Hardware Guide
Table Of Contents
- Introduction
- 2. Overview
- 3. GE865 Mechanical Dimensions
- 4. GE865 module connections
- 5. Hardware Commands
- 6. Power Supply
- 7. Antenna
- 8. Logic level specifications
- 9. Serial Ports
- 10. Audio Section Overview
- 11. General Purpose I/O
- 11.1. GPIO Logic levels
- 11.2. Using a GPIO Pad as INPUT
- 11.3. Using a GPIO Pad as OUTPUT
- 11.4. Using the RF Transmission Control GPIO4
- 11.5. Using the RFTXMON Output GPIO5
- 11.6. Using the Alarm Output GPIO6
- 11.7. Using the Buzzer Output GPIO7
- 11.8. Indication of network service availability
- 11.9. RTC Bypass out
- 11.10. External SIM Holder Implementation
- 12. DAC and ADC section
- 13. Mounting the GE865 on your Board
- 14. Packing system
- 15. Conformity Assessment Issues
- 17. Document History
GE865 Hardware User Guide
1vv0300799 Rev.15– 2012-04-23
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 65 of 77
13.6. PCB pad design
Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.
Recommendations for PCB pad dimensions
Ball pitch [mm]
2,4
Solder resist opening diameter A [mm]
1,150
Metal pad diameter B [mm]
1 ± 0.05
It is not recommended to place via or microvia not covered by solder resist in an area of 1,6mm
diameter around the pads unless it carries the same signal of the pad itself. (see following figure).