Datasheet

VSMF3710
www.vishay.com
Vishay Semiconductors
Rev. 2.0, 02-Nov-15
4
Document Number: 81241
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters
SOLDER PROFILE
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: T
amb
< 30 °C, RH < 60 %
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Drawing-No.: 6.541-5067.01-4
specications
according to DIN
Technical drawings
Issue: 6; 23.09.13
Dimensions in mm
C
A
Ø2.4
Pin identication
3.5 ±0.2
1.75
±0.1
0.9
2.8
±0.15
2.2
3
+0.15
0
.
8
Mounting Pad Layout
4
4
1.2
2.6 (2.8)
1.6 (1.9)
Dimensions: Reow and vapor phase (wave soldering)
Area covered
with solderresist
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
19841
255 °C