User's Manual

Doc No.
Rev
1.0
Document released Date.
15/8/25
Page
6
Description
WM-BN-BM-26_A User Manual
Additional RF-specific PCB design guidelines include:
•
Keep the RF traces on the component sides (top or bottom layer) using micro-strip or
CGW techniques where possible.
•
Screen these traces to avoid electromagnetic interference.
•
Use internal layers with strip-line techniques if necessary.
•
Maintain continuous ground below micro-strip traces, beside CGW traces, and above
and below strip-line traces.
•
Keep traces short and direct, to minimize loss and undesired coupling.
•
Front-end losses increase the system noise figure — keep traces before the first gain
stage as short as possible and use low-loss capacitors and inductors.
•
Clear internal layer (or layers) of metal. This improves micro-strip, CGW, and strip-line
geometries, allowing wider traces.
•
Fill the areas along both sides of traces with ground to improve isolation, but provide
adequate clearance to minimize co-planar capacitance and leakage. These ground-filled
areas are integral to CGW designs.
•
Use several ground vias along both sides of the signal traces to connect RF ground-fill
areas to the internal RF ground plane.
•
Avoid crossing RF traces if possible.
•
Ground of RF trace it is better to use it’s own ground on top layer.
The content of this document is to be treated as strictly confidential and is not to be disclosed, reproduced or used, except as
authorized in writing by Universal Scientific Industrial Co., Ltd. Copyright © 2011 Universal Scientific Industrial Co. ,Ltd.
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