User Guide

ManualsBrandsAbility ManualsElectronicsWCDMA and LTE wireless cellular module

Table Of Contents

APPLICABILITY TABLE
Contents
1. Introduction
- 1.1. Scope
- 1.2. Audience
- 1.3. Contact Information, Support
- 1.4. Symbol Conventions
- 1.5. Related Documents
2. general Product Description
- 2.1. Overview
- 2.2. Applications
- 2.3. General Functionality and Main Features
- 2.4. Block Diagram
- 2.5. Environmental Requirements
  - 2.5.1. Temperature Range
  - 2.5.2. RoHS Compliance
- 2.6. Operating Frequency Bands
  - 2.6.1. RF Bands per Regional Variant
  - 2.6.2. Reference Table of RF Bands Characteristics
- 2.7. RF Parameters
  - 2.7.1. Sensitivity
  - 2.7.2. Output power
- 2.8. Mechanical Specifications
  - 2.8.1. Dimensions
  - 2.8.2. Weight
3. Module Connections
- 3.1. Pin-out
- 3.2. Signals That Must Be Connected
- 3.3. LGA Pads Layout
- 3.4. Backward Compatibility to xE910 Family
4. Electrical Specifications
- 4.1. Absolute Maximum Ratings – Not Operational
- 4.2. Recommended Operating Conditions
- 4.3. Logic Level Specifications
5. Hardware Commands
- 5.1. Turning on the LE910Cx Module
- 5.2. Initialization and Activation State
- 1.1.
- 5.3. Turning off the LE910Cx Module
- 5.4. Powering OFF the Module
- 5.5. Fast Power Down
  - 5.5.1. Fast Shut Down by Hardware
  - 5.5.2. Fast Shut Down by Software
6. Power Supply
- 6.1. Power Supply Requirements
- 6.2. Power Consumption
- 6.3. General Design Rules
1.
7. Antenna(s)
- 7.1. GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements
- 7.2. GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines
- 7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines
- 7.4. Antenna Diversity Requirements
- 7.5. GNSS Antenna Requirements
8. Hardware Interfaces
- 8.1. USB Port
- 8.2. HSIC Interface (Optional)
- 8.3. SGMII Interface
  - 8.3.1. Ethernet Control interface
- 8.4. Serial Ports
- 8.5. Peripheral Ports
- 8.6. Audio Interface
  - 8.6.1. Digital Audio
- 8.7. General Purpose I/O
9. Miscellaneous Functions
- 9.1. Indication of Network Service Availability
- 9.2. Indication of Software Ready
- 9.3. RTC – Real Time Clock
- 9.4. VAUX Power Output
- 9.5. ADC Converter
  - 9.5.1. Description
  - 9.5.2. Using the ADC Converter
- 9.6. Using the Temperature Monitor Function
- 9.7. GNSS Characteristics
1.
1.
1.
1.
1.
10. Mounting the Module on your Board
- 10.1. General
- 10.2. Finishing & Dimensions
- 1.1.
- 10.3. Recommended Footprint for the Application
- 10.4. Stencil
- 10.5. PCB Pad Design
- 10.6. Recommendations for PCB Pad Dimensions (mm)
- 10.7. Solder Paste
  - 10.7.1. Solder Reflow
  - 10.7.2. Cleaning
11. Application Guide
- 11.1. Debug of the LE910Cx Module in Production
- 11.2. Bypass Capacitor on Power Supplies
- 11.3. SIM Interface
  - 11.3.1. SIM Schematic Example
- 11.4. EMC Recommendations
- 11.5. Download and Debug Port
  - 11.5.1. Fast Boot mode
  - 11.5.2. Recovery Boot Mode
12. Packing System
- 12.1. Packing System – Tray
- 12.2. Tape & Reel
- 12.3. Moisture Sensitivity
13. Conformity Assessment Issues
- 13.1. FCC/ISED Regulatory Notices
- 13.2. JTBL Regulatory Notices
- 13.3. NCC Regulatory Notices
- 13.4. ANATEL Regulatory Notices
- 1.1. Europe Approvals
- 13.5.
1.
1.
1.
14. PRODUCT AND SAFETY INFORMATION
- 14.1. Copyrights and Other Notices
  - 14.1.1. Copyrights
  - 14.1.2. Computer Software Copyrights
- 14.2. Usage and Disclosure Restrictions
- 14.3. Safety Recommendations
15. GLOSSARY
16. Document History

LE910Cx HW User Guide

1VV0301298 Rev. 34 Page 39 of 131

Not Subject to NDA

Pad

Parameter

Min

Max

Unit

Comment

V

OH

Output high

level

2.25V 3.1V [V]

V

OL

Output low level

0V

0.4V

[V]

I

IL

Low-level input

leakage current

-10 [uA] No pull-up

I

IH

High-level input

leakage current

10 [uA] No pull-down

R

PU

Pull-up

resistance

10

100

[kΩ]

R

PD

Pull-down

resistance

10 100 [k

Ω

]

C

i

Input

capacitance

5 [pF]

Table 17: Operating Range – For SIM Pads Operating at 2.95V