Hardware Guide
Table Of Contents
- Introduction
- 2. Overview
- 3. GE865 Mechanical Dimensions
- 4. GE865 module connections
- 5. Hardware Commands
- 6. Power Supply
- 7. Antenna
- 8. Logic level specifications
- 9. Serial Ports
- 10. Audio Section Overview
- 11. General Purpose I/O
- 11.1. GPIO Logic levels
- 11.2. Using a GPIO Pad as INPUT
- 11.3. Using a GPIO Pad as OUTPUT
- 11.4. Using the RF Transmission Control GPIO4
- 11.5. Using the RFTXMON Output GPIO5
- 11.6. Using the Alarm Output GPIO6
- 11.7. Using the Buzzer Output GPIO7
- 11.8. Indication of network service availability
- 11.9. RTC Bypass out
- 11.10. External SIM Holder Implementation
- 12. DAC and ADC section
- 13. Mounting the GE865 on your Board
- 14. Packing system
- 15. Conformity Assessment Issues
- 17. Document History
GE865 Hardware User Guide
1vv0300799 Rev.15– 2012-04-23
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 64 of 77
13.4. Debug of the GE865 in production
To test and debug the mounting of the GE865, we strongly recommend to foreseen test pads on
the host PCB, in order to check the connection between the GE865 itself and the application and
to test the performance of the module connecting it with an external computer. Depending by the
customer application, these pads include, but are not limited to the following signals:
• TXD
• RXD
• ON/OFF
• RESET
• GND
• VBATT
• TX_AUX
• RX_AUX
• PWRMON
• SERVICE
13.5. Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.