Hardware Guide
Table Of Contents
- Introduction
- 2. Overview
- 3. GE865 Mechanical Dimensions
- 4. GE865 module connections
- 5. Hardware Commands
- 6. Power Supply
- 7. Antenna
- 8. Logic level specifications
- 9. Serial Ports
- 10. Audio Section Overview
- 11. General Purpose I/O
- 11.1. GPIO Logic levels
- 11.2. Using a GPIO Pad as INPUT
- 11.3. Using a GPIO Pad as OUTPUT
- 11.4. Using the RF Transmission Control GPIO4
- 11.5. Using the RFTXMON Output GPIO5
- 11.6. Using the Alarm Output GPIO6
- 11.7. Using the Buzzer Output GPIO7
- 11.8. Indication of network service availability
- 11.9. RTC Bypass out
- 11.10. External SIM Holder Implementation
- 12. DAC and ADC section
- 13. Mounting the GE865 on your Board
- 14. Packing system
- 15. Conformity Assessment Issues
- 17. Document History
GE865 Hardware User Guide
1vv0300799 Rev.15– 2012-04-23
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 67 of 77
13.7.1. GE865 Solder reflow
The following is the recommended solder reflow profile
Profile Feature
Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.