Datasheet

SiSF02DN
www.vishay.com
Vishay Siliconix
S19-0104-Rev. A, 04-Feb-2019
1
Document Number: 76933
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Common Drain Dual N-Channel 25 V (S1-S2) MOSFET
FEATURES
TrenchFET
®
Gen IV power MOSFET
Very low source-to-source on resistance
Integrated common-drain n-channel MOSFETs
in a compact and thermally enhanced package
100 % R
g
and UIS tested
Optimizes circuit layout for bi-directional current flow
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
Battery protection switch
Bi-directional switch
•Load switch
Notes
a. T
C
= 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257
). The PowerPAK 1212-8SCD is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 63 °C/W
g. Single MOSFET
h. Package limited
PRODUCT SUMMARY
V
S1S2
(V) 25
R
S1S2(on)
max. () at V
GS
= 10 V 0.0035
R
S1S2(on)
max. () at V
GS
= 4.5 V 0.0056
Q
g
typ. (nC) 16.9
g
I
S1S2
(A) 60
a, h
Configuration Common drain
PowerPAK
®
1212-8SCD
1
G
1
2
D
1
3
D
2
4
G
2
S
1
8
S
1
7
S
2
6
S
2
5
S
1
S
2
Top View Bottom View
3.3 mm
1
3.3 mm
N-Channel 1 MOSFET
N-Channel 2 MOSFET
G
2
S
2
G
1
S
1
ORDERING INFORMATION
Package PowerPAK 1212-8SCD
Lead (Pb)-free and halogen-free SiSF02DN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage V
S1S2
25
V
Gate-source voltage V
GS
+16 / -12
Continuous drain current (T
J
= 150 °C)
T
C
= 25 °C
I
S1S2
60
h
A
T
C
= 70 °C 60
h
T
A
= 25 °C 30.5
b, c
T
A
= 70 °C 24
b, c
Pulsed drain current (t = 100 μs) I
S1S2M
140
Maximum power dissipation
T
C
= 25 °C
P
D
69.4
W
T
C
= 70 °C 44.4
T
A
= 25 °C 5.2
b, c
T
A
= 70 °C 3.3
b, c
Operating junction and storage temperature range T
J
, T
stg
-55 to +150
°C
Soldering recommendations (peak temperature)
c
260
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYPICAL MAXIMUM UNIT
Maximum junction-to-ambient
b
t 10 s R
thJA
19 24
°C/W
Maximum junction-to-case (drain) Steady state R
thJC
1.4 1.8

Summary of content (8 pages)