Hardware Guide
Table Of Contents
- Introduction
- 2. Overview
- 3. GE865 Mechanical Dimensions
- 4. GE865 module connections
- 5. Hardware Commands
- 6. Power Supply
- 7. Antenna
- 8. Logic level specifications
- 9. Serial Ports
- 10. Audio Section Overview
- 11. General Purpose I/O
- 11.1. GPIO Logic levels
- 11.2. Using a GPIO Pad as INPUT
- 11.3. Using a GPIO Pad as OUTPUT
- 11.4. Using the RF Transmission Control GPIO4
- 11.5. Using the RFTXMON Output GPIO5
- 11.6. Using the Alarm Output GPIO6
- 11.7. Using the Buzzer Output GPIO7
- 11.8. Indication of network service availability
- 11.9. RTC Bypass out
- 11.10. External SIM Holder Implementation
- 12. DAC and ADC section
- 13. Mounting the GE865 on your Board
- 14. Packing system
- 15. Conformity Assessment Issues
- 17. Document History
GE865 Hardware User Guide
1vv0300799 Rev.15– 2012-04-23
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 66 of 77
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni /
Immersion Au
3 –7 /
0.05 – 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-
lead solder paste on the described surface plating is better compared to lead-free solder paste.
13.7. Solder paste
Lead free
Solder paste
Sn/Ag/Cu
It is recommended to use only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.