NTC Thermistor Die Suitable for Wire Bonding
FEATURES
• Flat chip contacted top and bottom
(gold: NTCC300E4 series or silver: NTCC200E4
series)
• Green thermistor - does not use RoHS
exemptions
• Wide temperature range from -55 °C to +175 °C
• Highly resistant to thermal shocks
• Ideal for wire bonding (aluminum or gold
depending on metalization type)
• Resistance to leaching
• Delivered on blister tape
• AEC-Q200 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• High temperature sensing, control and compensation.
E.g. IGBT modules (inverters in EV and HEV vehicles)
• IC and semiconductor protecting
• DC/AC power inverters and HIC overheat protecting
DESIGN-IN SUPPORT
For complete curve computation, please visit:
www.vishay.com/thermistors/ntc-curve-list/
MARKING
The thermistors have no marking and have electrode
termination design without orientation.
MOUNTING
The thermistors are primarily intended for wire bonding. The
parameters of the assembly process should be chosen in
accordance with the lead-wire material.
The mounting process should be in compliance with the
following guidelines and recommendations:
Die bonding:
• Gold electrode: silver epoxy gluing.
• Silver electrode: (vacuum) reflow soldering - silver epoxy
gluing - nano silver sintering.
Cleaning:
• Detergent spraying.
• Ultrasonic or formic acid vapor cleaning is not
recommended.
Wire bonding:
• The gold electrode has been tested for gold wire bonding
with a wire diameter of max. 32 μm.
• The silver electrode has been tested for aluminum wire
bonding with a wire diameter of max. 300 μm.
Encapsulation:
• In order to preserve the characteristics of the bonded die
at long term an encapsulation is mandatory
.
• The encapsulation is defined by the user. Silicon and
epoxy encapsulations have been tested. For
recommendations on compatible encapsulants contact
Vishay.
Note
(1)
In order to define R
25
-tolerance, replace * in SAP part number by F (± 1 %), G (± 2 %), H (± 3 %), or J (± 5 %)
QUICK REFERENCE DATA
PARAMETER VALUE UNIT
Resistance value at 25 °C 4.7K to 20K 
Tolerance on R
25
-value ± 1; ± 2; ± 3; ± 5 %
B
25/85
-value 3435 to 3865 K
Tolerance on B
25/85
-value ± 1 %
Operating temperature range -55 to +175 °C
Response time (63.2 %)
25 °C to 85 °C still air (for info)
3s
Dissipation factor  in still air
(for info, non-mounted die)
3mW
Maximum power dissipation 50 mW
Weight 3 mg
ELECTRICAL DATA AND ORDERING INFORMATION
R
25
()
R
25
-TOL.
(± %)
B
25/85
(K)
B
25/85
-TOL.
(± %)
DESCRIPTION
SAP MATERIAL AND
ORDERING NUMBER
(1)
4700 1, 2, 3, 5 3435 1 Bare die with top / bottom silver terminations NTCC200E4472*T
12 000 1, 2, 3, 5 3740 1 Bare die with top / bottom silver terminations NTCC200E4123*T
20 000 1, 2, 3, 5 3865 1 Bare die with top / bottom silver terminations NTCC200E4203*T
4700 1, 2, 3, 5 3435 1 Bare die with top / bottom gold terminations NTCC300E4472*T
12 000 1, 2, 3, 5 3740 1 Bare die with top / bottom gold terminations NTCC300E4123*T
20 000 1, 2, 3, 5 3865 1 Bare die with top / bottom gold terminations NTCC300E4203*T