Datasheet

VOT8121AM
www.vishay.com
Vishay Semiconductors
Rev. 1.2, 30-Oct-2018
9
Document Number: 84914
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SOLDER PROFILES
IR Reflow Soldering (JEDEC
®
J-STD-020C compliant)
One time soldering reflow is recommended within the
condition of temperature and time profile shown below. Do
not solder more than three times.
Fig. 2
Wave Soldering (JEDEC JESD22-A111 compliant)
One time soldering is recommended within the condition of
temperature.
Temperature: 260 °C + 0 °C / - 5 °C
Time: 10 s
Preheat temperature: 25 °C to 140 °C
Preheat time: 30 s to 80 s
Fig. 3
Hand Soldering by Soldering Iron
Allow single lead soldering in every single process. One time
soldering is recommended.
Temperature: 380 °C + 0 °C / - 5 °C
Time: 3 s max.
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: T
amb
< 30 °C, RH < 85 %
Moisture sensitivity level 1, according to J-STD-020
PROFILE ITEM CONDITIONS
Preheat
- Temperature minimum (T
S min.
) 150 °C
- Temperature maximum (T
S max.
) 200 °C
- Time (min. to max.) (t
S
) 90 s ± 30 s
Soldering zone
- Temperature (T
L
) 217 °C
- Time (t
L
) 60 s
Peak temperature (T
p
) 260 °C
Ramp-up rate 3 °C/s max.
Ramp-down rate 3 °C/s to 6 °C/s
0 20406080
1000
10000
25
100
1000
10000
Time (s)
Axis Title
1st line
2nd line
2nd line
Temperarure (°C)
Time (s)
10
100
60 s
t
L
(soldering)
60 s to 120 s
t
S
(preheat)
35 s to 70 s
20 s
T
p
(260 °C)
T
L
(217 °C)
T
S max.
(200 °C)
T
S min.
(150 °C)
Ramp-up
Ramp-down
23016
10
100
1000
10000
0
200
250
300
0 0.5 2.5 3.0 3.5 4.0
Axis Title
2nd line
Time (min)
150
100
50
2.01.0 1.5
Temperature (°C)
260 °C + 0 °C / - 5 °C
wave temperature
Second wave
-5 °C/s
+200 °C/s
+2 °C/s
First wave
Preheat zone
1st line
2nd line
23017