User Guide

ManualsBrandsAbility ManualsElectronicsWCDMA and LTE wireless cellular module

100

Table Of Contents

APPLICABILITY TABLE
Contents
1. Introduction
- 1.1. Scope
- 1.2. Audience
- 1.3. Contact Information, Support
- 1.4. Symbol Conventions
- 1.5. Related Documents
2. general Product Description
- 2.1. Overview
- 2.2. Applications
- 2.3. General Functionality and Main Features
- 2.4. Block Diagram
- 2.5. Environmental Requirements
  - 2.5.1. Temperature Range
  - 2.5.2. RoHS Compliance
- 2.6. Operating Frequency Bands
  - 2.6.1. RF Bands per Regional Variant
  - 2.6.2. Reference Table of RF Bands Characteristics
- 2.7. RF Parameters
  - 2.7.1. Sensitivity
  - 2.7.2. Output power
- 2.8. Mechanical Specifications
  - 2.8.1. Dimensions
  - 2.8.2. Weight
3. Module Connections
- 3.1. Pin-out
- 3.2. Signals That Must Be Connected
- 3.3. LGA Pads Layout
- 3.4. Backward Compatibility to xE910 Family
4. Electrical Specifications
- 4.1. Absolute Maximum Ratings – Not Operational
- 4.2. Recommended Operating Conditions
- 4.3. Logic Level Specifications
5. Hardware Commands
- 5.1. Turning on the LE910Cx Module
- 5.2. Initialization and Activation State
- 1.1.
- 5.3. Turning off the LE910Cx Module
- 5.4. Powering OFF the Module
- 5.5. Fast Power Down
  - 5.5.1. Fast Shut Down by Hardware
  - 5.5.2. Fast Shut Down by Software
6. Power Supply
- 6.1. Power Supply Requirements
- 6.2. Power Consumption
- 6.3. General Design Rules
1.
7. Antenna(s)
- 7.1. GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements
- 7.2. GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines
- 7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines
- 7.4. Antenna Diversity Requirements
- 7.5. GNSS Antenna Requirements
8. Hardware Interfaces
- 8.1. USB Port
- 8.2. HSIC Interface (Optional)
- 8.3. SGMII Interface
  - 8.3.1. Ethernet Control interface
- 8.4. Serial Ports
- 8.5. Peripheral Ports
- 8.6. Audio Interface
  - 8.6.1. Digital Audio
- 8.7. General Purpose I/O
9. Miscellaneous Functions
- 9.1. Indication of Network Service Availability
- 9.2. Indication of Software Ready
- 9.3. RTC – Real Time Clock
- 9.4. VAUX Power Output
- 9.5. ADC Converter
  - 9.5.1. Description
  - 9.5.2. Using the ADC Converter
- 9.6. Using the Temperature Monitor Function
- 9.7. GNSS Characteristics
1.
1.
1.
1.
1.
10. Mounting the Module on your Board
- 10.1. General
- 10.2. Finishing & Dimensions
- 1.1.
- 10.3. Recommended Footprint for the Application
- 10.4. Stencil
- 10.5. PCB Pad Design
- 10.6. Recommendations for PCB Pad Dimensions (mm)
- 10.7. Solder Paste
  - 10.7.1. Solder Reflow
  - 10.7.2. Cleaning
11. Application Guide
- 11.1. Debug of the LE910Cx Module in Production
- 11.2. Bypass Capacitor on Power Supplies
- 11.3. SIM Interface
  - 11.3.1. SIM Schematic Example
- 11.4. EMC Recommendations
- 11.5. Download and Debug Port
  - 11.5.1. Fast Boot mode
  - 11.5.2. Recovery Boot Mode
12. Packing System
- 12.1. Packing System – Tray
- 12.2. Tape & Reel
- 12.3. Moisture Sensitivity
13. Conformity Assessment Issues
- 13.1. FCC/ISED Regulatory Notices
- 13.2. JTBL Regulatory Notices
- 13.3. NCC Regulatory Notices
- 13.4. ANATEL Regulatory Notices
- 1.1. Europe Approvals
- 13.5.
1.
1.
1.
14. PRODUCT AND SAFETY INFORMATION
- 14.1. Copyrights and Other Notices
  - 14.1.1. Copyrights
  - 14.1.2. Computer Software Copyrights
- 14.2. Usage and Disclosure Restrictions
- 14.3. Safety Recommendations
15. GLOSSARY
16. Document History

LE910Cx HW User Guide

1VV0301298 Rev. 34 Page 100 of 131

Not Subject to NDA

It is not recommended to place a via or micro-via not covered by solder resist around the

pads in an area of 0.15 mm unless it carries the same signal as the pad itself. Micro vias

inside the pads are allowed.

Holes in pad are only allowed for blind holes and not for through holes.

Finish

Layer Thickness (um)

Properties

Electro-less Ni / Immersion Au 3-7 / 0.05-0.15

Good solder ability protection, high

shear force values

Table 43: Recommendations for PCB Pad Surfaces

The PCB must be able to resist the higher temperatures, which occur during the lead-

free process. This issue should be discussed with the PCB-supplier. In general, the

wettability of tin-lead solder paste on the described surface plating is better compared

to lead-free solder paste.

Solder Paste

We recommend using only “no clean” solder paste to avoid the cleaning of the modules

after assembly.

10.7.1. Solder Reflow

Figure 35 shows the recommended solder reflow profile.

Figure 35: Solder Reflow Profile