Datasheet

VLMW51Q2R3
www.vishay.com
Vishay Semiconductors
Rev. 1.0, 16-May-13
6
Document Number: 84160
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RECOMMENDED PAD DESIGN DIMENSIONS in millimeters
specications
according to DIN
technical drawings
Drawing-No.: 6.541-5082.01-4
Issue: 2; 23.07.10
22065
Additional area covered by solder resist
for improved heat dissipation.
A
C
Package mark
3.5 ± 0.2
3.5 ± 0.2
0.05
3.7 ± 0.2
Ø 2.6
1.5
3.1
0.5
0.7
1.2 ± 0.2
2.6
0.5
2.8
10
9.4
1.4
3.4
4.5
Recommended solder pad