User Guide

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Table Of Contents

APPLICABILITY TABLE
Contents
1. Introduction
- 1.1. Scope
- 1.2. Audience
- 1.3. Contact Information, Support
- 1.4. Symbol Conventions
- 1.5. Related Documents
2. general Product Description
- 2.1. Overview
- 2.2. Applications
- 2.3. General Functionality and Main Features
- 2.4. Block Diagram
- 2.5. Environmental Requirements
  - 2.5.1. Temperature Range
  - 2.5.2. RoHS Compliance
- 2.6. Operating Frequency Bands
  - 2.6.1. RF Bands per Regional Variant
  - 2.6.2. Reference Table of RF Bands Characteristics
- 2.7. RF Parameters
  - 2.7.1. Sensitivity
  - 2.7.2. Output power
- 2.8. Mechanical Specifications
  - 2.8.1. Dimensions
  - 2.8.2. Weight
3. Module Connections
- 3.1. Pin-out
- 3.2. Signals That Must Be Connected
- 3.3. LGA Pads Layout
- 3.4. Backward Compatibility to xE910 Family
4. Electrical Specifications
- 4.1. Absolute Maximum Ratings – Not Operational
- 4.2. Recommended Operating Conditions
- 4.3. Logic Level Specifications
5. Hardware Commands
- 5.1. Turning on the LE910Cx Module
- 5.2. Initialization and Activation State
- 1.1.
- 5.3. Turning off the LE910Cx Module
- 5.4. Powering OFF the Module
- 5.5. Fast Power Down
  - 5.5.1. Fast Shut Down by Hardware
  - 5.5.2. Fast Shut Down by Software
6. Power Supply
- 6.1. Power Supply Requirements
- 6.2. Power Consumption
- 6.3. General Design Rules
1.
7. Antenna(s)
- 7.1. GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements
- 7.2. GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines
- 7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines
- 7.4. Antenna Diversity Requirements
- 7.5. GNSS Antenna Requirements
8. Hardware Interfaces
- 8.1. USB Port
- 8.2. HSIC Interface (Optional)
- 8.3. SGMII Interface
  - 8.3.1. Ethernet Control interface
- 8.4. Serial Ports
- 8.5. Peripheral Ports
- 8.6. Audio Interface
  - 8.6.1. Digital Audio
- 8.7. General Purpose I/O
9. Miscellaneous Functions
- 9.1. Indication of Network Service Availability
- 9.2. Indication of Software Ready
- 9.3. RTC – Real Time Clock
- 9.4. VAUX Power Output
- 9.5. ADC Converter
  - 9.5.1. Description
  - 9.5.2. Using the ADC Converter
- 9.6. Using the Temperature Monitor Function
- 9.7. GNSS Characteristics
1.
1.
1.
1.
1.
10. Mounting the Module on your Board
- 10.1. General
- 10.2. Finishing & Dimensions
- 1.1.
- 10.3. Recommended Footprint for the Application
- 10.4. Stencil
- 10.5. PCB Pad Design
- 10.6. Recommendations for PCB Pad Dimensions (mm)
- 10.7. Solder Paste
  - 10.7.1. Solder Reflow
  - 10.7.2. Cleaning
11. Application Guide
- 11.1. Debug of the LE910Cx Module in Production
- 11.2. Bypass Capacitor on Power Supplies
- 11.3. SIM Interface
  - 11.3.1. SIM Schematic Example
- 11.4. EMC Recommendations
- 11.5. Download and Debug Port
  - 11.5.1. Fast Boot mode
  - 11.5.2. Recovery Boot Mode
12. Packing System
- 12.1. Packing System – Tray
- 12.2. Tape & Reel
- 12.3. Moisture Sensitivity
13. Conformity Assessment Issues
- 13.1. FCC/ISED Regulatory Notices
- 13.2. JTBL Regulatory Notices
- 13.3. NCC Regulatory Notices
- 13.4. ANATEL Regulatory Notices
- 1.1. Europe Approvals
- 13.5.
1.
1.
1.
14. PRODUCT AND SAFETY INFORMATION
- 14.1. Copyrights and Other Notices
  - 14.1.1. Copyrights
  - 14.1.2. Computer Software Copyrights
- 14.2. Usage and Disclosure Restrictions
- 14.3. Safety Recommendations
15. GLOSSARY
16. Document History

LE910Cx HW User Guide

1VV0301298 Rev. 34 Page 103 of 131

Not Subject to NDA

11. APPLICATION GUIDE

Debug of the LE910Cx Module in Production

To test and debug the mounting of the LE910Cx module, we strongly recommend adding

several test pads on the application board design for the following purposes:

• Check the connection between the LE910Cx itself and the application

• Test the performance of the module by connecting it to an external computer

Depending on the customer’s application, these test pads include, but are not limited to

the following signals:

• TXD

• RXD

• ON/OFF

• HW_SHUTDOWN_N

• GND

• VBATT

• TX_AUX

• RX_AUX

• USB_VBUS

• USB_D+

• USB_D-

• GPIO_09

• WCI_RX

In addition, the following signals are also recommended (but not mandatory):

• PWRMON

• GPIO_01 (STAT_LED)

• GPIO_08 (SW_RDY)

Bypass Capacitor on Power Supplies

When there is a sudden voltage step to or a cut from the power supplies, the steep

transition causes some reactions such as overshoot and undershoot. This abrupt voltage

transition can affect the device causing it to fail or malfunction.